摘要:
Deep-drawn membranes formed of polyester or polycarbonate films, comprising units of Formula (I) and (II), useful for acoustic signal converters as microphones and speakers. The film can be produced by thermoplastic processes or solvent cast processes. Especially suitable for the production of small membranes with a diameter of up to 10 cm useful in mobile devices as microphones, mobile telephones, laptops, personal digital assistants (PDAs), headphones or as signal transmitters
摘要:
Adhesive assembly tape for interior finishing, comprising a carrier and an adhesive coated from the melt to at least one side of said carrier,characterized in that the adhesive comprises an ethylene-propylene rubber having a density of between 0.86 and 0.89 g/cm3 and a tackifier resin.
摘要翻译:用于内部精加工的粘合剂装配带,包括载体和从熔体涂覆到所述载体的至少一侧的粘合剂,其特征在于,所述粘合剂包括密度为0.86至0.89g / cm 3的乙丙橡胶和 增粘树脂。
摘要:
Pressure-sensitive adhesive comprising a crosslinkable polyolefin and at least one tackifier resin, wherein the polyolefin is composed of at least two monomers A and B and of at least one comonomer C amenable to crosslinking, the monomers A and B being selected from the group consisting of α-olefins, vinyl acetate, n-butyl acrylate and methyl methacrylate or, in the case of EPDM, a diene such as 5-ethylidene-2-norbornene, dicyclopentadiene or 5-vinyl-2-norbornene.
摘要:
Films and membranes produced therefrom for acoustic signal converters made of polyester comprising the structural unit of formula (I) wherein R1 and R2 independently represent hydrogen, halogen, C1-C8 alkyl, C5-C6 cycloalkyl, C6-C10 aryl, C7-C12 aralkyl and R3 corresponds to a carbonyl group or to the formula (A)
摘要:
A method for encapsulating an electronic, optionally optoelectronic, arrangement against permeants, in which a pressure-sensitive adhesive composition based on a partly crystalline polyolefin is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated, wherein the polyolefin has a density between 0.86 and 0.89 g/cm and a crystallite melting point of at least 90° C.
摘要翻译:一种用于将电子的,可选地光电子的装置封装在透过物中的方法,其中将基于部分结晶聚烯烃的压敏粘合剂组合物施加到待包封的电子装置的区域上和/或周围,其中聚烯烃 具有0.86至0.89g / cm 3的密度和至少90℃的微晶熔点。