公开(公告)号：US4963375A

公开(公告)日：1990-10-16

申请号：US344726

申请日：1989-04-28

申请人： Akira Sato ,  Toshio Sato ,  Kiyoshi Yamanoi

发明人： Akira Sato ,  Toshio Sato ,  Kiyoshi Yamanoi

IPC分类号： A23G3/00 ,  A21B1/40 ,  A21D8/06 ,  A23G3/34 ,  A23L5/10 ,  A23N12/08 ,  F24C7/08 ,  G05D23/00 ,  G05D23/27

CPC分类号： G05D23/27 ,  A21B1/40 ,  F24C7/08

摘要： Method of controlling the baking for foods, wherein an amount of heat absorbed by a portion near the food to be baked in an oven is measured to control heating temperature and/or air flow rate in the oven, based on the measured amount of heat.

公开(公告)号：US4557762A

公开(公告)日：1985-12-10

申请号：US635403

申请日：1984-07-30

申请人： Akishi Nakaso ,  Toshiro Okamura ,  Kiyoshi Yamanoi ,  Sumiko Nakajima

发明人： Akishi Nakaso ,  Toshiro Okamura ,  Kiyoshi Yamanoi ,  Sumiko Nakajima

IPC分类号： C23C18/40

CPC分类号： C23C18/40 ,  C23C18/405

摘要： An electroless copper plating solution comprising cupric ions, a complexing agent, a reducing agent, a pH adjuster, a perfluoropolyether, a cyanide and/or .alpha.,.alpha.'-dipyridyl and/or 1,10-phenanthroline or a derivative thereof is capable of forming a deposited film with high elongation.

摘要翻译： 包含铜离子，络合剂，还原剂，pH调节剂，全氟聚醚，氰化物和/或α，α'-二吡啶基和/或1,10-菲咯啉或其衍生物的化学镀铜溶液能够 形成具有高伸长率的沉积膜。

公开(公告)号：US4643793A

公开(公告)日：1987-02-17

申请号：US750780

申请日：1985-07-01

申请人： Akishi Nakaso ,  Youichi Kaneko ,  Toshiro Okamura ,  Kiyoshi Yamanoi

发明人： Akishi Nakaso ,  Youichi Kaneko ,  Toshiro Okamura ,  Kiyoshi Yamanoi

IPC分类号： C23C22/06 ,  C23C18/40 ,  H05K3/38 ,  H05K3/46

CPC分类号： C23C18/40 ,  H05K3/384 ,  H05K2203/0307 ,  H05K2203/072 ,  H05K3/4611 ,  Y10S428/901

摘要： A process for treating a surface of a metal such as copper with a liquid composition comprising (I) copper ions, a complexing agent, a reducing agent, a pH adjusting agent, water, and (II) a nitrogen-containing organic compound such as heterocyclic compound or containing --N.dbd. and --NH.sub.2 and/or --OH groups in its molecule can give multilayer printed wiring boards having excellent adhesive strength and line definition of inner layer copper conductors with long shelf life.

摘要翻译： 一种用（I）铜离子，络合剂，还原剂，pH调节剂，水等液体组合物处理金属表面的方法，（II）含氮有机化合物如 杂环化合物或其分子中含有-N =和-NH 2和/或-OH基团可以提供具有优良的粘合强度和具有长保质期的内层铜导线的线定义的多层印刷线路板。

公开(公告)号：US4548644A

公开(公告)日：1985-10-22

申请号：US535057

申请日：1983-09-23

申请人： Akishi Nakaso ,  Kiyoshi Yamanoi ,  Toshiro Okamura ,  Yoshiyuki Tsuru

发明人： Akishi Nakaso ,  Kiyoshi Yamanoi ,  Toshiro Okamura ,  Yoshiyuki Tsuru

IPC分类号： C23C18/40 ,  C23C3/02

CPC分类号： C23C18/40

摘要： An electroless copper deposition solution comprising (a) cupric ions, a complexing agent for cupric ions, a reducing agent and a pH adjusting agent, (b) a polyoxyethylene ether and (c) at least one member selected from the group consisting of an inorganic cyanide and .alpha.,.alpha.'-dipyridyl can give a deposited film with high elongation.

摘要翻译： 一种无电解铜沉积溶液，其包含（a）铜离子，铜离子络合剂，还原剂和pH调节剂，（b）聚氧乙烯醚和（c）至少一种选自无机 氰化物和α，α'-二吡啶基可以产生具有高伸长率的沉积膜。

公开(公告)号：US06810181B2

公开(公告)日：2004-10-26

申请号：US10714911

申请日：2003-11-18

申请人： Masatoshi Yamaguchi ,  Nobuo Miyadera ,  Kiyoshi Yamanoi ,  Hiroyuki Matsuura

发明人： Masatoshi Yamaguchi ,  Nobuo Miyadera ,  Kiyoshi Yamanoi ,  Hiroyuki Matsuura

IPC分类号： G02B610

CPC分类号： G02F1/065 ,  Y10T428/12535

摘要： The present invention relates to an electrode structure, which comprises a substrate provided with an electrode formed thereon, wherein the substrate comprises a layer of a fluorine-containing polyimide and a layer of a fluorine-free resin is interposed between the polyimide layer and the electrode and, in particular, to the foregoing electrode structure, wherein the electrode comprises a gold layer as the outermost or surface layer and an aluminum layer interposed between the substrate and the gold layer. The electrode structure of the present invention never causes any peeling off of the electrode due to insufficient adhesion of the electrode to the substrate, the structure has sufficiently high strength and therefore the boundary between the substrate and the electrode formed thereon is not destroyed by the energy of ultrasonics applied thereto.