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公开(公告)号：US4557762A
公开(公告)日：1985-12-10
申请号：US635403
申请日：1984-07-30
IPC分类号： C23C18/40
CPC分类号： C23C18/40 , C23C18/405
摘要： An electroless copper plating solution comprising cupric ions, a complexing agent, a reducing agent, a pH adjuster, a perfluoropolyether, a cyanide and/or .alpha.,.alpha.'-dipyridyl and/or 1,10-phenanthroline or a derivative thereof is capable of forming a deposited film with high elongation.
摘要翻译： 包含铜离子，络合剂，还原剂，pH调节剂，全氟聚醚，氰化物和/或α，α'-二吡啶基和/或1,10-菲咯啉或其衍生物的化学镀铜溶液能够 形成具有高伸长率的沉积膜。
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公开(公告)号：US08809696B2
公开(公告)日：2014-08-19
申请号：US13060095
申请日：2009-06-17
申请人： Tomoaki Yamashita , Sumiko Nakajima , Sadao Itou , Fumio Inoue , Shigeharu Arike
发明人： Tomoaki Yamashita , Sumiko Nakajima , Sadao Itou , Fumio Inoue , Shigeharu Arike
IPC分类号： H05K1/00
CPC分类号： C23F1/18 , C23F1/02 , H01L2224/16225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/181 , H05K3/384 , H05K3/385 , H05K2203/0315 , H05K2203/1157 , Y10T29/49982 , Y10T428/12438 , Y10T428/12771 , Y10T428/24917 , H01L2924/00012 , H01L2924/00014
摘要： An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.
摘要翻译： 本发明的目的是提供一种铜表面处理方法，其能够确保铜表面和抗蚀剂之间或铜表面与绝缘树脂之间的结合强度，而不会形成尺寸大于1μm的凹凸 铜表面和用该方法处理的铜。 表面处理方法，包括：在铜表面上离开形成比铜更贵的金属的第一步骤; 在第一步骤之后的第二步，通过用含有氧化剂的碱性溶液氧化在铜表面上形成氧化铜; 以及将氧化铜溶解以除去的第三步骤，从而在铜表面上形成凹凸。
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公开(公告)号：US20110147072A1
公开(公告)日：2011-06-23
申请号：US13060095
申请日：2009-06-17
申请人： Tomoaki Yamashita , Sumiko Nakajima , Sadao Itou , Fumio Inoue , Shigeharu Arike
发明人： Tomoaki Yamashita , Sumiko Nakajima , Sadao Itou , Fumio Inoue , Shigeharu Arike
CPC分类号： C23F1/18 , C23F1/02 , H01L2224/16225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/181 , H05K3/384 , H05K3/385 , H05K2203/0315 , H05K2203/1157 , Y10T29/49982 , Y10T428/12438 , Y10T428/12771 , Y10T428/24917 , H01L2924/00012 , H01L2924/00014
摘要： An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.
摘要翻译： 本发明的目的是提供一种铜表面处理方法，其能够确保铜表面和抗蚀剂之间或铜表面与绝缘树脂之间的结合强度，而不会形成尺寸大于1μm的凹凸 铜表面和用该方法处理的铜。 表面处理方法，包括：在铜表面上离开形成比铜更贵的金属的第一步骤; 在第一步骤之后的第二步，通过用含有氧化剂的碱性溶液氧化在铜表面上形成氧化铜; 以及将氧化铜溶解以除去的第三步骤，从而在铜表面上形成凹凸。
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公开(公告)号：US06811828B2
公开(公告)日：2004-11-02
申请号：US10380548
申请日：2003-03-17
IPC分类号： B05D118
CPC分类号： C23C18/44
摘要： The present invention is aimed to provide an electroless gold plating solution which requires less amount of a reducing agent, retains a sufficient deposition rate for a practical use, and has an excellent stability as a plating solution; and a method for carrying out an electroless gold plating. The present invention provides an electroless gold plating solution comprising a gold salt, a phenyl compound based reducing agent and a water-soluble amine and a method for plating using the gold plating solution.
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