Electrode structure
    1.
    发明授权

    公开(公告)号:US06810181B2

    公开(公告)日:2004-10-26

    申请号:US10714911

    申请日:2003-11-18

    IPC分类号: G02B610

    CPC分类号: G02F1/065 Y10T428/12535

    摘要: The present invention relates to an electrode structure, which comprises a substrate provided with an electrode formed thereon, wherein the substrate comprises a layer of a fluorine-containing polyimide and a layer of a fluorine-free resin is interposed between the polyimide layer and the electrode and, in particular, to the foregoing electrode structure, wherein the electrode comprises a gold layer as the outermost or surface layer and an aluminum layer interposed between the substrate and the gold layer. The electrode structure of the present invention never causes any peeling off of the electrode due to insufficient adhesion of the electrode to the substrate, the structure has sufficiently high strength and therefore the boundary between the substrate and the electrode formed thereon is not destroyed by the energy of ultrasonics applied thereto.

    Electroless copper deposition solution
    5.
    发明授权
    Electroless copper deposition solution 失效
    无电镀铜沉积溶液

    公开(公告)号:US4548644A

    公开(公告)日:1985-10-22

    申请号:US535057

    申请日:1983-09-23

    IPC分类号: C23C18/40 C23C3/02

    CPC分类号: C23C18/40

    摘要: An electroless copper deposition solution comprising (a) cupric ions, a complexing agent for cupric ions, a reducing agent and a pH adjusting agent, (b) a polyoxyethylene ether and (c) at least one member selected from the group consisting of an inorganic cyanide and .alpha.,.alpha.'-dipyridyl can give a deposited film with high elongation.

    摘要翻译: 一种无电解铜沉积溶液,其包含(a)铜离子,铜离子络合剂,还原剂和pH调节剂,(b)聚氧乙烯醚和(c)至少一种选自无机 氰化物和α,α'-二吡啶基可以产生具有高伸长率的沉积膜。