Local area network for reconfiguration in the event of line ruptures or node failure
    1.
    发明授权
    Local area network for reconfiguration in the event of line ruptures or node failure 失效
    发生线路破裂或节点故障时重新配置的局域网

    公开(公告)号:US06278690B1

    公开(公告)日:2001-08-21

    申请号:US09057651

    申请日:1998-04-09

    IPC分类号: H04J116

    摘要: A local area network with a plurality of nodes for transmitting cells in the asynchronous transfer mode over a ring system having two opposite direction rings. In the event of a defect in a transmitting line from a node, or a defect in a neighboring node, a loop is formed in this node to reroute messages from one ring to the other. First, a node detecting a defect transmits a message of a first type to all other involved nodes, identifying the location of the detected defect. This information is entered in a respective status table in each node. After evaluating the information in its status table, a node which should form a loop does so, and sends a message of a second type identifying the loop to any nodes which do not already have this information.

    摘要翻译: 一种具有多个节点的局域网,用于通过具有两个相反方向环的环系统以异步传输模式传送小区。 在来自节点的传输线路中的缺陷或相邻节点的缺陷的情况下,在该节点中形成环路以将消息从一个环路重新路由到另一个环路。 首先,检测缺陷的节点向所有其他相关节点发送第一类型的消息,识别检测到的缺陷的位置。 该信息被输入到每个节点的相应状态表中。 在对其状态表中的信息进行评估之后,应该形成循环的节点执行此操作,并且向没有该信息的任何节点发送标识循环的第二类型的消息。

    Multilayer printed circuit board, in particular, for high-frequency
operation
    2.
    发明授权
    Multilayer printed circuit board, in particular, for high-frequency operation 失效
    多层印刷电路板,特别适用于高频操作

    公开(公告)号:US5336855A

    公开(公告)日:1994-08-09

    申请号:US817238

    申请日:1992-01-06

    IPC分类号: H05K3/46 H05K1/02 H05K1/00

    摘要: The invention relates to a multilayer printed circuit board, in particular, for high-frequency operation, having least an outer, plane dielectric layer for accommodating interconnection paths of equal cross-section and component as well as further alternately provided metallic and dielectric layers for forming a reference earth and for the voltage supply to said interconnection paths and components via plated-through holes. In order to obtain a plane surface for the interconnection paths and predetermined areas on the printed circuit board, which areas have different characteristic impedances when interconnection paths having the same cross-section are used, at least the first metal layer comprises at least one window and the subsequent metal layer has a metal island corresponding to the area of the window, which island is connected to the reference earth via a buried plated-through hole, and the characteristic impedance of the interconnection paths is a function of the resulting thickness of the effective dielectric layers the number of which is increased in the area of the window.

    摘要翻译: 本发明涉及一种多层印刷电路板,特别是用于高频操作的多层印刷电路板,具有至少一个用于容纳相等横截面和分量的互连路径的外平面介电层,以及进一步交替提供用于形成的金属和电介质层 参考地和用于通过电镀通孔对所述互连路径和部件的电压供应。 为了获得互连路径和印刷电路板上的预定区域的平面,当使用具有相同横截面的互连路径时,哪些区域具有不同的特性阻抗,至少第一金属层包括至少一个窗口和 随后的金属层具有对应于窗口区域的金属岛,该岛通过掩埋电镀通孔连接到参考地,并且互连路径的特征阻抗是所产生的有效的厚度的函数 电介质层的数量在窗口的面积上增加。