Use of a graphite heat-dissipation device including a plating metal layer
    1.
    发明授权
    Use of a graphite heat-dissipation device including a plating metal layer 有权
    使用包括电镀金属层的石墨散热装置

    公开(公告)号:US09097468B2

    公开(公告)日:2015-08-04

    申请号:US13366353

    申请日:2012-02-05

    IPC分类号: F28F13/18 F28F7/00

    CPC分类号: F28F7/00

    摘要: The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.

    摘要翻译: 本发明涉及一种电子装置的散热装置,其特征在于,包括石墨平面体,一个或多个金属层,绝缘膜和粘合剂。 散热装置可选地连接到散热器。 还公开了使用散热装置散热的方法。

    HEAT DISSIPATION COMPOSITE AND THE USE THEREOF
    4.
    发明申请
    HEAT DISSIPATION COMPOSITE AND THE USE THEREOF 审中-公开
    散热复合材料及其用途

    公开(公告)号:US20140069622A1

    公开(公告)日:2014-03-13

    申请号:US13938138

    申请日:2013-07-09

    IPC分类号: H05K7/20 F28F3/00

    摘要: A multi-layer heat dissipation composite for reducing the external surface temperature of an electronic device is disclosed. The heat dissipation composite comprises a reflective component and a component with anisotropic property. The heat dissipation composite further comprises an adhesive. Some embodiments also provide methods for reducing the external surface temperature of an electronic device.

    摘要翻译: 公开了一种用于降低电子设备的外表面温度的多层散热复合材料。 散热复合材料包括反射组件和具有各向异性特性的组件。 散热复合材料还包括粘合剂。 一些实施例还提供了用于降低电子设备的外表面温度的方法。

    USE OF A GRAPHITE HEAT-DISSIPATION DEVICE INCLUDING A PLATING METAL LAYER
    6.
    发明申请
    USE OF A GRAPHITE HEAT-DISSIPATION DEVICE INCLUDING A PLATING METAL LAYER 有权
    使用包括镀金属层的石墨加热装置

    公开(公告)号:US20120132404A1

    公开(公告)日:2012-05-31

    申请号:US13366353

    申请日:2012-02-05

    IPC分类号: F28F13/00

    CPC分类号: F28F7/00

    摘要: The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.

    摘要翻译: 本发明涉及一种电子装置的散热装置,其特征在于,包括石墨平面体,一个或多个金属层,绝缘膜和粘合剂。 散热装置可选地连接到散热器。 还公开了使用散热装置散热的方法。

    ANISOTROPIC HEAT DISSIPATION IN A BACKLIGHT UNIT
    8.
    发明申请
    ANISOTROPIC HEAT DISSIPATION IN A BACKLIGHT UNIT 审中-公开
    背光单元中的各向异性散热

    公开(公告)号:US20140049984A1

    公开(公告)日:2014-02-20

    申请号:US13970185

    申请日:2013-08-19

    IPC分类号: F21V29/00

    摘要: A backlight unit with a light source, a light guiding plate, a reflective film and an anisotropic heat dissipation layer is disclosed. At least some embodiments provide a display panel including the backlight unit and methods for reducing the temperature of a backlight unit by the anisotropic heat dissipation layer.

    摘要翻译: 公开了具有光源,导光板,反射膜和各向异性散热层的背光单元。 至少一些实施例提供包括背光单元的显示面板和通过各向异性散热层降低背光单元的温度的方法。

    HEAT-DISSIPATING DEVICE INCLUDING A PLATING METAL LAYER
    9.
    发明申请
    HEAT-DISSIPATING DEVICE INCLUDING A PLATING METAL LAYER 审中-公开
    包括镀金属层的热灭灭装置

    公开(公告)号:US20100243230A1

    公开(公告)日:2010-09-30

    申请号:US12541677

    申请日:2009-08-14

    IPC分类号: F28F21/02 B21D53/02 F28F21/08

    摘要: A heat-dissipating device includes: a planar body made of a graphite laminate and extending along an x-y plane of the graphite laminate; and a plating metal layer formed on the planar body. The heat-dissipating device further includes a metal panel. The planar body is connected substantially perpendicularly to the metal panel. A method of making the heat-dissipating device is also disclosed.

    摘要翻译: 一种散热装置,包括:由石墨层叠体制成的平面体,并沿着石墨层叠体的x-y平面延伸; 以及形成在平面体上的电镀金属层。 散热装置还包括金属板。 平面体基本上垂直于金属面板连接。 还公开了制造散热装置的方法。

    USE OF A GRAPHITE HEAT-DISSIPATION DEVICE INCLUDING A PLATING METAL LAYER
    10.
    发明申请
    USE OF A GRAPHITE HEAT-DISSIPATION DEVICE INCLUDING A PLATING METAL LAYER 有权
    使用包括镀金属层的石墨加热装置

    公开(公告)号:US20110214851A1

    公开(公告)日:2011-09-08

    申请号:US13108983

    申请日:2011-05-16

    IPC分类号: F28F7/00

    CPC分类号: F28F7/00

    摘要: The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.

    摘要翻译: 本发明涉及一种电子装置的散热装置,其特征在于,包括石墨平面体,一个或多个金属层,绝缘膜和粘合剂。 散热装置可选地连接到散热器。 还公开了使用散热装置散热的方法。