公开(公告)号：US07223617B2

公开(公告)日：2007-05-29

申请号：US10629544

申请日：2003-07-30

申请人： Korekazu Mochida, legal representative ,  Kyoko Mochida, legal representative ,  Hiroto Inoue ,  Suguru Nakao ,  Yukihiro Iwata ,  Akira Takamori ,  Hideto Adachi ,  Masatoshi Tamura

发明人： Atuhito Mochida, deceased

IPC分类号： H01L21/00

CPC分类号： H01S5/02272 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/83192

摘要： A method of mounting a semiconductor laser component capable of preventing deterioration of laser characteristics and destruction of the semiconductor laser component due to a rise in temperature and a residual stress of the semiconductor laser component. The semiconductor laser component is mounted on a submount by heating and pressure-bonding, and is heated again up to a temperature more than a melting point of a bonding member at the released pressure to release the residual stress.

摘要翻译： 一种安装半导体激光器部件的方法，该半导体激光器部件能够防止半导体激光器部件的温度升高和残余应力引起的激光特性劣化和半导体激光部件的破坏。 半导体激光器部件通过加热和压接而安装在基座上，并且在释放的压力下再次被加热到接合部件的熔点以上以释放残余应力。

公开(公告)号：US20050127144A1

公开(公告)日：2005-06-16

申请号：US10730982

申请日：2003-12-10

申请人： Atuhito Mochida ,  Korekazu Mochida ,  Kyoko Mochida ,  Hiroto Inoue ,  Suguru Nakao ,  Yukihiro Iwata ,  Akira Takamori ,  Hideto Adachi ,  Masatoshi Tamura

发明人： Atuhito Mochida ,  Korekazu Mochida ,  Kyoko Mochida ,  Hiroto Inoue ,  Suguru Nakao ,  Yukihiro Iwata ,  Akira Takamori ,  Hideto Adachi ,  Masatoshi Tamura

IPC分类号： B23K20/02 ,  B23K31/02

CPC分类号： B23K20/023 ,  B23K2101/36 ,  H01L24/83 ,  H01L2224/83192

摘要： The present invention to provide a method of mounting a semiconductor laser component capable of preventing deterioration of laser characteristics and destruction of the semiconductor laser component due to residual stresses as well as preventing decrease of a lifetime due to increase in temperature of the semiconductor laser component. The method of mounting a semiconductor laser device which comprises a step of pressure bonding a semiconductor laser component on a submount by a collet while a bonding member is heated to be fused or melt on a submount by heating a table on which the submount is placed, for example, characterized in that the table and the collet are heated to a temperature higher than a fusing point of said bonding member so as not to occur the heat transfer substantially to a collet, and then heating of the table and the collet is terminated with maintaining the pressure bonding state.

摘要翻译： 本发明提供一种安装半导体激光器部件的方法，该半导体激光器部件能够防止由于残余应力引起的激光特性的劣化和半导体激光器部件的破坏以及防止半导体激光部件的温度升高引起的寿命的降低。 一种半导体激光装置的安装方法，其特征在于，在通过加热配置有所述基台的工作台的同时，在接合部件被加热熔融或熔融在副安装座上时，通过夹头将半导体激光部件压接在副安装座上的工序， 例如，其特征在于，将工作台和夹头加热到高于所述接合构件的熔点的温度，以便不将热传递基本上发生到夹头，然后用桌子和夹头加热，以 保持压接状态。

公开(公告)号：US20060171434A1

公开(公告)日：2006-08-03

申请号：US10629544

申请日：2003-07-30

申请人： Atuhito Mochida ,  Hiroto Inoue ,  Suguru Nakao ,  Yukihiro Iwata ,  Akira Takamori ,  Hideto Adachi ,  Masatoshi Tamura ,  Korekazu Mochida ,  Kyoko Mochida

发明人： Atuhito Mochida ,  Hiroto Inoue ,  Suguru Nakao ,  Yukihiro Iwata ,  Akira Takamori ,  Hideto Adachi ,  Masatoshi Tamura ,  Korekazu Mochida ,  Kyoko Mochida

IPC分类号： H01S5/00

CPC分类号： H01S5/02272 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/83192

摘要： The present invention provides a method of mounting a semiconductor laser component capable of preventing deterioration of laser characteristics and destruction of the semiconductor laser component due to a rise in temperature and a residual stress of the semiconductor laser component, wherein the semiconductor laser component is mounted on a submount by heating and pressure-bonding, and is heated again up to a temperature more than a melting point of a bonding member at the released pressure to release the residual stress.

摘要翻译： 本发明提供了一种安装半导体激光器部件的方法，该半导体激光器部件能够防止半导体激光器部件的温度升高和残余应力引起的激光特性劣化和半导体激光部件的破坏， 通过加热和压力粘合的基座，并且在释放的压力下再次被加热到接合部件的熔点以上的温度以释放残余应力。