公开(公告)号：US20120257307A1

公开(公告)日：2012-10-11

申请号：US13350428

申请日：2012-01-13

申请人： Kota Tokuda

发明人： Kota Tokuda

IPC分类号： H05K1/00 ,  G11B5/48

CPC分类号： G11B5/4806 ,  H05K1/0281 ,  H05K2201/056

摘要： According to one embodiment, an electronic component includes: an FPC wiring board in which electrical interconnections are formed on a film; a first FPC reinforcement plate which is bonded to a part of the FPC wiring board and has an opening portion; and a second FPC reinforcement plate which is bonded to another part of the FPC wiring board and has a projection which can be engaged with the opening portion of the first FPC reinforcement plate.

摘要翻译： 根据一个实施例，电子部件包括：FPC布线板，其中在膜上形成电互连; 第一FPC加强板，其接合到FPC布线板的一部分并具有开口部; 以及第二FPC加强板，其接合到FPC布线板的另一部分并且具有能够与第一FPC加强板的开口部接合的突起。

公开(公告)号：US20120051004A1

公开(公告)日：2012-03-01

申请号：US13093593

申请日：2011-04-25

申请人： Kota Tokuda ,  Sadahiro Tamai

发明人： Kota Tokuda ,  Sadahiro Tamai

IPC分类号： H05K1/02

CPC分类号： H05K1/189 ,  G06F1/1616 ,  H05K3/0064 ,  H05K2201/09063 ,  H05K2201/2009

摘要： According to one embodiment, an electronic apparatus includes a housing and a flexible printed circuit board accommodated in the housing. The flexible printed circuit board includes a base portion, an electrically conductive portion, a first adhesive portion, a cover portion, a rigid reinforcement plate, and a second adhesive portion. The electrically conductive portion is laminated to the base portion. The first adhesive portion is laminated to the conductive portion and includes a first opening. The cover portion is laminated to the first adhesive portion and includes a second opening continuous with the first opening. The rigid reinforcement plate is opposed to the cover portion. The second adhesive portion penetrates the first and second openings and is interposed between the cover portion and the reinforcement plate.

摘要翻译： 根据一个实施例，电子设备包括容纳在壳体中的壳体和柔性印刷电路板。 柔性印刷电路板包括基部，导电部分，第一粘合部分，盖部分，刚性加强板和第二粘合部分。 导电部分层压到基部。 第一粘合部分层压到导电部分并且包括第一开口。 盖部分层压到第一粘合剂部分并且包括与第一开口连续的第二开口。 刚性加强板与盖部相对。 第二粘合剂部分穿透第一和第二开口并插入在盖部分和加强板之间。

公开(公告)号：US20110211610A1

公开(公告)日：2011-09-01

申请号：US12929657

申请日：2011-02-07

申请人： Kazunari Saito ,  Noriyuki Banno ,  Kota Tokuda

发明人： Kazunari Saito ,  Noriyuki Banno ,  Kota Tokuda

IPC分类号： H01S5/40 ,  H01S5/323

CPC分类号： H01S5/22 ,  B82Y20/00 ,  G11B7/1275 ,  H01S5/02272 ,  H01S5/02461 ,  H01S5/02476 ,  H01S5/0425 ,  H01S5/2214 ,  H01S5/3432 ,  H01S5/34326 ,  H01S5/34333 ,  H01S5/4043 ,  H01S5/4087 ,  H01S2301/18

摘要： A light emitting device includes: a support base; a first light emitting element which is provided at one surface side of the support base and has a first substrate; and a second light emitting element which is provided between the first light emitting element and the support base and has a second substrate, which has a light emitting section as a semiconductor layer and a peripheral section other than the light emitting section at the first light emitting element side of the second substrate, and which has an embedded layer formed of a material with higher heat conductivity than the semiconductor layer in the peripheral section.

摘要翻译： 发光装置包括：支撑基座; 第一发光元件，其设置在所述支撑基座的一个表面侧，并具有第一基板; 以及第二发光元件，其设置在所述第一发光元件和所述支撑基座之间，并且具有第二基板，所述第二基板在所述第一发光区域具有作为半导体层的发光部和除了所述发光部以外的周边部 元件侧，并且具有由与周边部分中的半导体层相比更高的导热性的材料形成的嵌入层。

公开(公告)号：US08509278B2

公开(公告)日：2013-08-13

申请号：US12929657

申请日：2011-02-07

申请人： Kazunari Saito ,  Noriyuki Banno ,  Kota Tokuda

发明人： Kazunari Saito ,  Noriyuki Banno ,  Kota Tokuda

IPC分类号： H01S5/00

CPC分类号： H01S5/22 ,  B82Y20/00 ,  G11B7/1275 ,  H01S5/02272 ,  H01S5/02461 ,  H01S5/02476 ,  H01S5/0425 ,  H01S5/2214 ,  H01S5/3432 ,  H01S5/34326 ,  H01S5/34333 ,  H01S5/4043 ,  H01S5/4087 ,  H01S2301/18

摘要： A light emitting device includes: a support base; a first light emitting element which is provided at one surface side of the support base and has a first substrate; and a second light emitting element which is provided between the first light emitting element and the support base and has a second substrate, which has a light emitting section as a semiconductor layer and a peripheral section other than the light emitting section at the first light emitting element side of the second substrate, and which has an embedded layer formed of a material with higher heat conductivity than the semiconductor layer in the peripheral section.

摘要翻译： 发光装置包括：支撑基座; 第一发光元件，其设置在所述支撑基座的一个表面侧，并具有第一基板; 以及第二发光元件，其设置在所述第一发光元件和所述支撑基座之间，并且具有第二基板，所述第二基板在所述第一发光区域具有作为半导体层的发光部和除了所述发光部以外的周边部 元件侧，并且具有由与周边部分中的半导体层相比更高的导热性的材料形成的嵌入层。

公开(公告)号：US08767405B2

公开(公告)日：2014-07-01

申请号：US13093593

申请日：2011-04-25

申请人： Kota Tokuda ,  Sadahiro Tamai

发明人： Kota Tokuda ,  Sadahiro Tamai

IPC分类号： H05K5/00

CPC分类号： H05K1/189 ,  G06F1/1616 ,  H05K3/0064 ,  H05K2201/09063 ,  H05K2201/2009

摘要： According to one embodiment, an electronic apparatus includes a housing and a flexible printed circuit board accommodated in the housing. The flexible printed circuit board includes a base portion, an electrically conductive portion, a first adhesive portion, a cover portion, a rigid reinforcement plate, and a second adhesive portion. The electrically conductive portion is laminated to the base portion. The first adhesive portion is laminated to the conductive portion and includes a first opening. The cover portion is laminated to the first adhesive portion and includes a second opening continuous with the first opening. The rigid reinforcement plate is opposed to the cover portion. The second adhesive portion penetrates the first and second openings and is interposed between the cover portion and the reinforcement plate.

摘要翻译： 根据一个实施例，电子设备包括容纳在壳体中的壳体和柔性印刷电路板。 柔性印刷电路板包括基部，导电部分，第一粘合部分，盖部分，刚性加强板和第二粘合部分。 导电部分层压到基部。 第一粘合部分层压到导电部分并且包括第一开口。 盖部分层压到第一粘合剂部分并且包括与第一开口连续的第二开口。 刚性加强板与盖部相对。 第二粘合剂部分穿透第一和第二开口并插入在盖部分和加强板之间。

公开(公告)号：US08435880B2

公开(公告)日：2013-05-07

申请号：US12906217

申请日：2010-10-18

申请人： Akira Ohmae ,  Kota Tokuda ,  Masayuki Arimochi ,  Nobuhiro Suzuki ,  Michinori Shiomi ,  Tomonori Hino ,  Katsunori Yanashima

发明人： Akira Ohmae ,  Kota Tokuda ,  Masayuki Arimochi ,  Nobuhiro Suzuki ,  Michinori Shiomi ,  Tomonori Hino ,  Katsunori Yanashima

IPC分类号： H01L33/00

CPC分类号： H01L33/16 ,  H01L33/007 ,  H01L33/32 ,  H01S5/3013

摘要： In a method for manufacturing a semiconductor device, the method includes the step of growing a nitride-based III-V compound semiconductor layer, which forms a device structure, directly on a substrate without growing a buffer layer, the substrate being made of a material with a hexagonal crystal structure and having a principal surface that is oriented off at an angle of not less than −0.5° and not more than 0° from an R-plane with respect to a direction of a C-axis.

摘要翻译： 在制造半导体器件的方法中，该方法包括以下步骤：在不生长缓冲层的情况下，直接在衬底上生长形成器件结构的氮化物III-V族化合物半导体层，该衬底由材料 具有六边形晶体结构，并且具有相对于C轴方向从R平面以不小于-0.5°且不大于0°的角度取向的主表面。

公开(公告)号：US20110095401A1

公开(公告)日：2011-04-28

申请号：US12906217

申请日：2010-10-18

申请人： Akira Ohmae ,  Kota Tokuda ,  Masayuki Arimochi ,  Nobuhiro Suzuki ,  Michinori Shiomi ,  Tomonori Hino ,  Katsunori Yanashima

发明人： Akira Ohmae ,  Kota Tokuda ,  Masayuki Arimochi ,  Nobuhiro Suzuki ,  Michinori Shiomi ,  Tomonori Hino ,  Katsunori Yanashima

IPC分类号： H01L29/20 ,  H01L21/20

CPC分类号： H01L33/16 ,  H01L33/007 ,  H01L33/32 ,  H01S5/3013

摘要： In a method for manufacturing a semiconductor device, the method includes the step of growing a nitride-based III-V compound semiconductor layer, which forms a device structure, directly on a substrate without growing a buffer layer, the substrate being made of a material with a hexagonal crystal structure and having a principal surface that is oriented off at an angle of not less than −0.5° and not more than 0° from an R-plane with respect to a direction of a C-axis.

摘要翻译： 在制造半导体器件的方法中，该方法包括以下步骤：在不生长缓冲层的情况下，直接在衬底上生长形成器件结构的氮化物III-V族化合物半导体层，该衬底由材料 具有六边形晶体结构，并且具有相对于C轴方向从R平面以不小于-0.5°且不大于0°的角度取向的主表面。