公开(公告)号：US20050100723A1

公开(公告)日：2005-05-12

申请号：US10506705

申请日：2003-01-14

Applicant: Hiroyuki Tanaka ,  Ryosuke Matsui ,  Koukichi Hashimoto

Inventor： Hiroyuki Tanaka ,  Ryosuke Matsui ,  Koukichi Hashimoto

IPC: B32B27/08 ,  B32B27/36 ,  C08G63/672 ,  C08J5/18 ,  C08L67/02 ,  B32B15/08 ,  C08F20/00

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/36 ,  B32B2270/00 ,  B32B2311/24 ,  B32B2367/00 ,  C08G63/672 ,  C08G2261/126 ,  C08J5/18 ,  C08J2367/02 ,  C08L67/02 ,  C08L67/025 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786 ,  C08L2666/18

Abstract: In order to provide a polyester film having superior impact resistance and flex pinhole resistance, and further exhibiting superior gas barrier properties after a metal or metal oxide is deposited on the film, with the inherent characteristics of polyester film maintained, such as low hygroscopicity, dimensional stability, flatness, and transparency, the polyester film comprises a mixture of 70% to 97% by weight of polyester A mainly composed of a repeating unit comprising ethylene terephthalate and 3% to 30% by weight of polyester B mainly composed of a repeating unit comprising butylene terephthalate. The polyester film has a melting point in range of 245 to 270° C. The polyester film may comprise a polyester resin containing 90% to 60% by weight of an ethylene terephthalate component, 10% to 40% by weight of a butylene terephthalate component, and 0.1% to 5% by weight of a polyoxyalkylene glycol component. The polyester film is suitably used for packaging and other applications.

Abstract translation: 为了提供具有优异的耐冲击性和抗针孔性的聚酯膜，并且在金属或金属氧化物沉积在膜上之后进一步表现出优异的阻气性，保持了聚酯膜的固有特性，例如低吸湿性，尺寸 稳定性，平整度和透明度，聚酯膜包含主要由包含对苯二甲酸乙二醇酯和3重量％至30重量％的主要由重复单元组成的聚酯B的重复单元组成的聚酯A的70重量％至97重量％的混合物 包括对苯二甲酸丁二醇酯。 聚酯薄膜的熔点范围为245〜270℃。聚酯薄膜可以包含含有对苯二甲酸乙二醇酯成分90〜60重量％的聚酯树脂，10重量％〜40重量％的对苯二甲酸丁二醇酯成分 ，和0.1〜5重量％的聚氧亚烷基二醇成分。 聚酯薄膜适用于包装和其他应用。

公开(公告)号：US5981029A

公开(公告)日：1999-11-09

申请号：US825338

申请日：1997-03-28

Applicant: Yutaka Harada ,  Masahiro Kimura ,  Koukichi Hashimoto ,  Koichi Abe

Inventor： Yutaka Harada ,  Masahiro Kimura ,  Koukichi Hashimoto ,  Koichi Abe

IPC: C08J7/04 ,  C09D5/00 ,  B32B5/16

CPC classification number: C09D5/00 ,  C08J7/047 ,  Y10T428/24372 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/259 ,  Y10T428/269

Abstract: A gas barrier film comprises a thermoplastic resin substrate and on the substrate a gas barrier coating, which coating comprises a water soluble or water dispersible high polymer and inorganic stratified particles.In one film, the surface of the gas barrier coating remote from the substrate has a roughness parameter Rt/Ra of 25 or less.In an alternative film, the gas barrier coating contains an amine compound represented by the following general formula: ##STR1## where R1 stands for a hydrogen atom, or a C.sub.1-6 alkyl or allyl or phenyl group; R2 stands for a hydrogen atom, or an optionally substrated alkyl or allyl group; and R3 stands for an optionally substituted alkyl or allyl group.

Abstract translation: 阻气膜包括热塑性树脂基材，在基材上包含阻气涂层，该涂层包含水溶性或水分散性高分子聚合物和无机分层颗粒。 在一个膜中，远离基板的阻气涂层的表面的粗糙度参数Rt / Ra为25以下。 在替代膜中，阻气涂层含有由以下通式表示的胺化合物：其中R1代表氢原子，或C1-6烷基或烯丙基或苯基; R 2代表氢原子，或任选的下基团的烷基或烯丙基; R3代表任选取代的烷基或烯丙基。

公开(公告)号：US20120042105A1

公开(公告)日：2012-02-16

申请号：US13279974

申请日：2011-10-24

Applicant: Takashi MAEDA ,  Mamoru SUMIDA ,  Koukichi HASHIMOTO ,  Masatoshi MATSUSHITA

Inventor： Takashi MAEDA ,  Mamoru SUMIDA ,  Koukichi HASHIMOTO ,  Masatoshi MATSUSHITA

IPC: G06F13/00

CPC classification number: G06F13/364

Abstract: An arbitration circuit 108 receives a read/write request from a master 101, such as a CPU, in which low latency is required, at a regular interval, such that the master 101 performs memory access with low latency. A remaining band which is not used by the master 101 is allocated to masters 102 and 103, such as a DMA controller, in which a wideband is required, thereby ensuring a necessary band. When a read/write request is retained in a buffer 119 of a slave 118, the arbitration circuit 108 suppresses the acceptance of the read/write requests from the masters 102 and 103 having low priority. Therefore, it is possible to provide a bus arbitration apparatus capable of transmitting a request from a specific master to a slave with low latency, and to ensure a band necessary for another master.

Abstract translation: 仲裁电路108以规则的间隔从诸如CPU的主机101（其中需要低延迟）的主机101接收读/写请求，使得主机101以低延迟执行存储器访问。 主机101不使用的剩余频带被分配给需要宽带的诸如DMA控制器的主机102和103，从而确保必要的频带。 当读/写请求被保留在从站118的缓冲器119中时，仲裁电路108抑制对具有低优先级的主站102和103的读/写请求的接受。 因此，可以提供一种总线仲裁装置，其能够以低延迟将特定主机的请求发送到从机，并且确保另一主机必需的频带。

公开(公告)号：US6083605A

公开(公告)日：2000-07-04

申请号：US378712

申请日：1999-08-23

Applicant: Yutaka Harada ,  Masahiro Kimura ,  Koukichi Hashimoto ,  Koichi Abe

Inventor： Yutaka Harada ,  Masahiro Kimura ,  Koukichi Hashimoto ,  Koichi Abe

IPC: C08J7/04 ,  B32B5/16

CPC classification number: C08J7/047 ,  C08J2429/00 ,  Y10T428/24372 ,  Y10T428/25 ,  Y10T428/269

Abstract: A gas barrier film comprises a thermoplastic resin substrate and on the substrate a gas barrier coating, which coating comprises a water soluble or water dispersible high polymer and inorganic stratified particles.In one film, the surface of the gas barrier coating remote from the substrate has a roughness parameter Rt/Ra of 25 or less.In an alternative film, the gas barrier coating contains an amine compound represented by the following general formula: ##STR1## where R1 stands for a hydrogen atom, or a C.sub.1-6 alkyl or allyl or phenyl group; R2 stands for a hydrogen atom, or an optionally substrated alkyl or allyl group; and R3 stands for an optionally substituted alkyl or allyl group.

Abstract translation: 阻气膜包括热塑性树脂基材，在基材上包含阻气涂层，该涂层包含水溶性或水分散性高分子聚合物和无机分层颗粒。 在一个膜中，远离基板的阻气涂层的表面的粗糙度参数Rt / Ra为25以下。 在替代膜中，阻气涂层含有由以下通式表示的胺化合物：其中R1代表氢原子，或C1-6烷基或烯丙基或苯基; R 2代表氢原子，或任选的下基团的烷基或烯丙基; R3代表任选取代的烷基或烯丙基。

公开(公告)号：US07115320B2

公开(公告)日：2006-10-03

申请号：US10506705

申请日：2003-01-14

Applicant: Hiroyuki Tanaka ,  Ryosuke Matsui ,  Koukichi Hashimoto

Inventor： Hiroyuki Tanaka ,  Ryosuke Matsui ,  Koukichi Hashimoto

IPC: B32B15/09 ,  B32B15/29 ,  B32B18/00 ,  C08G63/183 ,  C08G63/672

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/36 ,  B32B2270/00 ,  B32B2311/24 ,  B32B2367/00 ,  C08G63/672 ,  C08G2261/126 ,  C08J5/18 ,  C08J2367/02 ,  C08L67/02 ,  C08L67/025 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786 ,  C08L2666/18

Abstract: In order to provide a polyester film having superior impact resistance and flex pinhole resistance, and further exhibiting superior gas barrier properties after a metal or metal oxide is deposited on the film, with the inherent characteristics of polyester film maintained, such as low hygroscopicity, dimensional stability, flatness, and transparency, the polyester film comprises a mixture of 70% to 97% by weight of polyester A mainly composed of a repeating unit comprising ethylene terephthalate and 3% to 30% by weight of polyester B mainly composed of a repeating unit comprising butylene terephthalate. The polyester film has a melting point in range of 245 to 270° C. The polyester film may comprise a polyester resin containing 90% to 60% by weight of an ethylene terephthalate component, 10% to 40% by weight of a butylene terephthalate component, and 0.1% to 5% by weight of a polyoxyalkylene glycol component. The polyester film is suitably used for packaging and other applications.

Abstract translation: 为了提供具有优异的耐冲击性和抗针孔性的聚酯膜，并且在金属或金属氧化物沉积在膜上之后进一步表现出优异的阻气性，保持了聚酯膜的固有特性，例如低吸湿性，尺寸 稳定性，平整度和透明度，聚酯膜包含主要由包含对苯二甲酸乙二醇酯和3重量％至30重量％的主要由重复单元组成的聚酯B的重复单元组成的聚酯A的70重量％至97重量％的混合物 包括对苯二甲酸丁二醇酯。 聚酯薄膜的熔点范围为245〜270℃。聚酯薄膜可以包含含有对苯二甲酸乙二醇酯成分90〜60重量％的聚酯树脂，10重量％〜40重量％的对苯二甲酸丁二醇酯成分 ，和0.1〜5重量％的聚氧亚烷基二醇成分。 聚酯薄膜适用于包装和其他应用。