公开(公告)号：US20080041616A1

公开(公告)日：2008-02-21

申请号：US11508057

申请日：2006-08-21

申请人： Cheng-Hsin Chen ,  Kuang-Cheng Kao ,  Chen-Yu Yang

发明人： Cheng-Hsin Chen ,  Kuang-Cheng Kao ,  Chen-Yu Yang

IPC分类号： H05K1/16

CPC分类号： G02F1/13452 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0265 ,  H05K1/0393 ,  H05K1/112 ,  H05K3/244 ,  H05K3/361 ,  H05K2201/0326 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/10674 ,  H01L2924/00

摘要： A layout of a printed circuit board adaptive to be bonded to an integrated circuit device is introduced here. The layout includes a first metal layer, disposed in a first insulation layer and a second metal layer, disposed in a second insulation layer over the first insulation layer. The first metal layer and the second metal layer are connected to each other through a plurality of contact hole filled with conductive materials and are arranged to be substantially parallel to each other throughout a pad structure region and a line structure region of the printed circuit. The connected first metal layer and second metal layer are used for a signal path from the printed circuit board to the bonded integrated circuit device to improve driving ability of power supply.

摘要翻译： 这里介绍了适合于结合到集成电路器件的印刷电路板的布局。 布置包括设置在第一绝缘层和第二金属层上的第一金属层，设置在第一绝缘层上的第二绝缘层中。 第一金属层和第二金属层通过填充有导电材料的多个接触孔彼此连接，并且布置成在整个衬垫结构区域和印刷电路的线结构区域中彼此大致平行。 连接的第一金属层和第二金属层用于从印刷电路板到结合集成电路器件的信号路径，以提高电源的驱动能力。

公开(公告)号：US07615706B2

公开(公告)日：2009-11-10

申请号：US11508057

申请日：2006-08-21

申请人： Cheng-Hsin Chen ,  Kuang-Cheng Kao ,  Chen-Yu Yang

发明人： Cheng-Hsin Chen ,  Kuang-Cheng Kao ,  Chen-Yu Yang

IPC分类号： H05K1/16

CPC分类号： G02F1/13452 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0265 ,  H05K1/0393 ,  H05K1/112 ,  H05K3/244 ,  H05K3/361 ,  H05K2201/0326 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/10674 ,  H01L2924/00

摘要： A layout of a printed circuit board adaptive to be bonded to an integrated circuit device is introduced here. The layout includes a first metal layer, disposed in a first insulation layer and a second metal layer, disposed in a second insulation layer over the first insulation layer. The first metal layer and the second metal layer are connected to each other through a plurality of contact hole filled with conductive materials and are arranged to be substantially parallel to each other throughout a pad structure region and a line structure region of the printed circuit. The connected first metal layer and second metal layer are used for a signal path from the printed circuit board to the bonded integrated circuit device to improve driving ability of power supply.

摘要翻译： 这里介绍了适合于结合到集成电路器件的印刷电路板的布局。 布置包括设置在第一绝缘层和第二金属层上的第一金属层，设置在第一绝缘层上的第二绝缘层中。 第一金属层和第二金属层通过填充有导电材料的多个接触孔彼此连接，并且布置成在整个衬垫结构区域和印刷电路的线结构区域中彼此大致平行。 连接的第一金属层和第二金属层用于从印刷电路板到结合集成电路器件的信号路径，以提高电源的驱动能力。