公开(公告)号：US20130043120A1

公开(公告)日：2013-02-21

申请号：US13212217

申请日：2011-08-18

Applicant: Chia-Liang CHUEH ,  Kuo-Chou CHEN ,  Ren-Dou LEE ,  Hsien-Liang MENG ,  Chun-Wei LIN

Inventor： Chia-Liang CHUEH ,  Kuo-Chou CHEN ,  Ren-Dou LEE ,  Hsien-Liang MENG ,  Chun-Wei LIN

IPC: C23C14/35 ,  C23C14/14

CPC classification number: C23C14/35 ,  C23C14/3407 ,  H01J37/3405 ,  H01J37/3423 ,  H01J37/3482

Abstract: A sputtering target is provided that includes a planar backing plate and a target material formed over the planar backing plate and including an uneven sputtering surface including thick portions and thin portions and configured in conjunction with a sputtering apparatus such as a magnetron sputtering tool with a fixed magnet arrangement. The uneven surface is designed in conjunction with the magnetic fields that will be produced by the magnet arrangement such that the thicker target portions are positioned at locations where target erosion occurs at a high rate. Also provided is the magnetron sputtering system and a method for utilizing the target with uneven sputtering surface such that the thickness across the target to become more uniform in time as the target is used.

Abstract translation: 提供了一种溅射靶，其包括平面背板和形成在平面背板上的目标材料，并且包括具有厚部分和薄部分的不均匀溅射表面，并且与诸如具有固定的磁控溅射工具的溅射装置 磁铁排列。 不平坦表面与由磁体布置产生的磁场结合设计，使得较厚的目标部分位于高速率发生目标侵蚀的位置。 还提供了磁控管溅射系统以及利用不均匀溅射表面的靶的方法，使得目标物上的厚度随着靶物的时间变得更加均匀。

公开(公告)号：US06709965B1

公开(公告)日：2004-03-23

申请号：US10262923

申请日：2002-10-02

Applicant: Kuo-Chou Chen ,  Huai-Jen Hsu

Inventor： Kuo-Chou Chen ,  Huai-Jen Hsu

IPC: H01L2144

CPC classification number: H01L24/05 ,  H01L21/76804 ,  H01L24/03 ,  H01L24/11 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/05042 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A process for forming a bond pad structure to be used to accommodate a subsequent wire bond, has been developed. The process features defining a bond pad opening in a composite insulator stack, exposing a portion of a top surface of an upper level metal interconnect structure at the bottom of the bond pad opening. The bond pad opening is formed with a top portion of the composite insulator stack laterally pulled back from a bottom portion of the same composite insulator stack. The bond pad structure, comprised of aluminum—copper, is then formed entirely in the bond pad opening, with the top surface of the bond pad structure lower than the top surface of the composite insulator stack, thus resulting in a bond pad structure topography offering reduced risk of damage during subsequent pre-wire bonding procedures.

Abstract translation: 已经开发了用于形成用于适应随后的引线键合的接合焊盘结构的工艺。 该工艺特征在复合绝缘体堆叠中限定了接合焊盘开口，暴露了在接合焊盘开口底部的上部金属互连结构的顶部表面的一部分。 接合焊盘开口形成有复合绝缘体堆叠的顶部从相同复合绝缘体叠层的底部侧向拉回。 由铝 - 铜组成的接合焊盘结构完全形成在接合焊盘开口中，接合焊盘结构的顶表面比复合绝缘子堆叠的顶表面低，从而导致焊盘结构形貌的提供 降低后续预接线过程中损坏的风险。

公开(公告)号：US09127356B2

公开(公告)日：2015-09-08

申请号：US13212217

申请日：2011-08-18

Applicant: Chia-Liang Chueh ,  Kuo-Chou Chen ,  Ren-Dou Lee ,  Hsien-Liang Meng ,  Chun-Wei Lin

Inventor： Chia-Liang Chueh ,  Kuo-Chou Chen ,  Ren-Dou Lee ,  Hsien-Liang Meng ,  Chun-Wei Lin

IPC: C23C14/35 ,  C23C14/34 ,  H01J37/34

CPC classification number: C23C14/35 ,  C23C14/3407 ,  H01J37/3405 ,  H01J37/3423 ,  H01J37/3482

Abstract: A sputtering target is provided that includes a planar backing plate and a target material formed over the planar backing plate and including an uneven sputtering surface including thick portions and thin portions and configured in conjunction with a sputtering apparatus such as a magnetron sputtering tool with a fixed magnet arrangement. The uneven surface is designed in conjunction with the magnetic fields that will be produced by the magnet arrangement such that the thicker target portions are positioned at locations where target erosion occurs at a high rate. Also provided is the magnetron sputtering system and a method for utilizing the target with uneven sputtering surface such that the thickness across the target to become more uniform in time as the target is used.

Abstract translation: 提供了一种溅射靶，其包括平面背板和形成在平面背板上的目标材料，并且包括具有厚部分和薄部分的不均匀溅射表面，并且与诸如具有固定的磁控溅射工具的溅射装置 磁铁排列。 不平坦表面与由磁体布置产生的磁场结合设计，使得较厚的目标部分位于高速率发生目标侵蚀的位置。 还提供了磁控管溅射系统以及利用不均匀溅射表面的靶的方法，使得目标物上的厚度随着靶物的时间变得更加均匀。