公开(公告)号：US4604160A

公开(公告)日：1986-08-05

申请号：US689802

申请日：1985-01-08

申请人： Kanji Murakami ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Motoyo Wajima ,  Yoichi Matsuda ,  Kyoji Kawakubo ,  Minoru Kanechiku ,  Toyofusa Yoshimura ,  Makoto Matsunaga

发明人： Kanji Murakami ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Motoyo Wajima ,  Yoichi Matsuda ,  Kyoji Kawakubo ,  Minoru Kanechiku ,  Toyofusa Yoshimura ,  Makoto Matsunaga

IPC分类号： H01F41/04 ,  H05K1/00 ,  H05K1/16 ,  H05K3/20 ,  C23F1/02 ,  B05D5/12 ,  B44C1/22 ,  C25D5/02

CPC分类号： H05K1/165 ,  H01F41/042 ,  H05K3/205 ,  H01L2221/68345 ,  H05K1/0393 ,  H05K2201/09881 ,  H05K2203/0152 ,  H05K2203/0726 ,  Y10T29/49155

摘要： This invention concerns a method for the manufacture of a printed wiring board which particularly proves useful as a printed coil. This method is characterized by the fact that in the work in process which has undergone the step for formation of a conductor circuit and which has not undergone the step for separation of a plating resist, the plating resist and other insulating substratal material are separated for transfer from the surface of the substrate having the conductor circuit formed thereon.Since this method permits formation of an extremely thin insulating layer and a conductor circuit layer thicker than the insulating layer, it enables production of very thin printed wiring board and printed coil having high circuit density in the surfaces of component layers as well as in the direction of superposition of component layers.

摘要翻译： 本发明涉及一种特别证明可用作印刷线圈的印刷线路板的制造方法。 该方法的特征在于，在已经经历了形成导体电路的步骤的工作中，没有经历电镀抗蚀剂分离的步骤，电镀抗蚀剂和其它绝缘底材分离用于转印 从其上形成有导体电路的基板的表面。 由于该方法可以形成非常薄的绝缘层和比绝缘层更厚的导体电路层，所以能够在部件层表面和方向上制造非常薄的印刷线路板和具有高电路密度的印刷线圈 的组件层的叠加。