公开(公告)号：USD543023S1

公开(公告)日：2007-05-22

申请号：US29262250

申请日：2006-06-29

Applicant: Kyung-Jin Han ,  Hye-Jeong Lee ,  Nam-Mi Kim ,  Chang-Hwan Hwang

Designer： Kyung-Jin Han ,  Hye-Jeong Lee ,  Nam-Mi Kim ,  Chang-Hwan Hwang

公开(公告)号：USD558177S1

公开(公告)日：2007-12-25

申请号：US29268121

申请日：2006-10-31

Applicant: Kyung-Jin Han ,  Jin-Soo Kim ,  Nam-Mi Kim ,  Chang-Hwan Hwang

Designer： Kyung-Jin Han ,  Jin-Soo Kim ,  Nam-Mi Kim ,  Chang-Hwan Hwang

公开(公告)号：USD576599S1

公开(公告)日：2008-09-09

申请号：US29292314

申请日：2007-10-05

Applicant: Kyung Jin Han ,  Nam Mi Kim ,  Chang Soo Lee

Designer： Kyung Jin Han ,  Nam Mi Kim ,  Chang Soo Lee

公开(公告)号：US08929091B2

公开(公告)日：2015-01-06

申请号：US13067131

申请日：2011-05-11

Applicant: Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

Inventor： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC: H05K1/16 ,  H01L23/538 ,  H01L23/13 ,  H01L23/00 ,  H05K1/18

CPC classification number: H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

Abstract: A method of manufacturing a printed circuit board (PCB) having an embedded bare chip includes attaching a tape to one side of an insulated substrate having a penetration hole formed therein, and attaching the bare chip onto the tape inside the penetration hole such that electrode pads of the bare chip face the tape; filling up the penetration hole with a filler, and removing the tape; laminating a metal layer onto a surface of the filler and the insulated substrate from which the tape is removed; and forming electrode bumps by removing portions of the metal layer. The forming of electrode bumps further includes simultaneously removing portions of the metal layer and forming an circuit pattern on one side of the insulated substrate. The circuit pattern is formed directly on the upper side of the insulated substrate and the electrode bumps are formed on the surface of the electrode pads.

Abstract translation: 一种制造具有嵌入式裸芯片的印刷电路板（PCB）的方法包括：将带粘附到具有形成在其中的穿透孔的绝缘基板的一侧，并将裸芯片附接到穿透孔内的带上，使得电极焊盘 的裸片面对磁带; 用填料填充贯通孔，取出胶带; 将金属层层压到填料的表面上以及除去带的绝缘基板; 以及通过去除金属层的部分形成电极凸块。 电极凸块的形成还包括同时去除金属层的部分并在绝缘基板的一侧上形成电路图案。 电路图案直接形成在绝缘基板的上侧，并且电极凸块形成在电极焊盘的表面上。

公开(公告)号：US08184448B2

公开(公告)日：2012-05-22

申请号：US11703814

申请日：2007-02-08

Applicant: Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

Inventor： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC: H05K1/16

CPC classification number: H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

Abstract: A PCB having an embedded bare chip includes an insulated substrate having a penetration hole formed therein; a filler filling up an inside of the penetration hole; a bare chip embedded in the filler such that electrode pads formed on one side thereof are exposed at the surface of the filler; and an electrode bump attached to a surface of the electrode pads and protruded to be exposed to the outside.

Abstract translation: 具有嵌入式裸芯片的PCB包括其中形成有穿透孔的绝缘基板; 填充物穿透孔内部的填充物; 嵌入填料中的裸芯片，使得在其一侧形成的电极焊盘在填料的表面露出; 以及附着到电极焊盘的表面并突出以暴露于外部的电极凸块。

公开(公告)号：US20110277320A1

公开(公告)日：2011-11-17

申请号：US13067131

申请日：2011-05-11

Applicant: Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

Inventor： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC: H05K3/30

CPC classification number: H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

Abstract: A method of manufacturing a PCB that includes embedding a bare chip in a board such that electrode pads of the bare chip are exposed, and forming electrode bumps on the electrode pads.

Abstract translation: 一种制造PCB的方法，包括将裸芯片嵌入板中，使得裸芯片的电极焊盘露出，并在电极焊盘上形成电极凸块。

公开(公告)号：US20070181988A1

公开(公告)日：2007-08-09

申请号：US11703814

申请日：2007-02-08

Applicant: Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

Inventor： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

Abstract: A PCB having an embedded bare chip and a manufacturing method thereof are disclosed. A method of manufacturing a PCB may include embedding a bare chip in a board such that electrode pads of the bare chip are exposed, and forming electrode bumps on the electrode pads. In this way, the mass production system of a bare chip embedded PCB can be made to have a simplified process and low cost.

Abstract translation: 公开了具有嵌入式裸芯片的PCB及其制造方法。 制造PCB的方法可以包括将裸芯片嵌入板中，使得裸芯片的电极焊盘露出，并在电极焊盘上形成电极凸块。 这样，裸芯片嵌入式PCB的批量生产系统可以简化工艺，成本低廉。