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    Printed circuit board having inner via hole and manufacturing method thereof
    4.
    发明申请
    Printed circuit board having inner via hole and manufacturing method thereof 审中-公开
    具有内通孔的印刷电路板及其制造方法

    公开(公告)号：US20070199735A1

    公开(公告)日：2007-08-30

    申请号：US11709758

    申请日：2007-02-23

    申请人： Chi-Seong Kim ,  Hyo-Seung Nam ,  Seok-Hwan Ahn ,  Kwang-Ok Jeong ,  Kyung-Hwan Ko

    发明人： Chi-Seong Kim ,  Hyo-Seung Nam ,  Seok-Hwan Ahn ,  Kwang-Ok Jeong ,  Kyung-Hwan Ko

    IPC分类号： H05K1/03

    CPC分类号： H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155

    摘要： An aspect of the present invention features a printed circuit board. The board can comprise a core layer in which an inner via hole (IVH) is formed, a first plating layer that closes one entrance of the inner via hole, leaving a remaining space in the inner via hole unfilled; and a second plating layer that closes the other entrance of the inner via hole, filling the remaining space. Also, the present invention provides a printed circuit board and a manufacturing method thereof that do not require filling an inner via hole with an insulating ink, and forming a conductive layer on the insulating ink. Therefore, the present invention can increase productive capacity and reduce manufacturing cost by simplifying the manufacturing process and reducing the lead time.

    摘要翻译： 本发明的一个方面的特征在于印刷电路板。 板可以包括其中形成内通孔（IVH）的芯层，封闭内通孔的一个入口的第一镀层，在未填充的内通孔中留下剩余空间; 以及第二镀层，其封闭所述内通孔的另一个入口，填充剩余空间。 另外，本发明提供一种印刷电路板及其制造方法，其不需要用绝缘油墨填充内部通孔，并在绝缘油墨上形成导电层。 因此，本发明可以通过简化制造过程并缩短交货时间来提高生产能力并降低制造成本。

    Method for manufacturing package on package with cavity
    6.
    发明申请
    Method for manufacturing package on package with cavity 审中-公开
    封装封装封装方法

    公开(公告)号：US20100006446A1

    公开(公告)日：2010-01-14

    申请号：US12585568

    申请日：2009-09-17

    申请人： Chi-Seong Kim ,  Hyo-Seung Nam ,  Seok-Hwan Ahn ,  Kwang-Ok Jeong ,  Kyung-Hwan Ko

    发明人： Chi-Seong Kim ,  Hyo-Seung Nam ,  Seok-Hwan Ahn ,  Kwang-Ok Jeong ,  Kyung-Hwan Ko

    IPC分类号： H05K3/00

    CPC分类号： H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155

    摘要： A method for manufacturing a printed circuit board with an inner via hole, the method including applying a first current to both surfaces of a core layer having the inner via hole, so that a first plating layer grows centerwardly in an equal rate from all the directions of an inner wall of the inner via hole to close one entrance of the inner via hole, leaving a remaining space the inner via hole unfilled; and applying a second current to fill the remaining space of the inner via hole. Also, the manufacturing method does not require filling an inner via hole with an insulating ink, and forming a conductive layer on the insulating ink. Therefore, the method increases productive capacity and reduces manufacturing cost by simplifying the manufacturing process and reducing the lead time.

    摘要翻译： 一种用于制造具有内通孔的印刷电路板的方法，所述方法包括向具有所述内通孔的芯层的两个表面施加第一电流，使得第一镀层从所有方向以相等的速度向中心生长 的内通孔的内壁以封闭内通孔的一个入口，留下未填充的内通孔的剩余空间; 以及施加第二电流以填充所述内部通孔的剩余空间。 此外，制造方法不需要用绝缘油墨填充内部通孔，并且在绝缘油墨上形成导电层。 因此，该方法通过简化制造过程并缩短交货时间来提高生产能力并降低制造成本。

    Aggregate power measurement
    7.
    发明授权
    Aggregate power measurement 有权
    总体功率测量

    公开(公告)号：US07085580B1

    公开(公告)日：2006-08-01

    申请号：US09385725

    申请日：1999-08-30

    申请人： Edward Ellis Eibling ,  Kyung Hwan Ko ,  Lily Zhu

    发明人： Edward Ellis Eibling ,  Kyung Hwan Ko ,  Lily Zhu

    IPC分类号： H04Q7/20

    CPC分类号： H04W52/24 ,  H04W52/267 ,  H04W52/34 ,  H04W52/40 ,  H04W52/50

    摘要： The power level of at least one forward-link signal is determined for a measurement interval, where the measurement interval has a duration smaller than or equal to the time period in which at least one power-indicative signal characteristic can change. For example, a power-indicative signal characteristic used can be the information rate of the signal, which can change once per frame. In this case the measurement interval would be smaller than or equal to a frame. Preferably, the measurement interval is smaller than the time period in which any of the power-indicative signal characteristics can change. The power level of the signal is based on the signal's power-indicative signal characteristics during the measurement interval. In one embodiment of the invention, the signal's power-indicative signal characteristics include the information rate, and the gain of the signal. The power-indicative signal characteristics can also include whether the information contained in a traffic signal is control information or voice and/or data information, whether the signal is setting up a call or is part of an established call, and whether the call is in a soft handoff. Each forward-link signal is a part of a signal set. The signal set can include: all or some of the signals corresponding to a sector of the cell containing the base station; or all or some of the signals amplified by the base station's amplifier. The power level of each signal that is in the signal set is summed to obtain the power level of the signal set.

    摘要翻译： 对于测量间隔确定至少一个前向链路信号的功率电平，其中测量间隔具有小于或等于至少一个功率指示信号特性可以改变的时间段的持续时间。 例如，所使用的功率指示信号特性可以是信号的信息速率，其可以每帧改变一次。 在这种情况下，测量间隔将小于或等于一帧。 优选地，测量间隔小于任何功率指示信号特性可以改变的时间段。 信号的功率电平基于信号在测量间隔期间的功率指示信号特性。 在本发明的一个实施例中，信号的功率指示信号特征包括信息速率和信号的增益。 功率指示信号特征还可以包括业务信号中包含的信息是控制信息还是语音和/或数据信息，信号是建立呼叫还是建立呼叫的一部分，以及呼叫是否在 软切换。 每个前向链路信号是信号组的一部分。 该信号组可以包括：对应于包含基站的小区的扇区的全部或一些信号; 或由基站的放大器放大的全部或一些信号。 将信号集中的每个信号的功率电平相加以获得信号组的功率电平。