公开(公告)号：US07541275B2

公开(公告)日：2009-06-02

申请号：US10828592

申请日：2004-04-21

申请人： Betty Shu Mercer ,  Erika Leigh Shoemaker ,  Byron Lovell Williams ,  Laurinda W. Ng ,  Alec J. Morton ,  C. Matthew Thompson

发明人： Betty Shu Mercer ,  Erika Leigh Shoemaker ,  Byron Lovell Williams ,  Laurinda W. Ng ,  Alec J. Morton ,  C. Matthew Thompson

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L2224/039 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05005 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/0518 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2224/05552 ,  H01L2924/00014 ,  H01L2924/013

摘要： The present invention provides an interconnect for use in an integrated circuit, a method for manufacturing the interconnect, and a method for manufacturing an integrated circuit including the interconnect. The interconnect (100), among other elements, includes a surface conductive lead (160) located in an opening formed within a protective overcoat (110), and a barrier layer (140) located between the protective overcoat (110) and the surface conductive lead (160), a portion of the barrier layer (140) forming a skirt (145) that extends outside a footprint of the surface conductive lead (160).

摘要翻译： 本发明提供了一种用于集成电路的互连，一种用于制造该互连的方法，以及一种用于制造包括该互连的集成电路的方法。 除了其它元件之外，互连（100）包括位于形成在保护外涂层（110）内的开口中的表面导电引线（160）和位于保护外涂层（110）和表面导电 导线（160），阻挡层（140）的形成裙部（145）的部分延伸到表面导电引线（160）的覆盖区外部。

公开(公告)号：US06657832B2

公开(公告)日：2003-12-02

申请号：US09843395

申请日：2001-04-26

申请人： Bryon L. Williams ,  Laurinda W. Ng ,  Darius L. Crenshaw ,  Jose L. Melendez

发明人： Bryon L. Williams ,  Laurinda W. Ng ,  Darius L. Crenshaw ,  Jose L. Melendez

IPC分类号： H01G212

CPC分类号： H01H59/0009 ,  H01G5/16 ,  H01H2059/0072

摘要： The present invention includes an integrated circuit switch including a membrane supported over a first conductor on a substrate, a conductive region on the membrane and connecting to the first conductor on the substrate, a pulldown electrode on the substrate and under the membrane and a pillar to support the membrane after the pulldown threshold has been reached. A voltage greater than a pulldown threshold is applied between the membrane and the pulldown electrode will pull the membrane down to make a capacitive coupling to the first conductor. The addition of the pillars increases the upward restoring force when the activation voltage is removed.