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公开(公告)号：US09048274B2
公开(公告)日：2015-06-02
申请号：US12329664
申请日：2008-12-08
Applicant: Wei-Cheng Wang , Feng-Ning Lee , Chi-Feng Tung , Mao-Lin Kao , Li-Jen Ko
Inventor： Wei-Cheng Wang , Feng-Ning Lee , Chi-Feng Tung , Mao-Lin Kao , Li-Jen Ko
IPC: H01L21/677
CPC classification number: H01L21/67775 , H01L21/67766
Abstract: A system comprising a conveyor. A semiconductor processing tool has a lifter port. The tool is positioned near the conveyor, such that the lifter port is configured to transport a Front Opening Unified Pod (FOUP) between the conveyor and the lifter port. An upstream stocker and a downstream stocker are both co-located with the conveyor and the tool. The upstream and downstream stockers each have a respective storage space for the FOUP and a respective robotic device configured to transport the FOUP between its respective storage space and the conveyor. The upstream stocker is configured to receive the FOUP from an overhead transport (OHT) and deliver the FOUP to the conveyor. The downstream stocker is configured to receive the FOUP from the conveyor and deliver the FOUP to the OHT.
Abstract translation: 一种包括输送机的系统。 半导体处理工具具有升降器端口。 该工具位于输送机附近，使得升降器端口构造成在输送机和升降器端口之间输送前开口统一荚（FOUP）。 上游储料器和下游储料器与输送机和工具共处。 上游和下游储存器各自具有用于FOUP的相应存储空间以及被配置为在其各自的存储空间和输送机之间运输FOUP的相应机器人装置。 上游储料器被配置为从架空运输（OHT）接收FOUP并将FOUP输送到输送机。 下游储料器配置为从输送机接收FOUP，并将FOUP运送到OHT。
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Patent Agency Ranking
2.发明申请公开(公告)号：US20140086720A1
公开(公告)日：2014-03-27
申请号：US13629498
申请日：2012-09-27
Applicant: Mao-Lin KAO , Hsu-Shui Liu , Tien-Chen Hu , Li-Jen Ko , Hsiang-Yin Shen , Jiun-Rong Pai
Inventor： Mao-Lin KAO , Hsu-Shui Liu , Tien-Chen Hu , Li-Jen Ko , Hsiang-Yin Shen , Jiun-Rong Pai
IPC: H01L21/677 , H01L21/203 , H01L21/306
CPC classification number: H01L21/67184 , H01L21/67161 , H01L21/67167 , H01L21/67201 , H01L21/68707
Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.
Abstract translation: 提供半导体处理站。 半导体处理站包括第一平台，第二平台和真空隧道，其中第一平台具有第一负载锁和第一多个室，并且第二平台具有第二负载锁和第二多个室，以及 真空隧道连接第一和第二加载锁。
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公开(公告)号：US07789576B2
公开(公告)日：2010-09-07
申请号：US11740129
申请日：2007-04-25
Applicant: Feng-Ning Lee , Yung-Cheng Chen , Yao-Hwan Kao , Li-Jen Ko , Chin-Hsiang Lin
Inventor： Feng-Ning Lee , Yung-Cheng Chen , Yao-Hwan Kao , Li-Jen Ko , Chin-Hsiang Lin
CPC classification number: G03F7/70991 , H01L21/67225 , H01L21/67748
Abstract: The present disclosure provides a lithography apparatus. The apparatus includes an exposure module designed for exposure processing; a baking module embedded in the exposure module and designed for post exposure baking (PEB); and a control module designed to control the exposure module and the baking module.
Abstract translation: 本公开提供一种光刻设备。 该装置包括设计用于曝光处理的曝光模块; 嵌入曝光模块中的烘烤模块，用于后曝光烘烤（PEB）; 以及设计用于控制曝光模块和烘焙模块的控制模块。
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公开(公告)号：US20100143082A1
公开(公告)日：2010-06-10
申请号：US12329664
申请日：2008-12-08
Applicant: Wei-Cheng Wang , Feng-Ning Lee , Chi-Feng Tung , Mao-Lin Kao , Li-Jen Ko
Inventor： Wei-Cheng Wang , Feng-Ning Lee , Chi-Feng Tung , Mao-Lin Kao , Li-Jen Ko
IPC: H01L21/677
CPC classification number: H01L21/67775 , H01L21/67766
Abstract: A system comprising a conveyor. A semiconductor processing tool has a lifter port. The tool is positioned near the conveyor, such that the lifter port is configured to transport a Front Opening Unified Pod (FOUP) between the conveyor and the lifter port. An upstream stocker and a downstream stocker are both co-located with the conveyor and the tool. The upstream and downstream stockers each have a respective storage space for the FOUP and a respective robotic device configured to transport the FOUP between its respective storage space and the conveyor. The upstream stocker is configured to receive the FOUP from an overhead transport (OHT) and deliver the FOUP to the conveyor. The downstream stocker is configured to receive the FOUP from the conveyor and deliver the FOUP to the OHT.
Abstract translation: 一种包括输送机的系统。 半导体处理工具具有升降器端口。 该工具位于输送机附近，使得升降器端口构造成在输送机和升降器端口之间输送前开口统一荚（FOUP）。 上游储料器和下游储料器与输送机和工具共处。 上游和下游储存器各自具有用于FOUP的相应存储空间以及被配置为在其各自的存储空间和输送机之间运输FOUP的相应机器人装置。 上游储料器被配置为从架空运输（OHT）接收FOUP并将FOUP输送到输送机。 下游储料器配置为从输送机接收FOUP，并将FOUP运送到OHT。
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5.发明授权公开(公告)号：US09558974B2
公开(公告)日：2017-01-31
申请号：US13629498
申请日：2012-09-27
Applicant: Mao-Lin Kao , Hsu-Shui Liu , Tien-Chen Hu , Li-Jen Ko , Hsiang-Yin Shen , Jiun-Rong Pai
Inventor： Mao-Lin Kao , Hsu-Shui Liu , Tien-Chen Hu , Li-Jen Ko , Hsiang-Yin Shen , Jiun-Rong Pai
IPC: H01L21/677 , H01L21/67
CPC classification number: H01L21/67184 , H01L21/67161 , H01L21/67167 , H01L21/67201 , H01L21/68707
Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.
Abstract translation: 提供半导体处理站。 半导体处理站包括第一平台，第二平台和真空隧道，其中第一平台具有第一负载锁和第一多个室，并且第二平台具有第二负载锁和第二多个室，以及 真空隧道连接第一和第二加载锁。
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公开(公告)号：US20080241760A1
公开(公告)日：2008-10-02
申请号：US11740129
申请日：2007-04-25
Applicant: Feng-Ning Lee , Yung-Cheng Chen , Yao-Hwan Kao , Li-Jen Ko , Chin-Hsiang Lin
Inventor： Feng-Ning Lee , Yung-Cheng Chen , Yao-Hwan Kao , Li-Jen Ko , Chin-Hsiang Lin
IPC: G03C5/00
CPC classification number: G03F7/70991 , H01L21/67225 , H01L21/67748
Abstract: The present disclosure provides a lithography apparatus. The apparatus includes an exposure module designed for exposure processing; a baking module embedded in the exposure module and designed for post exposure baking (PEB); and a control module designed to control the exposure module and the baking module.
Abstract translation: 本公开提供一种光刻设备。 该装置包括设计用于曝光处理的曝光模块; 嵌入曝光模块中的烘烤模块，用于后曝光烘烤（PEB）; 以及设计用于控制曝光模块和烘焙模块的控制模块。
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