摘要:
A planar lightwave circuit has a waveguide having a bend and plurality of multiple trenches with parallel front and back interfaces. The trench and waveguide refractive indexes are different such that a refractive interface is defined between the waveguide and the trench. The trench may include a material of higher refractive index than the waveguide, such as silicon, or alternatively a material having a lower refractive index than the waveguide, such as an air void. The trench is disposed on the waveguide bend such that the front and back planar interfaces have an angle of incidence to a direction of the lightwave propagation from the waveguide. The invention also includes beamsplitters that include trenches that reflect a portion of a lightwave in a first direction and a portion of a lightwave in a second direction.
摘要:
A method of fabricating a semiconductor device wherein there is provided a semiconductor substrate of a first conductivity type. A dopant is implanted in one region of the substrate of opposite conductivity type and that region is masked, preferably with a silicon oxide mask. A relatively heavy dose of a dopant of the first conductivity type is implanted in a different region of the substrate while retaining the mask on the region of the substrate doped with dopant of the opposite conductivity type. The two implants are driven farther into the substrate to form a first tank of said first conductivity type and a second tank of opposite conductivity type by an annealing step while retaining the mask on the region of the substrate doped with dopant of the opposite conductivity type. A second implant of the first conductivity type is then implanted into the tank of first conductivity type while retaining the mask on the region of the substrate doped with dopant of the opposite conductivity type. Fabrication of the device is then completed in standard manner except that there is no Vtn, pattern and there are no Vtn implants. The second implant of the first conductivity type has a lower dosage then the prior implant of first conductivity type. The higher dosage implant of the first conductivity type is provided to set the depth of the tank and is from about 6×1012/cm2 to about 1.9×1013/cm2. The lower dosage implant of the first conductivity type is from about 1×1012/cm2 to about 8×1012/cm2.
摘要翻译:一种制造半导体器件的方法,其中提供了第一导电类型的半导体衬底。 将掺杂剂注入到具有相反导电类型的衬底的一个区域中,并且该区域被掩蔽,优选地使用氧化硅掩模。 将相对大量的第一导电类型的掺杂剂注入到衬底的不同区域中,同时将掩模保持在掺杂有相反导电类型的掺杂剂的衬底的区域上。 通过退火步骤将两个植入物进一步驱动到衬底中以形成具有所述第一导电类型的第一罐和具有相反导电类型的第二罐,同时将掩模保持在掺杂有相反导电类型的掺杂剂的衬底的区域上。 然后将第一导电类型的第二植入物注入到第一导电类型的槽中,同时将掩模保持在掺杂有相反导电类型的掺杂剂的衬底的区域上。 然后以标准方式完成装置的制造,除了没有Vtn,图案和没有Vtn植入物。 第一种导电类型的第二植入物具有较低的剂量,然后是先前的第一导电类型的植入。 提供第一导电类型的较高剂量植入物以设定罐的深度,并且为约6×10 12 / cm 2至约1.9×10 13 / cm 2。 第一导电类型的较低剂量植入物为约1×10 12 / cm 2至约8×10 12 / cm 2。
摘要:
Adjusting digital images for parallax includes receiving (401) a digital image of an object on a platform from a camera positioned over the platform and adjusting (402) a magnification of a top surface of the object in the digital image based on a height of the object.
摘要:
One or more passivation layers are added to the end of a semiconductor process flow to provide additional protection for devices (e.g., transistors) formed during the process. An additional layer is then formed and/or an anneal is performed to mitigate threshold voltage shifting that may be induced by the passivation layers. Mitigation of threshold voltage shifting increases the life expectancy of devices (e.g., transistors) formed during the process, which in turn mitigates yield loss by facilitating predictable or otherwise desirable behavior of the devices (e.g., transistors).
摘要:
Method for dynamically compensating probe tip misalignment with a semiconductor wafer. The wafer is located on a handler and the wafer is adjusted to a first temperature. Probe tips of an inspection system are moved to a first position centered above pads of a test module on the wafer. The first position is recorded in a memory of the inspection system at the first temperature. The wafer and the probe tips are adjusted to a second temperature while the wafer remains in the inspection system. A second position of the probe tips is recorded in the memory while the probe tips and the wafer are equilibrated at the second temperature. A difference between the first and second position is calculated. Relative positions of the probe tips or the wafer is compensated based on the calculated difference, such that the probe tips are re-centered above the pads at the second temperature.
摘要:
Method for dynamically compensating probe tip misalignment with a semiconductor wafer. The wafer is located on a handler and the wafer is adjusted to a first temperature. Probe tips of an inspection system are moved to a first position centered above pads of a test module on the wafer. The first position is recorded in a memory of the inspection system at the first temperature. The wafer and the probe tips are adjusted to a second temperature while the wafer remains in the inspection system. A second position of the probe tips is recorded in the memory while the probe tips and the wafer are equilibrated at the second temperature. A difference between the first and second position is calculated. Relative positions of the probe tips or the wafer is compensated based on the calculated difference, such that the probe tips are re-centered above the pads at the second temperature.
摘要:
A planar lightwave circuit has a waveguide having a bend and plurality of multiple trenches with parallel front and back interfaces. The trench and waveguide refractive indexes are different such that a refractive interface is defined between the waveguide and the trench. The trench may include a material of higher refractive index than the waveguide, such as silicon, or alternatively a material having a lower refractive index than the waveguide, such as an air void. The trench is disposed on the waveguide bend such that the front and back planar interfaces have an angle of incidence to a direction of the lightwave propagation from the waveguide. The invention also includes beamsplitters that include trenches that reflect a portion of a lightwave in a first direction and a portion of a lightwave in a second direction.