公开(公告)号：US5566441A

公开(公告)日：1996-10-22

申请号：US209046

申请日：1994-03-11

Applicant: Michael J. C. Marsh ,  Mark H. Carson ,  Gideon J. Gouws ,  Mario A. Marais ,  Trevor M. Hodson

Inventor： Michael J. C. Marsh ,  Mark H. Carson ,  Gideon J. Gouws ,  Mario A. Marais ,  Trevor M. Hodson

IPC: H01Q13/00 ,  B31B1/90 ,  B65D5/42 ,  B65D5/52 ,  B65D51/24 ,  G06K19/07 ,  G06K19/077 ,  H01L21/58 ,  H01L21/60 ,  H01L23/538 ,  H05K3/20 ,  H05K3/28 ,  H05K3/32 ,  H01P11/00

CPC classification number: H01L24/32 ,  B65D5/4233 ,  B65D5/528 ,  B65D51/245 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07771 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/86 ,  B31B2201/90 ,  B65D2203/10 ,  B65D2211/00 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  Y10S428/901 ,  Y10T29/49016 ,  Y10T29/49144

Abstract: Integrated circuits such as transponders are attached to a substrate such as cardboard packaging material by adhering an integrated circuit in the substrate, applying a patch antenna to the substrate and the integrated circuit, and applying a sealing layer over the integrated circuit and at least a portion of the antenna. In variations of the method, an indentation may be formed in the substrate into which the integrated circuit is placed. The patch antenna may be screen printed onto the substrate and the integrated circuit, using conductive ink, or may be a metallic foil which is applied to the substrate and the integrated circuit. Where the integrated circuit is a transponder, it can be programmed with an identification code, either before or after being attached to the substrate.

Abstract translation: 诸如应答器之类的集成电路通过将集成电路粘附在基板中而附着到诸如纸板包装材料的基板上，将贴片天线施加于基板和集成电路，并在该集成电路上施加密封层，并且至少部分 的天线。 在该方法的变型中，可以在放置集成电路的衬底中形成凹陷。 可以使用导电油墨将贴片天线丝网印刷到基板和集成电路上，或者可以是施加到基板和集成电路的金属箔。 在集成电路是应答器的情况下，可以在附着到基板之前或之后使用识别码进行编程。