公开(公告)号：US5526228A

公开(公告)日：1996-06-11

申请号：US298631

申请日：1994-08-31

申请人： Russell E. Dickson ,  John T. Gullicksrud ,  David W. Hill ,  Tim K. Murphy ,  Michael D. O'Connell ,  Mark M. Thornton

发明人： Russell E. Dickson ,  John T. Gullicksrud ,  David W. Hill ,  Tim K. Murphy ,  Michael D. O'Connell ,  Mark M. Thornton

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： G06F1/20

摘要： A computer system unit which includes an acoustic dampening cooling fan shroud panel mounted on a rear surface thereof. The computer system unit is generally rectangular, encloses an electronic component package and includes a front panel and a pair of generally parallel side panels. An intermediate rear panel, generally parallel to the front panel, mounts one or more cooling fans which draw air through the generally rectangular unit. A cooling fan shroud panel which includes an acoustic noise reduction lining is then mounted to the intermediate rear panel. The cooling fan shroud panel includes an aperture for ventilation which is displaced from the mounting position of the cooling fans such that acoustic noise resultant from cooling fan operation is minimized. The aperture within the cooling fan shroud panel extends into at least one surface thereof which is not parallel to either the side panel or the intermediate rear panel wherein ventilation is substantially unobstructed by adjacent vertical surfaces.

摘要翻译： 一种计算机系统单元，其包括安装在其后表面上的隔音冷却风扇护罩面板。 计算机系统单元通常是矩形的，包围电子部件封装并且包括前面板和一对大致平行的侧面板。 大致平行于前面板的中间后面板安装一个或多个冷却风扇，其将空气抽吸通过大体上矩形的单元。 然后将包括声学降噪衬里的冷却风扇护罩板安装到中间后面板。 冷却风扇罩面板包括一个通风孔，该孔从冷却风扇的安装位置移位，使冷却风扇运行产生的声音噪声最小化。 冷却风扇护罩板内的孔径延伸到至少一个不与侧板或中间后板平行的表面，其中通风基本上不被相邻的垂直表面阻挡。

公开(公告)号：US20100185410A1

公开(公告)日：2010-07-22

申请号：US12354958

申请日：2009-01-16

申请人： GERALD K. BARTLEY ,  CHARLES L. JOHNSON ,  MARK M. THORNTON ,  PATRICK R. VAREKAMP

发明人： GERALD K. BARTLEY ,  CHARLES L. JOHNSON ,  MARK M. THORNTON ,  PATRICK R. VAREKAMP

IPC分类号： G06F19/00 ,  H01L21/66 ,  H01L23/58

CPC分类号： G06F19/00 ,  H01L22/14 ,  H01L22/20 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06596 ,  H01L2924/0002 ,  H01L2924/00

摘要： A three-dimensional (3D) chip is fabricated from components that have been cut out of a two-dimensional (2D) chip to create the layers of the 3D chip. By testing the 2D chip first, the layers of the 3D chip have been pre-tested, thus reducing testing and production costs.

摘要翻译： 三维（3D）芯片由已经从二维（2D）芯片切出的部件制造以产生3D芯片的层。 首先通过测试2D芯片，3D芯片的层已经过预先测试，从而降低了测试和生产成本。

公开(公告)号：US08140297B2

公开(公告)日：2012-03-20

申请号：US12354958

申请日：2009-01-16

申请人： Gerald K. Bartley ,  Charles L. Johnson ,  Mark M. Thornton ,  Patrick R. Varekamp

发明人： Gerald K. Bartley ,  Charles L. Johnson ,  Mark M. Thornton ,  Patrick R. Varekamp

IPC分类号： G06F11/22 ,  G06F11/00 ,  G06F11/30 ,  G01R31/26 ,  G01R31/00 ,  G01R31/02 ,  G01D21/00

CPC分类号： G06F19/00 ,  H01L22/14 ,  H01L22/20 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06596 ,  H01L2924/0002 ,  H01L2924/00

摘要： A three-dimensional (3D) chip is fabricated from components that have been cut out of a two-dimensional (2D) chip. The components from the 2D chip are layered and coupled to create the layers of the 3D chip. By testing the 2D chip first, the layers of the 3D chip have been pre-tested, thus reducing testing and production costs.

摘要翻译： 三维（3D）芯片由已经从二维（2D）芯片切出的部件制成。 来自2D芯片的组件被分层和耦合以产生3D芯片的层。 首先通过测试2D芯片，3D芯片的层已经过预先测试，从而降低了测试和生产成本。