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公开(公告)号：US20050046928A1
公开(公告)日：2005-03-03
申请号：US10898537
申请日：2004-07-23
申请人： William Bischel , David Wagner , Harald Guenther , Simon Field , Markus Hehlen , Richard Tompane , Andrew Ryan , C. Fanning , Jim Li , Nina Morozova
发明人： William Bischel , David Wagner , Harald Guenther , Simon Field , Markus Hehlen , Richard Tompane , Andrew Ryan , C. Fanning , Jim Li , Nina Morozova
CPC分类号： H01S5/02252 , G02B6/30 , G02B6/305 , G02B6/362 , G02B6/3636 , G02B6/3652 , G02B6/3692 , G02B6/4201 , G02B6/4202 , G02B6/4204 , G02B6/4224 , G02B6/4225 , G02B6/423 , G02B6/4232 , G02B6/4243 , G02B6/4249 , G02B6/4265 , G02B6/4267 , G02B6/4286 , G02B6/4287 , G02B2006/12195 , H01L2224/48091 , H01S3/09415 , H01S5/02284 , H01S5/141 , H01S5/146 , H01S5/4012 , H01S5/4062 , Y10T156/1028 , Y10T156/1089 , Y10T156/109 , Y10T156/1092 , Y10T156/1093 , H01L2924/00014
摘要： An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
摘要翻译： 诸如用于EDFA的多输出二极管激光泵源的光学组件通过将光学阵列发射器芯片压靠在从基座突出的支架结构上而形成，使得发射极芯片变形以匹配支座结构的曲率。 IO芯片也与隔离结构并置，使得其光接收器可以从发射器芯片接收光能。 IO芯片可以提供各种光学功能，然后提供用于耦合到光纤阵列中的光学阵列输出。 隔离结构优选地在比发射器芯片与基座重叠的区域小得多的聚集接触区域上接触发射极芯片。 用于将发射极芯片和IO芯片连接到基座的材料设置在支座之间的凹槽中，而不是在支架结构的接触表面上。
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公开(公告)号：US20070248139A1
公开(公告)日：2007-10-25
申请号：US11768150
申请日：2007-06-25
申请人： William Bischel , David Wagner , Harald Guenther , Simon Field , Markus Hehlen , Richard Tompane , Andrew Ryan , C. Fanning , Jim Li , Nina Morozova
发明人： William Bischel , David Wagner , Harald Guenther , Simon Field , Markus Hehlen , Richard Tompane , Andrew Ryan , C. Fanning , Jim Li , Nina Morozova
IPC分类号： H01S3/091
CPC分类号： H01S5/02252 , G02B6/30 , G02B6/305 , G02B6/362 , G02B6/3636 , G02B6/3652 , G02B6/3692 , G02B6/4201 , G02B6/4202 , G02B6/4204 , G02B6/4224 , G02B6/4225 , G02B6/423 , G02B6/4232 , G02B6/4243 , G02B6/4249 , G02B6/4265 , G02B6/4267 , G02B6/4286 , G02B6/4287 , G02B2006/12195 , H01L2224/48091 , H01S3/09415 , H01S5/02284 , H01S5/141 , H01S5/146 , H01S5/4012 , H01S5/4062 , Y10T156/1028 , Y10T156/1089 , Y10T156/109 , Y10T156/1092 , Y10T156/1093 , H01L2924/00014
摘要： An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
摘要翻译： 诸如用于EDFA的多输出二极管激光泵源的光学组件通过将光学阵列发射器芯片压靠在从基座突出的支架结构上而形成，使得发射极芯片变形以匹配支座结构的曲率。 IO芯片也与隔离结构并置，使得其光接收器可以从发射器芯片接收光能。 IO芯片可以提供各种光学功能，然后提供用于耦合到光纤阵列中的光学阵列输出。 隔离结构优选地在比发射器芯片与基座重叠的区域小得多的聚集接触区域上接触发射极芯片。 用于将发射极芯片和IO芯片连接到基座的材料设置在支座之间的凹槽中，而不是在支架结构的接触表面上。
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