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1.发明申请MOUNTING STRUCTURE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT ONTO CIRCUIT BOARD 失效将电子元件安装到电路板上的安装结构和方法公开(公告)号：US20090277684A1
公开(公告)日：2009-11-12
申请号：US12158904
申请日：2006-12-19
CPC分类号： B29C45/14655 , B29C2045/14983 , H01L21/565 , H01L23/3135 , H01L27/14618 , H01L31/0203 , H01L33/483 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2924/09701 , H01L2924/1815 , H05K1/189 , H05K3/284 , H05K3/326 , H05K2201/09081 , H05K2201/091 , H05K2201/10106 , H05K2201/10636 , H05K2201/10727 , H05K2201/10977 , H05K2203/1316 , Y02P70/611 , H01L2924/00
摘要： An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.
摘要翻译： 电子部件安装结构包括其上形成有端子连接图案的柔性电路板和设置有电极的发光部件。 将发光部件放置在柔性电路板上，将合成树脂壳体注射成型以覆盖发光部件和围绕放置在其上的发光部件的柔性电路基板的一部分，由此， 柔性电路板的发光部件和端子连接图案彼此抵靠接触地连接。
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2.发明授权Mounting structure and method for mounting electronic component onto circuit board 失效将电子元件安装到电路板上的安装结构和方法公开(公告)号：US08053684B2
公开(公告)日：2011-11-08
申请号：US12158904
申请日：2006-12-19
IPC分类号： H01L23/28
CPC分类号： B29C45/14655 , B29C2045/14983 , H01L21/565 , H01L23/3135 , H01L27/14618 , H01L31/0203 , H01L33/483 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2924/09701 , H01L2924/1815 , H05K1/189 , H05K3/284 , H05K3/326 , H05K2201/09081 , H05K2201/091 , H05K2201/10106 , H05K2201/10636 , H05K2201/10727 , H05K2201/10977 , H05K2203/1316 , Y02P70/611 , H01L2924/00
摘要： An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.
摘要翻译： 电子部件安装结构包括其上形成有端子连接图案的柔性电路板和设置有电极的发光部件。 将发光部件放置在柔性电路板上，将合成树脂壳体注射成型以覆盖发光部件和围绕放置在其上的发光部件的柔性电路基板的一部分，由此， 柔性电路板的发光部件和端子连接图案彼此抵靠接触地连接。
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