公开(公告)号：US07915171B2

公开(公告)日：2011-03-29

申请号：US12111702

申请日：2008-04-29

Applicant: Charles H. Wallace ,  Matthew Tingey ,  Swaminathan Sivakumar

Inventor： Charles H. Wallace ,  Matthew Tingey ,  Swaminathan Sivakumar

IPC: H01L21/306 ,  G03F1/00

CPC classification number: H01L21/308 ,  H01L21/0271 ,  H01L21/3086 ,  H01L21/3088

Abstract: Double patterning techniques and structures are generally described. In one example, a method includes depositing a first photoresist to a semiconductor substrate, forming a first integrated circuit (IC) pattern in the first photoresist, the first IC pattern comprising one or more trench structures, protecting the first IC pattern in the first photoresist from actions that form a second IC pattern in a second photoresist, depositing the second photoresist to the first IC pattern, and forming the second IC pattern in the second photoresist, the second IC pattern comprising one or more structures that are sufficiently close to the one or more trench structures of the first IC pattern to cause scumming of the second photoresist in the one or more trench structures of the first IC pattern.

Abstract translation: 通常描述双重图案形成技术和结构。 在一个实例中，一种方法包括将第一光致抗蚀剂沉积到半导体衬底，在第一光致抗蚀剂中形成第一集成电路（IC）图案，第一IC图案包括一个或多个沟槽结构，保护第一光致抗蚀剂 从在第二光致抗蚀剂中形成第二IC图案的动作，将第二光致抗蚀剂沉积到第一IC图案，以及在第二光致抗蚀剂中形成第二IC图案，第二IC图案包括一个或多个足够接近该一个的结构 或更多个沟槽结构，以使第一IC图案的一个或多个沟槽结构中的第二光致抗蚀剂浮渣。

公开(公告)号：US20100165317A1

公开(公告)日：2010-07-01

申请号：US12319014

申请日：2008-12-30

Applicant: Charles Wallace ,  Matthew Tingey ,  Swaminathan Sivakumar

Inventor： Charles Wallace ,  Matthew Tingey ,  Swaminathan Sivakumar

IPC: G03B27/72 ,  G02B26/02

CPC classification number: G03B27/72 ,  G03F7/701 ,  G03F7/70191

Abstract: Embodiments of systems and methods for providing a hybrid illumination aperture in optical lithography are generally described herein. Other embodiments may be described and claimed.

Abstract translation: 本文中通常描述用于在光学光刻中提供混合照明孔径的系统和方法的实施例。 可以描述和要求保护其他实施例。

公开(公告)号：US08233210B2

公开(公告)日：2012-07-31

申请号：US12319014

申请日：2008-12-30

Applicant: Charles Wallace ,  Matthew Tingey ,  Swaminathan Sivakumar

Inventor： Charles Wallace ,  Matthew Tingey ,  Swaminathan Sivakumar

IPC: G02B26/02 ,  G03B27/54 ,  G03B27/72

CPC classification number: G03B27/72 ,  G03F7/701 ,  G03F7/70191

Abstract: Embodiments of systems and methods for providing a hybrid illumination aperture in optical lithography are generally described herein. Other embodiments may be described and claimed.

Abstract translation: 本文中通常描述用于在光学光刻中提供混合照明孔径的系统和方法的实施例。 可以描述和要求保护其他实施例。

公开(公告)号：US20090267175A1

公开(公告)日：2009-10-29

申请号：US12111702

申请日：2008-04-29

Applicant: Charles H. Wallace ,  Matthew Tingey ,  Swaminathan Sivakumar

Inventor： Charles H. Wallace ,  Matthew Tingey ,  Swaminathan Sivakumar

IPC: H01L21/308 ,  H01L27/00

CPC classification number: H01L21/308 ,  H01L21/0271 ,  H01L21/3086 ,  H01L21/3088

Abstract: Double patterning techniques and structures are generally described. In one example, a method includes depositing a first photoresist to a semiconductor substrate, forming a first integrated circuit (IC) pattern in the first photoresist, the first IC pattern comprising one or more trench structures, protecting the first IC pattern in the first photoresist from actions that form a second IC pattern in a second photoresist, depositing the second photoresist to the first IC pattern, and forming the second IC pattern in the second photoresist, the second IC pattern comprising one or more structures that are sufficiently close to the one or more trench structures of the first IC pattern to cause scumming of the second photoresist in the one or more trench structures of the first IC pattern.

Abstract translation: 通常描述双重图案形成技术和结构。 在一个实例中，一种方法包括将第一光致抗蚀剂沉积到半导体衬底，在第一光致抗蚀剂中形成第一集成电路（IC）图案，第一IC图案包括一个或多个沟槽结构，保护第一光致抗蚀剂中的第一IC图案 从在第二光致抗蚀剂中形成第二IC图案的动作，将第二光致抗蚀剂沉积到第一IC图案，以及在第二光致抗蚀剂中形成第二IC图案，第二IC图案包括一个或多个足够接近该一个的结构 或更多个沟槽结构，以使第一IC图案的一个或多个沟槽结构中的第二光致抗蚀剂浮渣。

公开(公告)号：US20050079486A1

公开(公告)日：2005-04-14

申请号：US10711517

申请日：2004-09-23

Applicant: Nicholas ABBOTT ,  Matthew TINGEY ,  Brian CLARE ,  Chang-Hyun JANG

Inventor： Nicholas ABBOTT ,  Matthew TINGEY ,  Brian CLARE ,  Chang-Hyun JANG

IPC: B01J19/00 ,  C12Q1/68 ,  C12Q1/70 ,  C40B40/06 ,  C40B40/10 ,  C40B40/18 ,  C40B60/14 ,  G01N33/53 ,  G01N33/542 ,  G01N33/543

CPC classification number: B82Y30/00 ,  B01J19/0046 ,  B01J2219/00382 ,  B01J2219/00596 ,  B01J2219/00659 ,  B01J2219/0072 ,  B01J2219/00722 ,  B01J2219/00725 ,  B01J2219/0074 ,  B01J2219/00743 ,  B01J2219/00745 ,  B01J2219/0075 ,  B82Y15/00 ,  C40B40/06 ,  C40B40/10 ,  C40B40/18 ,  C40B60/14 ,  G01N33/54373

Abstract: The present invention provides methods, devices and kits for detecting a ligand. The methods involve capturing a ligand from a sample with an affinity substrate that includes a receptor for a ligand, transferring captured ligand to a detection surface and detecting the ligand on the detection surface with a liquid crystal. Accordingly, the capture step is decoupled from the detection step.

Abstract translation: 本发明提供用于检测配体的方法，装置和试剂盒。 所述方法包括用具有配体受体的亲和底物从样品捕获配体，将捕获的配体转移到检测表面，并用液晶检测检测表面上的配体。 因此，捕获步骤与检测步骤分离。