公开(公告)号：US08410569B2

公开(公告)日：2013-04-02

申请号：US12842583

申请日：2010-07-23

申请人： Ikuo Yoshihara ,  Masaya Nagata ,  Naoto Sasaki ,  Taku Umebayashi ,  Hiroshi Takahashi ,  Yoichi Otsuka ,  Isaya Kitamura ,  Tokihisa Kaneguchi ,  Keishi Inoue ,  Toshihiko Hayashi ,  Hiroyasu Matsugai ,  Mayoshi Aonuma ,  Hiroshi Yoshioka

发明人： Ikuo Yoshihara ,  Masaya Nagata ,  Naoto Sasaki ,  Taku Umebayashi ,  Hiroshi Takahashi ,  Yoichi Otsuka ,  Isaya Kitamura ,  Tokihisa Kaneguchi ,  Keishi Inoue ,  Toshihiko Hayashi ,  Hiroyasu Matsugai ,  Mayoshi Aonuma ,  Hiroshi Yoshioka

IPC分类号： H01L27/146

CPC分类号： H01L27/14632 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687

摘要： A solid-state imaging device includes a first substrate including a light-sensing portion configured to perform photoelectric conversion of incident light and a wiring portion provided on a light-incident side; an optically transparent second substrate provided on a wiring portion side of the first substrate at a certain distance; a through-hole provided in the first substrate; a through-via provided in the through-hole; a front-surface-side electrode connected to the through-via and provided on a front surface of the first substrate; a back-surface-side electrode connected to the through-via and provided on a back surface of the first substrate; and a stopper electrode provided on the front-surface-side electrode and filling a space between the front-surface-side electrode and the second substrate.

摘要翻译： 固态成像装置包括：第一基板，包括被配置为执行入射光的光电转换的光感测部分和设置在光入射侧的布线部分; 光学透明的第二基板，设置在所述第一基板的布线部侧一定距离; 设置在所述第一基板中的通孔; 通孔，设置在通孔中; 连接到所述通孔并设置在所述第一基板的前表面上的前表面侧电极; 连接到所述通孔并设置在所述第一基板的背面上的背面侧电极; 以及设置在前表面侧电极上并填充前表面侧电极和第二基板之间的间隔的止动电极。