公开(公告)号：US20110277491A1

公开(公告)日：2011-11-17

申请号：US12931605

申请日：2011-02-03

申请人： Ching-Ping Wu ,  Kai-An Cheng ,  Chun-Hsien Wu ,  Ju-Hong Lin ,  Chia-Chen Liao ,  Hsien Meng ,  Hsien-Chun Meng

发明人： Ching-Ping Wu ,  Kai-An Cheng ,  Chun-Hsien Wu ,  Ju-Hong Lin ,  Chia-Chen Liao ,  Hsien Meng ,  Hsien-Chun Meng

IPC分类号： F28D5/00 ,  F25D17/00

CPC分类号： H01L23/4336 ,  F28D15/0266 ,  F28D15/046 ,  F28F9/026 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation system includes a cooling device, a condenser, a vapor conveying duct and a cooling liquid conveying duct. The cooling device includes a housing, and an orifice plate dividing an inner space of the housing into a liquid supply chamber and an evaporation chamber proximate to the heat source, and formed with multiple micro orifices each having a diameter ranging from 5 to 1000 micrometers. The condenser includes a fluid inlet, a condensing chamber and a fluid outlet. The vapor conveying duct connects a vapor outlet of the housing and the fluid inlet of the condenser. The cooling liquid conveying duct connects a cooling liquid inlet of the housing and a fluid outlet of the condenser.

摘要翻译： 散热系统包括冷却装置，冷凝器，蒸汽输送管道和冷却液输送管道。 冷却装置包括壳体和将壳体的内部空间分成液体供应​​室和靠近热源的蒸发室的孔板，并且形成有多个微孔，每个孔具有5至1000微米的直径。 冷凝器包括流体入口，冷凝室和流体出口。 蒸汽输送管道连接外壳的蒸汽出口和冷凝器的流体入口。 冷却液输送管道连接壳体的冷却液入口和冷凝器的流体出口。

公开(公告)号：US20100281679A1

公开(公告)日：2010-11-11

申请号：US12841176

申请日：2010-07-22

申请人： Meng-Chi Huang ,  Min-Chieh Chou ,  Fuh-Yu Chang ,  Ching-Ping Wu

发明人： Meng-Chi Huang ,  Min-Chieh Chou ,  Fuh-Yu Chang ,  Ching-Ping Wu

IPC分类号： H05K13/00

CPC分类号： G01R1/06711 ,  G01R1/06761 ,  G01R3/00 ,  Y10T29/49002 ,  Y10T29/49117

摘要： A method of fabricating a multi-layer electric probe. The method includes forming a first strip layer. The first strip layer has a first conductivity and a first mechanical strength. Then, a second strip layer is solidly adhered to a surface of the first strip layer to form a structural body, wherein the second strip layer has a second conductivity and a second mechanical strength. The combination of the second conductivity and the second mechanical strength with the first conductivity and the first mechanical strength produces the desired capabilities of enduring current and mechanical strength.

摘要翻译： 一种制造多层电探针的方法。 该方法包括形成第一带状层。 第一带状层具有第一导电性和第一机械强度。 然后，第二带状层牢固地附着到第一带状层的表面，形成结构体，其中第二带状层具有第二导电性和第二机械强度。 第二导电性和第二机械强度与第一导电性和第一机械强度的组合产生持久电流和机械强度的期望能力。

公开(公告)号：US07185764B2

公开(公告)日：2007-03-06

申请号：US10600539

申请日：2003-06-23

申请人： Hung-Wen Lee ,  Ching-Ping Wu ,  Yen-Huei Su

发明人： Hung-Wen Lee ,  Ching-Ping Wu ,  Yen-Huei Su

IPC分类号： B65D85/30

CPC分类号： H01L21/67376 ,  B65D77/003 ,  B65D81/2076 ,  B65D81/2084 ,  H01L21/67386

摘要： A wafer-shipping device and a wafer storage method for protecting bonding pads from fluoridation. First, at least one through hole is drilled in the shipping box. The wafer is then placed in the shipping box. A packaging bag containing the shipping box is put into a vacuum packaging machine to remove air from the packaging bag and the shipping box. A dry inert gas is then introduced into the packaging bag and the shipping box until approaching atmospheric pressure as so to prevent the shipping box from collapse. The packaging bag is then sealed.

摘要翻译： 一种用于保护接合垫免受氟化的晶片运送装置和晶片储存方法。 首先，在运输箱中钻出至少一个通孔。 然后将晶片放置在运输箱中。 将包含运输箱的包装袋放入真空包装机中以从包装袋和运输箱中除去空气。 然后将干燥的惰性气体引入包装袋和运输箱中，直到接近大气压，以防止运输箱塌陷。 然后将包装袋密封。

公开(公告)号：US20080094084A1

公开(公告)日：2008-04-24

申请号：US11616892

申请日：2006-12-28

申请人： Meng-Chi Huang ,  Min-Chieh Chou ,  Fuh-Yu Chang ,  Ching-Ping Wu

发明人： Meng-Chi Huang ,  Min-Chieh Chou ,  Fuh-Yu Chang ,  Ching-Ping Wu

IPC分类号： G01R31/02 ,  H01R43/00

CPC分类号： G01R1/06711 ,  G01R1/06761 ,  G01R3/00 ,  Y10T29/49002 ,  Y10T29/49117

摘要： A multi-layer electric probe, suitable for testing a to-be-tested device, includes a first strip layer and a second strip layer. The first strip layer has a first conductivity and a first mechanical strength. The second strip layer has a second conductivity and a second mechanical strength. The first strip layer and the second strip layer are solidly adhered together as a structural body so as to produce at least one of the desired capabilities of enduring current and mechanical strength. The multi-layer electric probe can further include at least a third strip layer having the capability of enduring current and the desired mechanical strength.

摘要翻译： 适用于测试待测试装置的多层电探针包括第一条带层和第二条带层。 第一带状层具有第一导电性和第一机械强度。 第二带状层具有第二导电性和第二机械强度。 第一带层和第二带层作为结构体牢固地粘合在一起，以便产生持久电流和机械强度的期望能力中的至少一个。 多层电探​​针还可以包括具有耐久电流和期望的机械强度的能力的至少第三带状层。

公开(公告)号：US06897121B2

公开(公告)日：2005-05-24

申请号：US10442266

申请日：2003-05-21

申请人： H. Wally Lee ,  Ching-Ping Wu ,  Han-Maou Chang ,  Ma Chia-Chih ,  Nan-Tzu Lian ,  Hsin-Cheng Liu

发明人： H. Wally Lee ,  Ching-Ping Wu ,  Han-Maou Chang ,  Ma Chia-Chih ,  Nan-Tzu Lian ,  Hsin-Cheng Liu

IPC分类号： H01L21/3105 ,  H01L21/316 ,  H01L21/762 ,  H01L21/76

CPC分类号： H01L21/31053 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/022 ,  H01L21/02274 ,  H01L21/31056 ,  H01L21/31612 ,  H01L21/76229

摘要： A method of removing HDP oxide deposition comprises the steps of: (1) etching the HDP oxide deposition by in-side-out model, wherein the etching rate in the center of the substrate is faster than the edges of the substrate; (2) etching the HDP oxide deposition by out-side-in model, wherein the etching rate in the edges of the substrate is faster than the center of the substrate; and (3) removing the remaining silicon oxide layer using chemical-mechanical polishing (CMP). According to the method of the invention, the HDP oxide deposition can be planarized more uniform.

摘要翻译： 一种去除HDP氧化物沉积的方法包括以下步骤：（1）通过侧面模型蚀刻HDP氧化物沉积，其中衬底中心的蚀刻速率比衬底的边缘快; （2）通过外侧模型蚀刻HDP氧化物沉积，其中衬底边缘中的蚀刻速度比衬底的中心快; 和（3）使用化学机械抛光（CMP）去除剩余的氧化硅层。 根据本发明的方法，HDP氧化物沉积可以被平坦化得更均匀。