公开(公告)号：US20070039828A1

公开(公告)日：2007-02-22

申请号：US11506586

申请日：2006-08-18

Applicant: Adam Cohen ,  Michael Lockhard ,  Dennis Smalley

Inventor： Adam Cohen ,  Michael Lockhard ,  Dennis Smalley

IPC: C25D5/02

CPC classification number: C25D1/003 ,  B33Y10/00 ,  B81B2201/042 ,  B81C1/00293 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/10 ,  C25D5/022 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647 ,  Y10T156/10

Abstract: Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.

Abstract translation: 本发明的各种实施例涉及使用电化学制造技术形成中尺度或微尺寸器件，其中结构由多个层形成为打开的结构，其可折叠或以其他方式组合以形成所需构造的结构。 每个层由至少一种结构材料和至少一种牺牲材料形成。 开放结构的初始形成可以促进牺牲材料的释放，形成较少层以完成结构的能力，将附加材料定位到结构中的能力，对结构打开时暴露的区域执行附加处理操作的能力和/ 或形成完全封装和可能中空结构的能力。