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公开(公告)号：US08180587B2
公开(公告)日：2012-05-15
申请号：US10094550
申请日：2002-03-08
CPC分类号： G05B23/0213 , G05B23/027
摘要： A method of brokering information in a manufacturing system which includes a broker coupled between a supplier of information and a consumer of information. The manufacturing system receives information from the supplier in a first format and sends information from the broker to the consumer in a second format.
摘要翻译： 一种在制造系统中经纪交易信息的方法，其包括耦合在信息供应者和信息消费者之间的经纪人。 制造系统以第一格式从供应商处接收信息，并以第二种格式将信息从代理发送给消费者。
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公开(公告)号：US07051250B1
公开(公告)日：2006-05-23
申请号：US10164091
申请日：2002-06-06
IPC分类号： G06F11/00
CPC分类号： G05B19/4184 , G05B2219/31355 , G05B2219/31365 , G05B2219/32243 , G05B2219/32254 , Y02P90/14 , Y02P90/20
摘要： A method and apparatus is provided for routing workpieces based upon detecting a fault. The method comprises routing a workpiece to a first processing tool identified by a dispatch system, detecting a fault condition associated with the first processing tool and notifying the dispatch system of the detected fault condition. The method further comprises routing a second workpiece to a second processing tool in response to the dispatch system being notified of the fault condition.
摘要翻译： 提供了一种基于检测故障来路由工件的方法和装置。 该方法包括将工件路由到由调度系统识别的第一处理工具，检测与第一处理工具相关联的故障状况并通知调度系统检测到的故障状况。 该方法还包括响应于调度系统被通知故障状况而将第二工件路由到第二处理工具。
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公开(公告)号：US06895295B1
公开(公告)日：2005-05-17
申请号：US10140468
申请日：2002-05-06
CPC分类号： G03F7/70525 , G03F7/70991
摘要： A method for controlling a processing tool having a plurality of chambers includes processing a wafer in a first chamber of the processing tool; measuring a characteristic of the wafer; and modifying an operating recipe of one of the plurality of chambers based on the measured characteristic. A system for processing semiconductor wafers includes a processing tool, a metrology tool, and a process controller. The processing tool includes a plurality of chambers. The metrology tool is adapted to measure a characteristic of a wafer processed in a first chamber of the processing tool. The process controller is adapted to modify an operating recipe of one of the plurality of chambers based on the measured characteristic.
摘要翻译： 一种用于控制具有多个室的处理工具的方法包括：处理工具的第一室中的晶片; 测量晶片的特性; 以及基于所测量的特性修改所述多个室中的一个室的操作配方。 一种用于处理半导体晶片的系统包括处理工具，计量工具和过程控制器。 处理工具包括多个室。 测量工具适于测量在处理工具的第一室中处理的晶片的特性。 过程控制器适于基于测量的特性来修改多个腔室中的一个腔室的操作配方。
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4.发明授权Method for determining, tracking and/or controlling processing based upon silicon characteristics 有权用于基于硅特性确定，跟踪和/或控制处理的方法公开(公告)号：US06638778B1
公开(公告)日：2003-10-28
申请号：US10082809
申请日：2002-02-25
IPC分类号： H01L2166
CPC分类号： H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： The present invention is generally directed to various methods for determining, tracking and/or controlling processing based upon wafer characteristics. In one embodiment, the method is directed to selecting a plurality of wafers from the group of wafers based upon the semiconductor device to be manufactured on the wafer and at least one characteristic of the wafers. In another embodiment, the method comprises identifying a source of wafers wherein the device metrology data lies outside of the preselected range based upon the wafer identification mark and the device metrology data. As yet another example, the method comprises determining at least one parameter of a process operation to be performed on a wafer in a processing tool based upon the determined wafer characteristics.
摘要翻译： 本发明一般涉及用于基于晶片特性来确定，跟踪和/或控制处理的各种方法。 在一个实施例中，该方法旨在基于要在晶片上制造的半导体器件和晶片的至少一个特性从晶片组中选择多个晶片。 在另一个实施例中，该方法包括识别晶片源，其中基于晶片识别标记和器件测量数据，器件测量数据位于预选范围之外。 作为另一示例，该方法包括基于所确定的晶片特性来确定在处理工具中在晶片上执行的处理操作的至少一个参数。
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公开(公告)号：US06622111B1
公开(公告)日：2003-09-16
申请号：US09521046
申请日：2000-03-08
IPC分类号： G01C1918
CPC分类号： H01L21/67276
摘要： The movement of individual wafers in a semiconductor facility is tracked via a set of coordinates that include rotational points of reference on the wafer that coincide with the wafer's location in the processing line. In an example embodiment, the method includes imparting angles of rotation on the wafers in different stages of the processing system. The different angles of rotation on each wafer are collected as data along with the wafer location in the processing system and the tool/equipment identification code. The combined angle of rotation and wafer location data is used to map the path the wafer has traveled from the onset of processing. An important advantage of the invention is the increased control and traceability that the invention brings to wafer processing.
摘要翻译： 单个晶片在半导体设备中的移动通过一组坐标来跟踪，该坐标系包括与晶片在处理线中的位置一致的晶片上的旋转参考点。 在示例性实施例中，该方法包括在处理系统的不同阶段在晶片上施加旋转角度。 每个晶片上的不同旋转角度作为数据以及处理系统中的晶片位置和工具/设备识别码被收集。 组合的旋转角度和晶片位置数据用于映射晶片从处理开始行进的路径。 本发明的一个重要优点是本发明对晶片处理带来的增加的控制和可追溯性。
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6.发明授权公开(公告)号：US06427095B1
公开(公告)日：2002-07-30
申请号：US09569753
申请日：2000-05-12
IPC分类号： G06F700
CPC分类号： H01L21/67173 , H01L21/67724 , H01L21/67736 , Y10S414/139
摘要： Wafer processing time and handling is reduced by coupling a retrofitable processing tool between two standard processing tools. In an example embodiment, the retrofitable tool includes a metrology unit, which is coupled between two processing tools, that provides metrology capability without having to remove the wafers from the processing line. Once the metrology process is complete the wafers are transferred to the next processing tool and the retrofitable tool is decoupled from the two processing tools. An important advantage is the increased processing flexibility that the processing line reconfiguration method and the retrofitable tool bring to wafer processing.
摘要翻译： 通过在两个标准处理工具之间连接可逆加工工具来减少晶片加工时间和处理。 在示例性实施例中，可修改工具包括测量单元，其耦合在两个处理工具之间，其提供计量能力而不必从处理线移除晶片。 一旦测量过程完成，将晶片转移到下一个处理工具，并且可逆工具与两个处理工具分离。 一个重要的优点是处理线重构方法和可逆工具对晶片处理带来的增加的处理灵活性。
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7.发明授权Method of dynamically designing a preventative maintenance schedule based upon sensor data, and system for accomplishing same 有权基于传感器数据动态设计预防性维护计划的方法和用于实现其的系统公开(公告)号：US07130769B1
公开(公告)日：2006-10-31
申请号：US10060877
申请日：2002-01-30
IPC分类号： G06F15/00
CPC分类号： G05B23/0235 , G05B23/0283
摘要： In one example, the method includes operating a process tool that has a plurality of sensors for sensing at least one parameter associated with the operation of the process tool, obtaining data from the sensors and determining at least one maintenance activity for the process tool based upon the data obtained from the sensors. In another example, data from the sensors is provided to a controller that analyzes the data and indicates desired variations in at least one maintenance activity to be performed on the process tool based upon the analysis of the data. In yet another example, the controller identifies a plurality of maintenance activities to be performed on the process tool based upon the analysis of the data.
摘要翻译： 在一个示例中，该方法包括操作具有多个传感器的处理工具，该传感器用于感测与处理工具的操作相关联的至少一个参数，从传感器获取数据并基于以下步骤确定用于处理工具的至少一个维护活动 从传感器获得的数据。 在另一示例中，来自传感器的数据被提供给控制器，该控制器基于对数据的分析，分析数据并指示要在处理工具上执行的至少一个维护活动中的期望变化。 在又一示例中，控制器基于对数据的分析来识别要对处理工具执行的多个维护活动。
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8.发明授权公开(公告)号：US06790680B1
公开(公告)日：2004-09-14
申请号：US10052055
申请日：2002-01-17
IPC分类号： H01L2100
CPC分类号： H01L21/67276
摘要： A method and apparatus for determining a possible cause of a fault in a semiconductor fabrication process. The method includes determining a first fault in a first processing tool executing under first operating conditions and determining a second fault in a second processing tool executing under second operating conditions. The method further includes identifying a possible source of the second fault based on at least the first operating conditions of the first processing tool.
摘要翻译： 一种用于确定半导体制造工艺中的故障的可能原因的方法和装置。 该方法包括确定在第一操作条件下执行的第一处理工具中的第一故障，并确定在第二操作条件下执行的第二处理工具中的第二故障。 该方法还包括基于至少第一处理工具的第一操作条件来识别第二故障的可能来源。
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公开(公告)号：US06766285B1
公开(公告)日：2004-07-20
申请号：US09570305
申请日：2000-05-12
IPC分类号： G06F945
CPC分类号： G05B19/41865 , G05B2219/32194 , G05B2219/32343 , G05B2219/45031 , H01L21/67276 , Y02P90/20 , Y02P90/22 , Y02P90/26
摘要： Wafer processing cycle times are substantially reduced by predicting and correcting downstream processing location anomalies before a wafer lot is released to the next processing location on the processing line. In an example embodiment, a method of verifying downstream processing line readiness in a semiconductor processing facility having a material handling system includes presenting a wafer lot to a first application processing location. A signal is then sent to a second application processing location to verify readiness by simulating the second application processing on the wafer lot. The availability or operating status of the second processing location is then communicated to the material handling system, the material handling system communicating instructions to the first processing location on where to send the wafer lot after the processing simulation is complete. The readiness verification method is repeated until the wafer lot is completely processed.
摘要翻译： 通过在将晶片批次释放到处理线上的下一个处理位置之前预测和校正下游处理位置异常，可以大大减少晶片处理周期时间。 在一个示例性实施例中，一种在具有材料处理系统的半导体处理设备中验证下游处理线准备的方法包括将晶片批次呈现给第一应用处理位置。 然后将信号发送到第二应用处理位置，以通过模拟晶片批次上的第二应用处理来验证准备状态。 然后将第二处理位置的可用性或操作状态传送到材料处理系统，材料处理系统在处理模拟完成之后向第一处理位置传送指令发送晶片批次的指令。 重复准备验证方法，直到晶片批次完全处理。
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公开(公告)号：US06662070B1
公开(公告)日：2003-12-09
申请号：US09520483
申请日：2000-03-08
IPC分类号： G06F1900
CPC分类号： H01L21/67276 , H01L21/67259
摘要： The detection of a processing deviation in a cluster tool of a wafer processing system is achieved by assigning individual wafers a set of positional coordinates each time the wafer moves within the cluster tool. In an example embodiment, a wafer is placed into a first chamber of the cluster tool and it is rotated to a certain angle of rotation. Each time the wafer moves within the cluster tool the wafer is given a different angle of rotation; both the rotation angle and the wafer location are then recorded as a set of positional coordinates. The wafer exits the cluster tool and is examined for structural or surface defects that indicate that there was a variation in the processing parameters. A wafer movement map is developed from the positional coordinates and the map is then used as an analysis tool to identify the processing location that caused defect to occur. An important advantage is the increased control and traceability that the tracking method brings to single wafer handling and processing.
摘要翻译： 晶片处理系统的集群工具中的处理偏差的检测是通过每次晶片在集群工具内移动时分配一组位置坐标来实现的。 在示例性实施例中，将晶片放置在群集工具的第一室中，并将其旋转到一定的旋转角度。 每次晶片在集群工具内移动时，晶片都有不同的旋转角度; 然后将旋转角度和晶片位置两者记录为一组位置坐标。 晶片离开集群工具，并检查表明处理参数有变化的结构或表面缺陷。 从位置坐标开发晶片移动图，然后将该图用作分析工具，以识别导致缺陷发生的处理位置。 一个重要的优点是跟踪方法对单晶片处理和处理带来的增加的控制和可追溯性。
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