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公开(公告)号：US06264317B1
公开(公告)日：2001-07-24
申请号：US09443625
申请日：1999-11-19
IPC分类号： B41J2175
CPC分类号： B41J2/17536 , B41J2/17503 , B41J2/17553
摘要： The invention relates to an ink jet pen having exposed surfaces which are coated with a polymeric material. The polymeric material is treated with ultraviolet energy at a wavelength and for a period of time sufficient to increase the surface energy of the coating to thereby enhance the adhesive properties of the coating. The coated polymeric material and treated pen exhibits improved corrosion resistance and are more compatible with adhesives used to assemble components of the pen than similar untreated coatings.
摘要翻译： 本发明涉及一种具有涂覆有聚合物材料的暴露表面的喷墨笔。 聚合物材料用波长的紫外线能量处理足够长的时间以增加涂层的表面能，从而增强涂层的粘合性能。 涂覆的聚合物材料和经处理的笔具有改善的耐腐蚀性，并且与相似的未处理涂层的组合装置的粘合剂更相容。
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公开(公告)号：US6106096A
公开(公告)日：2000-08-22
申请号：US990343
申请日：1997-12-15
CPC分类号： B41J2/1631 , B41J2/14032 , B41J2/1601 , B41J2/162 , B41J2/1623 , B41J2/1626 , B41J2/1634 , B41J2/1635 , B41J2/1645
摘要： The invention described in the specification relates to an ink jet printhead structure having semiconductor substrate containing energy imparting devices for ejecting ink through nozzle holes in a nozzle plate, to a method for making a printhead structure and to a printer cartridge containing the printhead structure. In order to reduce stresses induced in the structure during manufacturing and/or use thereof, a polymeric layer is disposed between the semiconductor substrate and nozzle plate which contains expansion void spaces or valleys sufficient to inhibit stresses in the structure during a process for bonding the nozzle plate to the polymeric layer thereby reducing misalignment and warpage problems associated with conventional printhead structures.
摘要翻译： 本说明书中描述的本发明涉及一种具有半导体衬底的喷墨打印头结构，其具有用于通过喷嘴板中的喷嘴孔喷射墨水的能量赋予装置，以及用于制造打印头结构的方法以及包含打印头结构的打印机墨盒。 为了减少在制造和/或使用期间在结构中引起的应力，在半导体衬底和喷嘴板之间设置聚合物层，该聚合物层包含在用于接合喷嘴的过程中足以抑制结构中的应力的膨胀空隙空间或谷 从而减少与常规打印头结构相关的不对准和翘曲问题。
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公开(公告)号：US6071427A
公开(公告)日：2000-06-06
申请号：US89711
申请日：1998-06-03
申请人： Michael Raulinaitis
发明人： Michael Raulinaitis
CPC分类号： B41J2/14072 , B41J2/14024 , B41J2/1601 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1634 , B41J2/1643
摘要： The invention described in the specification relates to an improved method for making a printhead for an ink jet printer. In the method, one or more semiconductor substrates containing energy imparting devices for ink and electrical conductors for the energy imparting devices are attached to a metal substrate carrier. A conductive layer containing electrical tracing terminating in contact pads is also attached to the carrier using an adhesive. A nozzle plate is attached to the conductive layer and to the semiconductor substrate also using an adhesive. The nozzle plate, conductive layer and adhesive all have openings or windows therein for use in forming wire bonds between the semiconductor substrate and the conductive layer. Once the wire bonds having loops are formed, the wire loops are depressed toward the nozzle plate to reduce the height of the loops above the nozzle plate. The entire wires and bonds are then encapsulated in a elastomeric, insulative material to protect the wires. An advantage of the depressed wire loops is that the encapsulating material layer may be relatively thin so that it does not extend above the exposed surface of the nozzle plate more than about 15 mils thereby providing maximum clearance between the printhead a media to be printed.
摘要翻译： 本说明书中描述的本发明涉及一种用于制造用于喷墨打印机的打印头的改进方法。 在该方法中，一个或多个含有能量赋予装置的能量赋予装置的半导体基板和能量赋予装置的电导体被附着到金属基板载体上。 包含端接在接触垫中的电迹线的导电层也使用粘合剂附着到载体上。 喷嘴板也使用粘合剂附着到导电层和半导体衬底上。 喷嘴板，导电层和粘合剂都具有用于在半导体衬底和导电层之间形成引线接合的开口或窗口。 一旦形成了具有环的线接合，则线圈朝向喷嘴板压下，以减小喷嘴板上方的环的高度。 然后将整个电线和接合件封装在弹性体绝缘材料中以保护电线。 凹陷的线环的优点在于，封装材料层可以相对较薄，使得其不会在喷嘴板的暴露表面上方超过大约15密耳，从而在打印头之间提供打印头上要打印的介质之间的最大间隙。
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公开(公告)号：US06668445B1
公开(公告)日：2003-12-30
申请号：US09481254
申请日：2000-01-11
IPC分类号： H05B300
CPC分类号： G03G9/0821 , H05K3/3489 , H05K3/361 , Y10S438/906 , Y10T29/49083 , Y10T29/49169 , Y10T29/49401
摘要： A method of tape automated bonding a heater chip of an ink jet printer to a flexible circuit includes the step of attaching an electrically conductive bonding pad to a first portion of a surface of the heater chip. A mask is applied to a second portion of the surface of the heater chip. An exposed surface of the bonding pad is chemical dry etched for a predetermined time period to thereby remove contaminants from the etched exposed surface. The chemical dry etching is terminated at an end of the predetermined time period such that substantially none of the bonding pad is removed. Lastly, the flexible circuit is electrically connected to the etched exposed surface.
摘要翻译： 将喷墨打印机的加热器芯片自动粘合到柔性电路的带的方法包括将导电焊盘附接到加热器芯片的表面的第一部分的步骤。 将掩模施加到加热器芯片的表面的第二部分。 接合焊盘的暴露表面被化学干蚀刻预定的时间段，从而从蚀刻的暴露表面去除污染物。 化学干蚀刻在预定时间段结束时终止，使得基本上没有去除焊盘。 最后，柔性电路电连接到蚀刻的暴露表面。
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公开(公告)号：US06247779B1
公开(公告)日：2001-06-19
申请号：US09365267
申请日：1999-07-30
申请人： Ronald Monroe Nowell, Jr. , David Amos Ward , Michael David Lattuca , Michael Raulinaitis , Shirish Padmakar Mulay
发明人： Ronald Monroe Nowell, Jr. , David Amos Ward , Michael David Lattuca , Michael Raulinaitis , Shirish Padmakar Mulay
IPC分类号： B41J29377
CPC分类号： B41J29/377 , B41J2/14024 , B41J2/1408
摘要： A printhead comprises a source of ink, a body, a mounting base, and an ink heater thermally coupled to the mounting base. A flowpath delivers ink from the ink source to the heater and is defined at least in part by the mounting base on the body. Three or more thermally conductive paths extend from the mounting base to the body. Preferably, one or more of the thermally conductive paths are heat conductive bridges extending from the mounting base to the body through an edge feed via.
摘要翻译： 打印头包括一个油墨源，一个主体，一个安装基座和一个热耦合到安装基座上的墨水加热器。 流动路径将油墨从油墨源传送到加热器，并且至少部分地由主体上的安装基座限定。 三个或更多个导热路径从安装基座延伸到主体。 优选地，一个或多个导热路径是通过边缘馈送通孔从安装基座延伸到主体的导热桥。
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公开(公告)号：US5847737A
公开(公告)日：1998-12-08
申请号：US665707
申请日：1996-06-18
申请人： Micah Abraham Kaufman , Janine Marie Kelty , James Harold Powers , Michael Raulinaitis , Lawrence Russell Steward
发明人： Micah Abraham Kaufman , Janine Marie Kelty , James Harold Powers , Michael Raulinaitis , Lawrence Russell Steward
CPC分类号： B41J2/1404 , B41J2/14145 , B41J2/17563 , B41J2002/14387
摘要： An ink jet printhead includes a chip layer having a via for receiving ink, and having at least one actuator. A barrier layer is disposed adjacent the chip layer, and forms at least one throat which has a width and a cross-sectional area. The barrier layer also forms at least one bubble chamber, with each throat adapted to receive ink from the via and provide it to the respective bubble chamber. A nozzle layer is disposed adjacent the barrier layer, opposite the chip layer, and forms at least one nozzle for ejecting ink from the respective bubble chamber when the ink is energized by the associated actuator. At least one post is disposed proximate the throat, and extends part way between the chip layer and the nozzle layer. The post forms one or more gates through which the ink must pass from the via to the at least one throat.
摘要翻译： 喷墨打印头包括具有用于接收墨水的通孔的芯片层，并且具有至少一个致动器。 阻挡层设置在芯片层附近，形成至少一个具有宽度和横截面面积的喉部。 阻挡层还形成至少一个气泡室，每个喉部适于从通孔接收墨水并将其提供给相应的气泡室。 喷嘴层设置在与芯片层相对的阻挡层附近，并且当由相关联的致动器激励墨时，形成用于从相应气泡室喷射墨的至少一个喷嘴。 至少一个柱设置在喉部附近，并且在芯片层和喷嘴层之间部分地延伸。 该柱形成一个或多个浇口，油墨必须通过该浇口从通孔经过至少一个喉部。
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