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    Corrosion resistant printhead body for ink jet pen
    1.
    发明授权
    Corrosion resistant printhead body for ink jet pen 有权
    用于喷墨笔的防腐打印头体

    公开(公告)号：US06264317B1

    公开(公告)日：2001-07-24

    申请号：US09443625

    申请日：1999-11-19

    申请人： Michael Raulinaitis ,  Jeanne Marie Saldanha Singh ,  Gary Raymond Williams

    发明人： Michael Raulinaitis ,  Jeanne Marie Saldanha Singh ,  Gary Raymond Williams

    IPC分类号： B41J2175

    CPC分类号： B41J2/17536 ,  B41J2/17503 ,  B41J2/17553

    摘要： The invention relates to an ink jet pen having exposed surfaces which are coated with a polymeric material. The polymeric material is treated with ultraviolet energy at a wavelength and for a period of time sufficient to increase the surface energy of the coating to thereby enhance the adhesive properties of the coating. The coated polymeric material and treated pen exhibits improved corrosion resistance and are more compatible with adhesives used to assemble components of the pen than similar untreated coatings.

    摘要翻译： 本发明涉及一种具有涂覆有聚合物材料的暴露表面的喷墨笔。 聚合物材料用波长的紫外线能量处理足够长的时间以增加涂层的表面能，从而增强涂层的粘合性能。 涂覆的聚合物材料和经处理的笔具有改善的耐腐蚀性，并且与相似的未处理涂层的组合装置的粘合剂更相容。

    Tab circuit design for simplified use with hot bar soldering technique
    2.
    发明授权
    Tab circuit design for simplified use with hot bar soldering technique 有权
    Tab电路设计，简化使用热棒焊接技术

    公开(公告)号：US06357864B1

    公开(公告)日：2002-03-19

    申请号：US09464969

    申请日：1999-12-16

    申请人： Carl Edmond Sullivan ,  Frank Edward Anderson ,  Paul Timothy Spivey ,  Kris Ann Reeves ,  Gary Raymond Williams ,  Jeanne Marie Saldanha Singh

    发明人： Carl Edmond Sullivan ,  Frank Edward Anderson ,  Paul Timothy Spivey ,  Kris Ann Reeves ,  Gary Raymond Williams ,  Jeanne Marie Saldanha Singh

    IPC分类号： B41J205

    CPC分类号： B41J2/14072 ,  B41J2/14024 ,  H05K3/3494 ,  H05K3/363 ,  H05K3/4084 ,  H05K2201/0394 ,  H05K2201/10681 ,  H05K2201/10977 ,  H05K2203/0195 ,  H05K2203/1311

    摘要： The invention provides a printhead cartridge body contained within an inkjet printer which contains a tape automated bonding (TAB) circuit, having a unique architecture, electrically connected to a printhead heater chip and a printed circuit board (PCB). Moreover, the TAB circuit architecture is readily sealable by a variety of methods. The TAB circuit includes elongate apertures which have a length axis aligned perpendicular to electrical traces which run through the apertures. Each trace has a first end running through the apertures and being connected to a PCB by means of a hot bar soldering technique and the second end of the traces being connected to a printhead heater chip. An encapsulant layer substantially encloses the rectangular apertures and electrical connections preventing ink mist from contacting the connections. The TAB circuit design provides improvement in the manufacturing process and enables rework of connections without destroying the TAB circuit.

    摘要翻译： 本发明提供了一种包含在喷墨打印机内的打印头墨盒体，其包含带状自动粘合（TAB）电路，其具有电连接到打印头加热器芯片和印刷电路板（PCB）的独特结构。 此外，TAB电路架构可以通过各种方法容易地密封。 TAB电路包括细长孔，其具有垂直于穿过孔的电迹线对准的长度轴。 每个迹线具有穿过孔的第一端，并且通过热棒焊接技术连接到PCB，并且迹线的第二端连接到打印头加热器芯片。 密封剂层基本上包围矩形孔和防止墨雾接触连接的电连接。 TAB电路设计提供了制造过程的改进，并能够重新连接连接而不破坏TAB电路。

    Ink jetting structure having protected connections
    5.
    发明授权
    Ink jetting structure having protected connections 有权
    具有受保护连接的喷墨结构

    公开(公告)号：US07784909B2

    公开(公告)日：2010-08-31

    申请号：US12021375

    申请日：2008-01-29

    申请人： Frank Edward Anderson ,  Michael John Dixon ,  Bryan Dale McKinley ,  Jeanne Marie Saldanha Singh

    发明人： Frank Edward Anderson ,  Michael John Dixon ,  Bryan Dale McKinley ,  Jeanne Marie Saldanha Singh

    IPC分类号： B41J2/14

    CPC分类号： B41J2/17553 ,  B41J2/17526

    摘要： An ink jetting structure includes a substrate that has a first surface and a second surface. A heater chip is mounted to the second surface of the substrate, and includes a first set of electrical contacts. A printhead circuit member has a third surface, a fourth surface, and an opening configured to receive the heater chip with the first set of electrical contacts of the heater chip being exposed through the opening. The third surface is mounted to the second surface of the substrate. The fourth surface has a second set of electrical contacts attached by wire bonds to the first set of electrical contacts. The third surface has a third set of electrical contacts electrically coupled to the second set of electrical contacts, and electrically connected to a flexible cable for coupling to corresponding contacts on a printer.

    摘要翻译： 喷墨结构包括具有第一表面和第二表面的基底。 加热器芯片安装到基板的第二表面，并且包括第一组电触头。 打印头电路构件具有第三表面，第四表面和开口，其构造成接收加热器芯片，加热器芯片的第一组电触点通过开口露出。 第三表面安装到基板的第二表面。 第四表面具有通过引线键合连接到第一组电触点的第二组电触头。 第三表面具有电耦合到第二组电触头的第三组电触点，并且电连接到柔性电缆，用于耦合到打印机上的相应触点。

    Method and apparatus for adhesively securing ink jet pen components using thin film adhesives
    8.
    发明授权
    Method and apparatus for adhesively securing ink jet pen components using thin film adhesives 有权
    使用薄膜粘合剂粘合地固定喷墨笔组件的方法和装置

    公开(公告)号：US06758934B2

    公开(公告)日：2004-07-06

    申请号：US10305636

    申请日：2002-11-27

    申请人： Jeanne Marie Saldanha Singh ,  Thomas Lee Smart

    发明人： Jeanne Marie Saldanha Singh ,  Thomas Lee Smart

    IPC分类号： B32B3118

    CPC分类号： B41J2/17536 ,  Y10T156/1062 ,  Y10T156/1064 ,  Y10T156/108 ,  Y10T156/1082 ,  Y10T156/12 ,  Y10T156/1322

    摘要： The invention relates to a method for attaching microelectronic devices, circuit boards and the like to a surface, and is particularly suitable for attaching a plurality of a semiconductor chips to an ink jet pen body. The method includes the steps of (a) providing a sheet of a thin film adhesive material having a first surface and a second surface opposite the first surface, the second surface being releasably attached to a carrier web; (b) simultaneously making a plurality of cuts in the sheet of thin film adhesive material, the cuts extending from the first surface to an interface between the second surface and the carrier web without significantly extending into the carrier web to provide one or more cut portions of adhesive film; (c) removing each cut portion of adhesive film from the carrier web; (d) engaging the second surface of each of the cut portions with predetermined locations on a receiving surface; and (e) providing one or more semiconductor chips in a desirably aligned configuration with respect to the predetermined locations and contacting each semiconductor chip with first surface of each of the cut portions. Use of the method and apparatus of the invention provides significant improvement in the application of adhesive films to surfaces in electronic component assembly.

    摘要翻译： 本发明涉及一种将微电子器件，电路板等附着在表面上的方法，特别适用于将多个半导体芯片附着到喷墨笔体上。 该方法包括以下步骤：（a）提供具有第一表面和与第一表面相对的第二表面的薄膜粘合材料片，所述第二表面可释放地附接到载体网; （b）同时在薄膜粘合剂材料片上进行多个切口，切口从第一表面延伸到第二表面和载体网之间的界面，而不会显着延伸到载体网中以提供一个或多个切割部分 的胶膜; （c）从载体网上去除粘合膜的每个切割部分; （d）将每个切割部分的第二表面与接收表面上的预定位置接合; 和（e）相对于预定位置提供期望对准的一个或多个半导体芯片，并使每个半导体芯片与每个切割部分的第一表面接触。 使用本发明的方法和装置提供了在电子部件组件中将粘合剂膜应用于表面方面的显着改进。

    Printheads and method for assembling printheads
    9.
    发明授权
    Printheads and method for assembling printheads 有权
    打印头和组装打印头的方法

    公开(公告)号：US08636340B2

    公开(公告)日：2014-01-28

    申请号：US13046845

    申请日：2011-03-14

    申请人： Michael J. Dixon ,  Jiandong Fang ,  Richard Earl Corley, Jr. ,  Jeanne Marie Saldanha Singh ,  Frank E. Anderson ,  Xiaoming Wu

    发明人： Michael J. Dixon ,  Jiandong Fang ,  Richard Earl Corley, Jr. ,  Jeanne Marie Saldanha Singh ,  Frank E. Anderson ,  Xiaoming Wu

    IPC分类号： B41J2/25

    CPC分类号： B41J2/1628 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642

    摘要： Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.

    摘要翻译： 公开了一种用于打印机的打印头，其包括多个排出芯片单元。 多个排出芯片单元中的每个排出芯片单元构造成喷射至少一种流体。 打印头还包括多个支撑单元。 多个支撑单元的每个支撑单元与相应的排出芯片单元流体耦合。 每个支撑单元包括适于接收粘合剂以便于将各个支撑单元与相应的排出芯片单元相连接的多个沟槽。 此外，打印头包括与多个支撑单元中的每个支撑单元流体耦合的基座单元。 基座单元适于通过对应的支撑单元将至少一个流体提供给每个排出芯片单元。 另外公开了一种组装打印头的方法。

    MODULAR MICRO-FLUID EJECTION DEVICE
    10.
    发明申请
    MODULAR MICRO-FLUID EJECTION DEVICE 审中-公开
    模块化微流体喷射装置

    公开(公告)号：US20110316930A1

    公开(公告)日：2011-12-29

    申请号：US12825851

    申请日：2010-06-29

    申请人： Richard E. Corley ,  Michael J. Dixon ,  Jiandong Fang ,  Jeanne Marie Saldanha Singh

    发明人： Richard E. Corley ,  Michael J. Dixon ,  Jiandong Fang ,  Jeanne Marie Saldanha Singh

    IPC分类号： B41J2/145 ,  B21D53/76

    CPC分类号： B41J2/15 ,  B41J2/155 ,  B41J2202/19 ,  Y10T29/49401

    摘要： A modular micro-fluid ejection device includes a carrier frame supporting pluralities of micro-fluid ejection modules. Each of the modules has a plate of nozzles defining a plane. Adjacent nozzle plates are substantially coplanar and registered with one another across the entirety of the carrier frame. Methods to mount the modules to the frame include, first, temporarily mounting one module and then another, and then permanently mounting both with a durable adhesive. Manufacturing systems include suction devices to hold a first module in place on a fixture while later modules are suctioned and registered to each other. Once set in place, a carrier frame is commonly contacted to the modules and the suction to released. Adhesives between the frame and modules cause the modules to separate from the fixture and transfer to the frame. All remain properly registered upon transfer.

    摘要翻译： 模块化微流体喷射装置包括支撑多个微流体喷射模块的载体框架。 每个模块具有限定平面的喷嘴板。 相邻的喷嘴板基本上共面并且在整个载体框架上相互对准。 将模块安装到框架上的方法包括：首先临时安装一个模块，然后临时安装一个模块，然后用耐用的粘合剂永久地安装两个模块。 制造系统包括抽吸装置，以将第一模块保持在固定装置上的适当位置，而稍后模块被抽吸并彼此登记。 一旦设置到位，通常将载体框架与模块接触并且抽吸被释放。 框架和模块之间的粘合剂导致模块与夹具分离并传输到框架。 转让后，所有人都保持妥善的登记。