公开(公告)号：US5298399A

公开(公告)日：1994-03-29

申请号：US732242

申请日：1991-07-18

申请人： Takeshi Uozumi ,  Haruhiko Masaki ,  Makoto Hidaka ,  Akira Nakamura ,  Michihisa Maeda ,  Yasuo Yoneta

发明人： Takeshi Uozumi ,  Haruhiko Masaki ,  Makoto Hidaka ,  Akira Nakamura ,  Michihisa Maeda ,  Yasuo Yoneta

IPC分类号： C12N9/80 ,  C12N15/57 ,  C12N15/11 ,  C12N15/31 ,  C12P21/00

CPC分类号： C12N9/80

摘要： An isolated structural Bacillus sp. TB-90 (FERM BP-795) urease gene, which comprises base sequences encoding the amino acid sequences of three subunits of urease. A recombinant DNA comprising Bacillus sp. TB-90 (FERM BP-795) urease gene capable of replicating in Escherichia coli. A process for producing urease, which comprises cultivating Escherichia coli carrying a recombinant DNA comprising Bacillus sp. TB-90 (FERM BP-795) urease gene capable of replicating in Escherichia coli and recovering urease from the culture mixture

摘要翻译： 分离结构芽孢杆菌 TB-90（FERM BP-795）脲酶基因，其包含编码脲酶的三个亚基的氨基酸序列的碱基序列。 包含芽孢杆菌属的重组DNA 能在大肠杆菌中复制的TB-90（FERM BP-795）脲酶基因。 一种生产脲酶的方法，其包括培养携带包含芽孢杆菌属（Bacillus sp。）的重组DNA的大肠杆菌。 TB-90（FERM BP-795）能够在大肠杆菌中复制的脲酶基因并从培养物中回收尿素酶

公开(公告)号：US06713318B2

公开(公告)日：2004-03-30

申请号：US09820547

申请日：2001-03-28

申请人： Michihisa Maeda ,  Kenji Takahashi

发明人： Michihisa Maeda ,  Kenji Takahashi

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  B23K35/262 ,  B23K35/3618 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13147 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15312 ,  H05K3/3436 ,  H05K3/3489 ,  H01L2924/00014

摘要： A flip chip method of joining a chip and a substrate is described. A thermo-compression bonder is utilized to align the chip and substrate and apply a contact force to hold solder bumps on the substrate against metal bumps on the chip. The chip is rapidly heated from its non-native side by a pulse heater in the head of the bonder until the re-flow temperature of the solder bumps is reached. Proximate with reaching the re-flow temperature at the solder bumps, the contact force is released. The solder is held above its re-flow temperature for several seconds to facilitate wetting of the substrate's metal protrusions and joining. A no-clean flux that has a volatilization temperature below the melting point of the solder bumps is utilized to minimize or eliminate the need for a post interconnection de-flux operation.

公开(公告)号：US5179318A

公开(公告)日：1993-01-12

申请号：US546412

申请日：1990-06-29

申请人： Michihisa Maeda ,  Yoshiyuki Hanada ,  Hidemi Nakai ,  Yasukazu Morita ,  Yasuhiko Uehara

发明人： Michihisa Maeda ,  Yoshiyuki Hanada ,  Hidemi Nakai ,  Yasukazu Morita ,  Yasuhiko Uehara

IPC分类号： C23C14/08 ,  G02B5/28 ,  H01J29/18 ,  H01J29/28

CPC分类号： G02B5/285 ,  C23C14/081 ,  C23C14/083 ,  H01J29/185 ,  H01J29/28

摘要： A cathode-ray tube having a face plate which includes a phosphor layer provided at the inner surface side of a glass plate and an optical interference filter provided between the phosphor layer and the inner surface of the plate. The optical interference filter is constituted by high- and low-refractive index layers. The outermost layer of the optical interference filter in contact with the phosphor layer is an Al.sub.2 O.sub.3 layer or a ZrO.sub.2 layer having a physical thickness of 10 nm or more. The high-refractive index layer of the optical interference filter preferably consists of TiO.sub.2, and its low-refractive index layer preferably consists of Al.sub.2 O.sub.3.

摘要翻译： 一种具有面板的阴极射线管，该面板包括设置在玻璃板的内表面侧的荧光体层和设置在荧光体层和该板的内表面之间的光学干涉滤光器。 光学干涉滤光片由高折射率层和低折射率层构成。 与磷光体层接触的光学干涉滤光器的最外层是物理厚度为10nm以上的Al 2 O 3层或ZrO 2层。 光学干涉滤光器的高折射率层优选由TiO 2组成，其低折射率层优选由Al 2 O 3组成。