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    Apparatus and method for optical coherence tomography using multiple beams
    1.
    发明授权
    Apparatus and method for optical coherence tomography using multiple beams 有权
    使用多个光束进行光学相干断层扫描的装置和方法

    公开(公告)号：US09170088B2

    公开(公告)日：2015-10-27

    申请号：US13296960

    申请日：2011-11-15

    申请人： Jae-guyn Lim ,  Min-seog Choi ,  Won-hee Choi ,  Seong-deok Lee

    发明人： Jae-guyn Lim ,  Min-seog Choi ,  Won-hee Choi ,  Seong-deok Lee

    IPC分类号： G01B9/02

    CPC分类号： G01B9/02027 ,  G01B9/02007 ,  G01B9/02028 ,  G01B9/02091

    摘要： An apparatus and method for optical coherence tomography are provided. The apparatus includes a light source configured to generate a plurality of beams, a light coupler configured to split the plurality of beams into measurement beams and reference beams, transmit the measurement beams to a target object via a probe, and receive response beams from the probe, a detector configured to detect interference signals based on interference between the response beams and the reference beams, and an image processor configured to generate a first image of the target object based on any one of the interference signals and generate a second image of the target object having image characteristics different from those of the first image based on an other one of the interference signals.

    摘要翻译： 提供了一种用于光学相干断层扫描的装置和方法。 该装置包括被配置为产生多个光束的光源，被配置为将多个光束分割成测量光束和参考光束的光耦合器，经由探头将测量光束传送到目标对象，并且从探头接收响应光束 ，被配置为基于所述响应波束和所述参考波束之间的干扰来检测干扰信号的检测器，以及被配置为基于所述干扰信号中的任一个产生所述目标对象的第一图像的图像处理器，并且生成所述目标的第二图像 对象具有基于另一个干扰信号的与第一图像不同的图像特征。

    DEVICE AND MEHTOD FOR CONTROLLING CURVATURE
    2.
    发明申请
    DEVICE AND MEHTOD FOR CONTROLLING CURVATURE 有权
    用于控制曲线的装置和装置

    公开(公告)号：US20130077178A1

    公开(公告)日：2013-03-28

    申请号：US13451653

    申请日：2012-04-20

    申请人： Eun-sung LEE ,  Min-seog CHOI ,  Jong-hyeon CHANG

    发明人： Eun-sung LEE ,  Min-seog CHOI ,  Jong-hyeon CHANG

    IPC分类号： G02B3/14

    CPC分类号： G02B3/14 ,  G02B26/005

    摘要： A curvature control device includes: a first fluid having a light transmitting property and a polarity; a second fluid that has a light transmitting property and is not mixed with the first fluid; a chamber forming an inner space for containing the first fluid F1 and the second fluid F2 and including a lens area in which an interface between the first fluid and the second fluid forms an optical interface, and a plurality of channel areas in which another interface between the first fluid and the second fluid functions as a driving interface for inducing a variation in curvature of the optical interface; and an electrode portion generating an electric field for varying a position of the driving interface.

    摘要翻译： 曲率控制装置包括：具有透光性和极性的第一流体; 具有透光性且不与第一流体混合的第二流体; 形成用于容纳第一流体F1和第二流体F2的内部空间的室，并且包括其中第一流体和第二流体之间的界面形成光学界面的透镜区域，以及多个通道区域， 第一流体和第二流体用作用于引起光学界面的曲率变化的驱动界面; 以及电极部分，其产生用于改变驱动界面的位置的电场。

    PANEL CAMERA, AND OPTICAL TOUCH SCREEN AND DISPLAY APPARATUS EMPLOYING THE PANEL CAMERA
    4.
    发明申请
    PANEL CAMERA, AND OPTICAL TOUCH SCREEN AND DISPLAY APPARATUS EMPLOYING THE PANEL CAMERA 有权
    面板相机，以及使用面板相机的光学触摸屏和显示设备

    公开(公告)号：US20120169669A1

    公开(公告)日：2012-07-05

    申请号：US13244318

    申请日：2011-09-24

    申请人： Hyoung-ki LEE ,  Min-seog CHOI

    发明人： Hyoung-ki LEE ,  Min-seog CHOI

    IPC分类号： G06F3/042 ,  H04N9/04 ,  H04N5/225

    CPC分类号： H04N5/2254 ,  G06F3/042

    摘要： A panel camera, and an optical touch screen and a display apparatus employing the panel camera. The panel camera includes a lens panel comprising a plurality of narrow-angle lenses arranged in a two-dimensional (2D) array and a light-detection panel comprising a plurality of light detectors which are arranged in a 2D array to respectively correspond to the plurality of narrow-angle lenses to receive lights passing through the plurality of narrow-angle lenses from outside and obtain a remote image.

    摘要翻译： 面板照相机，光学触摸屏和采用面板照相机的显示装置。 面板照相机包括：透镜面板，包括以二维（2D）阵列布置的多个窄角度透镜和包括多个光检测器的光检测面板，所述多个光检测器以2D阵列分别对应于多个 的窄角度透镜从外部接收通过多个窄角度透镜的光，并获得远程图像。

    Wafer level incapsulation chip and encapsulation chip manufacturing method
    5.
    发明授权
    Wafer level incapsulation chip and encapsulation chip manufacturing method 有权
    晶圆级封装芯片和封装芯片制造方法

    公开(公告)号：US07906841B2

    公开(公告)日：2011-03-15

    申请号：US11447971

    申请日：2006-06-07

    申请人： Byung-gil Jeong ,  In-sang Song ,  Woon-bae Kim ,  Min-seog Choi ,  Suk-jin Ham ,  Ji-hyuk Lim

    发明人： Byung-gil Jeong ,  In-sang Song ,  Woon-bae Kim ,  Min-seog Choi ,  Suk-jin Ham ,  Ji-hyuk Lim

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/04 ,  H01L21/00

    CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L2924/01079 ,  H01L2924/16235

    摘要： A wafer level encapsulation chip and an encapsulation chip manufacturing method. The encapsulation chip includes a device substrate, a circuit module mounted on the device substrate, a bonding layer deposited on a predetermined area of the device substrate, a protection cap forming a cavity over the circuit module and bonded to the device substrate by the bonding layer and encapsulation portions formed on predetermined areas of the bonding layer and the protection cap. Thus, the present invention can minimize damages to a chip upon chip handling and prevent moisture from being introduced into the inside of the chip.

    摘要翻译： 晶圆级封装芯片和封装芯片制造方法。 封装芯片包括器件衬底，安装在器件衬底上的电路模块，沉积在器件衬底的预定区域上的结合层，在电路模块上形成空腔的保护帽，并通过结合层结合到器件衬底 以及形成在接合层和保护盖的预定区域上的封装部。 因此，本发明可以最大限度地减少芯片处理时对芯片的损害，并防止水分引入芯片内部。

    Wafer level incapsulation chip and encapsulation chip manufacturing method
    6.
    发明申请
    Wafer level incapsulation chip and encapsulation chip manufacturing method 有权
    晶圆级封装芯片和封装芯片制造方法

    公开(公告)号：US20070020817A1

    公开(公告)日：2007-01-25

    申请号：US11447971

    申请日：2006-06-07

    申请人： Byung-gil Jeong ,  In-sang Song ,  Woon-bae Kim ,  Min-seog Choi ,  Suk-jin Ham ,  Ji-hyuk Lim

    发明人： Byung-gil Jeong ,  In-sang Song ,  Woon-bae Kim ,  Min-seog Choi ,  Suk-jin Ham ,  Ji-hyuk Lim

    IPC分类号： H01L21/00

    CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L2924/01079 ,  H01L2924/16235

    摘要： A wafer level encapsulation chip and an encapsulation chip manufacturing method. The encapsulation chip includes a device substrate, a circuit module mounted on the device substrate, a bonding layer deposited on a predetermined area of the device substrate, a protection cap forming a cavity over the circuit module and bonded to the device substrate by the bonding layer and encapsulation portions formed on predetermined areas of the bonding layer and the protection cap. Thus, the present invention can minimize damages to a chip upon chip handling and prevent moisture from being introduced into the inside of the chip.

    摘要翻译： 晶圆级封装芯片和封装芯片制造方法。 封装芯片包括器件衬底，安装在器件衬底上的电路模块，沉积在器件衬底的预定区域上的结合层，在电路模块上形成空腔的保护帽，并通过结合层结合到器件衬底 以及形成在接合层和保护盖的预定区域上的封装部。 因此，本发明可以最大限度地减少在芯片处理时对芯片的损害，并防止水分引入芯片内部。

    Spring structure and micro-structure employing the same
    7.
    发明申请
    Spring structure and micro-structure employing the same 审中-公开
    弹簧结构和微结构采用相同

    公开(公告)号：US20060180409A1

    公开(公告)日：2006-08-17

    申请号：US11315118

    申请日：2005-12-23

    申请人： Soon-cheol Kweon ,  Hyung-jae Shin ,  Sang-hun Lee ,  Min-seog Choi ,  Che-heung Kim ,  Young-tack Houng

    发明人： Soon-cheol Kweon ,  Hyung-jae Shin ,  Sang-hun Lee ,  Min-seog Choi ,  Che-heung Kim ,  Young-tack Houng

    IPC分类号： F16D55/02

    CPC分类号： H01H59/0009 ,  H01H2059/0054

    摘要： A spring structure for supporting a floating member and a micro-structure having the same. The spring structure includes: at least one support post unit fixed to a substrate; and at least one spring unit having a first spring connected to the support post unit and extending in a predetermined direction from the support post unit, a second spring member connected to a floating member and extending in the same direction as the first spring unit from the floating member, and a connection member arranged normal to the first and second spring members and interconnecting the tip ends of the first and second spring members. Because the first spring member and the second spring member are arranged to be expanded or contracted along with the floating member when the temperature changes, the first and second spring members are not subject to stress caused due to the difference in thermal expansion coefficient.

    摘要翻译： 用于支撑浮动元件的弹簧结构和具有该浮动元件的微结构。 弹簧结构包括：固定到基板的至少一个支撑柱单元; 以及至少一个弹簧单元，其具有连接到所述支撑柱单元并且沿着预定方向从所述支撑柱单元延伸的第一弹簧;第二弹簧构件，其连接到浮动构件并沿与所述第一弹簧单元相同的方向从所述第一弹簧单元延伸; 浮动构件和与第一和第二弹簧构件正交布置并且互连第一和第二弹簧构件的末端的连接构件。 由于第一弹簧构件和第二弹簧构件布置成随着温度变化而与浮动构件一起膨胀或收缩，所以第一和第二弹簧构件不会由于热膨胀系数的差异而产生应力。

    Method for manufacturing micro electro-mechanical systems using solder balls
    8.
    发明授权
    Method for manufacturing micro electro-mechanical systems using solder balls 有权
    使用焊球制造微机电系统的方法

    公开(公告)号：US07008817B2

    公开(公告)日：2006-03-07

    申请号：US10784144

    申请日：2004-02-23

    申请人： Woon-bae Kim ,  Sung-hoon Choa ,  Min-seog Choi

    发明人： Woon-bae Kim ,  Sung-hoon Choa ,  Min-seog Choi

    IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC分类号： B81B7/0006 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method for manufacturing micro electro-mechanical systems includes forming an insulation layer on an upper surface of a semiconductor substrate, forming a structure layer on an upper surface of the insulation layer and etching the structure layer, forming an under bump metal on a predetermined position of an upper surface of the structure layer, forming a via hole in a glass substrate corresponding to the position of the under bump metal and in a shape such that the via hole is larger in diameter at an upper surface of the glass substrate than at a lower surface of the glass substrate, wherein the glass substrate is bonded to the upper surface of the structure layer and creates a vacuum chamber that protects a structure of the structure layer, and arranging a solder ball in the via hole and bonding the solder ball to the under bump metal.

    摘要翻译： 一种制造微电子机械系统的方法，包括在半导体衬底的上表面上形成绝缘层，在绝缘层的上表面上形成结构层并蚀刻结构层，在预定位置上形成凹凸金属 所述结构层的上表面在对应于所述凸块下金属的位置的玻璃基板中形成通孔，并且所述通孔在所述玻璃基板的上表面处的直径比在 玻璃基板的下表面，其中玻璃基板结合到结构层的上表面，并且形成保护结构层的结构的真空室，并且在通孔中布置焊球并将焊球接合到 下凸块金属。

    Micro lens, method and apparatus for manufacturing micro lens, and camera module including micro lens
    9.
    发明授权
    Micro lens, method and apparatus for manufacturing micro lens, and camera module including micro lens 有权
    微透镜，用于制造微透镜的方法和装置，以及包括微透镜的相机模块

    公开(公告)号：US08120858B2

    公开(公告)日：2012-02-21

    申请号：US12537283

    申请日：2009-08-07

    申请人： Min-seog Choi ,  Eun-sung Lee ,  Kyu-dong Jung

    发明人： Min-seog Choi ,  Eun-sung Lee ,  Kyu-dong Jung

    IPC分类号： G02B3/00 ,  G02B27/10 ,  B29D11/00

    CPC分类号： B29D11/00375 ,  B29C33/305 ,  B29D11/0048 ,  B29L2011/0016

    摘要： Micro lens manufacturing apparatus, a micro lens manufacturing method, a micro lens, and a camera module employing the micro lens are provided. First mold is manufactured in correspondence with a first lens profile of a lens element. Second mold is manufactured in correspondence with a second lens profile of the lens element. Second mold is aligned on a surface of a lens substrate having a hollow hole formed thereon. Material for the lens element is supplied into the hollow hole of the lens substrate. First mold is aligned on the other surface of the lens substrate having the hollow hole and compressed to form the first and second profiles of the lens element. Formed lens element hardened. First and second molds are separated from each other. Therefore, time and cost for manufacturing the micro lens are reduced, and the accurate alignment between the first and second lens profiles is achieved.

    摘要翻译： 提供微透镜制造装置，微透镜制造方法，微透镜和采用微透镜的相机模块。 与透镜元件的第一透镜轮廓对应地制造第一模具。 与透镜元件的第二透镜轮廓对应地制造第二模具。 第二模具在其上形成有中空孔的透镜基板的表面上对准。 将透镜元件的材料供应到透镜基板的中空孔中。 第一模具在具有中空孔的透镜基板的另一表面上对准，并被压缩以形成透镜元件的第一和第二轮廓。 成型镜片元件硬化。 第一和第二模具彼此分离。 因此，制造微透镜的时间和成本降低，并且实现了第一和第二透镜轮廓之间的精确对准。