Apparatus and method for optical coherence tomography using multiple beams
    1.
    发明授权
    Apparatus and method for optical coherence tomography using multiple beams 有权
    使用多个光束进行光学相干断层扫描的装置和方法

    公开(公告)号:US09170088B2

    公开(公告)日:2015-10-27

    申请号:US13296960

    申请日:2011-11-15

    IPC分类号: G01B9/02

    摘要: An apparatus and method for optical coherence tomography are provided. The apparatus includes a light source configured to generate a plurality of beams, a light coupler configured to split the plurality of beams into measurement beams and reference beams, transmit the measurement beams to a target object via a probe, and receive response beams from the probe, a detector configured to detect interference signals based on interference between the response beams and the reference beams, and an image processor configured to generate a first image of the target object based on any one of the interference signals and generate a second image of the target object having image characteristics different from those of the first image based on an other one of the interference signals.

    摘要翻译: 提供了一种用于光学相干断层扫描的装置和方法。 该装置包括被配置为产生多个光束的光源,被配置为将多个光束分割成测量光束和参考光束的光耦合器,经由探头将测量光束传送到目标对象,并且从探头接收响应光束 ,被配置为基于所述响应波束和所述参考波束之间的干扰来检测干扰信号的检测器,以及被配置为基于所述干扰信号中的任一个产生所述目标对象的第一图像的图像处理器,并且生成所述目标的第二图像 对象具有基于另一个干扰信号的与第一图像不同的图像特征。

    Micro lens, method and apparatus for manufacturing micro lens, and camera module including micro lens
    2.
    发明授权
    Micro lens, method and apparatus for manufacturing micro lens, and camera module including micro lens 有权
    微透镜,用于制造微透镜的方法和装置,以及包括微透镜的相机模块

    公开(公告)号:US08120858B2

    公开(公告)日:2012-02-21

    申请号:US12537283

    申请日:2009-08-07

    IPC分类号: G02B3/00 G02B27/10 B29D11/00

    摘要: Micro lens manufacturing apparatus, a micro lens manufacturing method, a micro lens, and a camera module employing the micro lens are provided. First mold is manufactured in correspondence with a first lens profile of a lens element. Second mold is manufactured in correspondence with a second lens profile of the lens element. Second mold is aligned on a surface of a lens substrate having a hollow hole formed thereon. Material for the lens element is supplied into the hollow hole of the lens substrate. First mold is aligned on the other surface of the lens substrate having the hollow hole and compressed to form the first and second profiles of the lens element. Formed lens element hardened. First and second molds are separated from each other. Therefore, time and cost for manufacturing the micro lens are reduced, and the accurate alignment between the first and second lens profiles is achieved.

    摘要翻译: 提供微透镜制造装置,微透镜制造方法,微透镜和采用微透镜的相机模块。 与透镜元件的第一透镜轮廓对应地制造第一模具。 与透镜元件的第二透镜轮廓对应地制造第二模具。 第二模具在其上形成有中空孔的透镜基板的表面上对准。 将透镜元件的材料供应到透镜基板的中空孔中。 第一模具在具有中空孔的透镜基板的另一表面上对准,并被压缩以形成透镜元件的第一和第二轮廓。 成型镜片元件硬化。 第一和第二模具彼此分离。 因此,制造微透镜的时间和成本降低,并且实现了第一和第二透镜轮廓之间的精确对准。

    Packaging chip having interconnection electrodes directly connected to plural wafers
    3.
    发明授权
    Packaging chip having interconnection electrodes directly connected to plural wafers 有权
    具有直接连接到多个晶片的互连电极的封装芯片

    公开(公告)号:US07786573B2

    公开(公告)日:2010-08-31

    申请号:US11481012

    申请日:2006-07-06

    IPC分类号: H01L23/34 H01R12/16 H05K1/11

    摘要: A packaging chip formed with plural wafers. The packaging chip includes plural wafers stacked in order and plural interconnection electrodes directly connecting the plural wafers from an upper surface of an uppermost wafer of the plural wafers to the other wafers. At least one or more of the plural wafers mounts a predetermined circuit device thereon. Further, at least one or more wafers of the plural wafers have a cavity of a predetermined size. Meanwhile, the packaging chip further includes plural pads independently arranged on the upper surface of the uppermost wafer one another and electrically connected to the plural interconnection electrodes respectively. Accordingly, the present invention can enhance the performance and reliability of a packaging chip and improve fabrication yield.

    摘要翻译: 形成有多个晶片的封装芯片。 封装芯片包括依次堆叠的多个晶片和从多个晶片的最上面的晶片的上表面直接连接多个晶片到另一个晶片的多个互连电极。 多个晶片中的至少一个或多个在其上安装预定的电路装置。 此外,多个晶片的至少一个或多个晶片具有预定尺寸的空腔。 同时,封装芯片还包括独立地布置在最上面的晶片的上表面上并分别电连接到多个互连电极的多个焊盘。 因此,本发明可以提高封装芯片的性能和可靠性,并提高制造成品率。

    PART BEING CENTERED DURING ASSEMBLY PROCESS, WAFER LEVEL PARTS ASSEMBLY, AND APPARATUS AND METHOD TO MANUFACTURE WAFER LEVEL PARTS ASSEMBLY
    4.
    发明申请
    PART BEING CENTERED DURING ASSEMBLY PROCESS, WAFER LEVEL PARTS ASSEMBLY, AND APPARATUS AND METHOD TO MANUFACTURE WAFER LEVEL PARTS ASSEMBLY 有权
    组装过程中的部分中心,水平部件组件,以及制造水平零件组件的装置和方法

    公开(公告)号:US20100050412A1

    公开(公告)日:2010-03-04

    申请号:US12488180

    申请日:2009-06-19

    IPC分类号: B23P11/00 B23P19/00

    摘要: A part to be centered during an assembly process includes an effective portion which performs a function and is shaped for insertion into a hole, a reference portion extended from the effective portion and formed substantially perpendicular to a center axis of the effective portion, and an aligning portion extended from the effective portion and formed around the effective portion. When the effective portion of the part is inserted into the hole, a center of the effective portion is automatically aligned with a centerline of the hole.

    摘要翻译: 在组装过程中要中心的部件包括执行功能并成形为用于插入孔的有效部分,从有效部分延伸并且基本上垂直于有效部分的中心轴线形成的参考部分,以及对准 部分从有效部分延伸并围绕有效部分形成。 当部件的有效部分插入孔中时,有效部分的中心自动与孔的中心线对准。

    Device and method for controlling curvature
    5.
    发明授权
    Device and method for controlling curvature 有权
    用于控制曲率的装置和方法

    公开(公告)号:US08861092B2

    公开(公告)日:2014-10-14

    申请号:US13451653

    申请日:2012-04-20

    IPC分类号: G02B1/06 G02B26/00 G02B3/14

    CPC分类号: G02B3/14 G02B26/005

    摘要: A curvature control device includes: a first fluid having a light transmitting property and a polarity; a second fluid that has a light transmitting property and is not mixed with the first fluid; a chamber forming an inner space for containing the first fluid F1 and the second fluid F2 and including a lens area in which an interface between the first fluid and the second fluid forms an optical interface, and a plurality of channel areas in which another interface between the first fluid and the second fluid functions as a driving interface for inducing a variation in curvature of the optical interface; and an electrode portion generating an electric field for varying a position of the driving interface.

    摘要翻译: 曲率控制装置包括:具有透光性和极性的第一流体; 具有透光性且不与第一流体混合的第二流体; 形成用于容纳第一流体F1和第二流体F2的内部空间的室,并且包括其中第一流体和第二流体之间的界面形成光学界面的透镜区域,以及多个通道区域, 第一流体和第二流体用作用于引起光学界面的曲率变化的驱动界面; 以及电极部分,其产生用于改变驱动界面的位置的电场。

    Electroactive polymer actuator and manufacturing method thereof
    7.
    发明授权
    Electroactive polymer actuator and manufacturing method thereof 有权
    电动聚合物致动器及其制造方法

    公开(公告)号:US07719167B2

    公开(公告)日:2010-05-18

    申请号:US11927827

    申请日:2007-10-30

    IPC分类号: H01L41/08

    摘要: An electroactive polymer actuator and a method for manufacturing the electroactive polymer actuator are provided. The electroactive polymer actuator includes an actuator unit which is a laminate of a plurality of deformation layers; and a support layer which supports the actuator unit so that the actuator unit provides displacement corresponding to a voltage if the voltage is applied to the actuator unit. Therefore, it is possible to provide an electroactive polymer actuator suitable for a compact mobile device with a low driving voltage.

    摘要翻译: 提供电活性聚合物致动器和制造电活性聚合物致动器的方法。 电活性聚合物致动器包括作为多个变形层的层压体的致动器单元; 以及支撑层,其支撑致动器单元,使得如果将电压施加到致动器单元,致动器单元提供对应于电压的位移。 因此,可以提供适合于具有低驱动电压的紧凑型移动设备的电活性聚合物致动器。

    Method for manufacturing micro electro-mechanical systems using solder balls
    8.
    发明申请
    Method for manufacturing micro electro-mechanical systems using solder balls 有权
    使用焊球制造微机电系统的方法

    公开(公告)号:US20050009315A1

    公开(公告)日:2005-01-13

    申请号:US10784144

    申请日:2004-02-23

    摘要: A method for manufacturing micro electro-mechanical systems includes forming an insulation layer on an upper surface of a semiconductor substrate, forming a structure layer on an upper surface of the insulation layer and etching the structure layer, forming an under bump metal on a predetermined position of an upper surface of the structure layer, forming a via hole in a glass substrate corresponding to the position of the under bump metal and in a shape such that the via hole is larger in diameter at an upper surface of the glass substrate than at a lower surface of the glass substrate, wherein the glass substrate is bonded to the upper surface of the structure layer and creates a vacuum chamber that protects a structure of the structure layer, and arranging a solder ball in the via hole and bonding the solder ball to the under bump metal.

    摘要翻译: 一种制造微电子机械系统的方法,包括在半导体衬底的上表面上形成绝缘层,在绝缘层的上表面上形成结构层并蚀刻结构层,在预定位置上形成凹凸金属 所述结构层的上表面在对应于所述凸块下金属的位置的玻璃基板中形成通孔,并且所述通孔在所述玻璃基板的上表面处的直径比在 玻璃基板的下表面,其中玻璃基板结合到结构层的上表面,并且形成保护结构层的结构的真空室,并且在通孔中布置焊球并将焊球接合到 下凸块金属。

    Microelectrofluidic device and method of driving the same
    10.
    发明授权
    Microelectrofluidic device and method of driving the same 有权
    微电磁流体装置及其驱动方法

    公开(公告)号:US09188774B2

    公开(公告)日:2015-11-17

    申请号:US13616572

    申请日:2012-09-14

    IPC分类号: G02B26/02

    CPC分类号: G02B26/02 G02B2207/115

    摘要: A microelectrofluidic device includes: a chamber; a first fluid and a second fluid which are contained in the chamber and are not mixable with each other; and a first electrode group including a plurality of electrodes that are disposed on an inner side of the chamber, and to which a voltage is applied to change an interface between the first fluid and the second fluid, wherein the plurality of electrodes are connected to form a first electrode unit, a second electrode unit, and a third electrode unit that are independently turned on or off, and the plurality of electrodes are annular and coated with an insulating material, and adjacent electrodes are connected to different electrode units.

    摘要翻译: 微电流流体装置包括:腔室; 第一流体和第二流体,其容纳在所述室中并且不能彼此混合; 以及第一电极组,其包括设置在所述室的内侧的多个电极,并且施加电压以改变所述第一流体和所述第二流体之间的界面,其中所述多个电极连接形成 独立地接通或断开的第一电极单元,第二电极单元和第三电极单元,并且多个电极是环形的并且涂覆有绝缘材料,并且相邻的电极连接到不同的电极单元。