摘要:
A head of an inkjet printer is formed by bonding of a heater substrate and a nozzle plate. In order to bond the heater substrate where a heater thin film and a protecting film are vapor-deposited, and the nozzle plate where a nozzle is formed, an intermediate layer is formed by forming a thin film of glass on the heater substrate by vapor-depositing, and the nozzle plate is installed on the heater substrate. SiO2 is formed at an interface between the nozzle plate and the heater thin film due to heating and application of an electric field, and thus the nozzle plate and the heater substrate are bonded with an electrostatic force of SiO2. The nozzle plate and the heater substrate are bonded by using the intermediate layer made of the thin film of glass instead of a general polymer as the bonding layer, thereby preventing swelling of the polymer and isolation of layers of the head occurring due to ink penetration into interfaces of the layers. Moreover, a bonding process is performed in wafer units to improve mass productivity.
摘要:
An ink cartridge and an ink supplying apparatus of an image forming device, which can prevent a deformation of a needle in an ink cartridge mounting operation, an inflow of external air in a printing operation, and an ink leakage, includes a cartridge body having an ink discharging unit, an inner cap disposed in the ink discharging unit to close or selectively seal the ink discharging unit, and having a needle seating groove formed in a shape corresponding to an end of a needle, and an outer cap disposed outside the ink discharging unit. The inner cap is movable in a direction, which opens or selectively unseals the ink discharging unit, when the needle of a needle assembly is used in a combination with the ink cartridge.
摘要:
A laser induced thermal imaging method capable of effectively laminating a donor film and an acceptor substrate using a magnetic force; and a fabricating method of an organic light-emitting diode using the same. The laser induced thermal imaging method includes arranging an acceptor substrate, in which a first magnet is formed in one surface thereof, on a substrate stage in a processing chamber; arranging on the acceptor substrate a donor film including a second magnet; laminating the donor film and the acceptor substrate using a magnetic force acting between the first and second magnets; and transferring at least one region of an imaging layer onto the acceptor substrate by scanning a laser on the donor film. The laser induced thermal imaging method improved adhesion between the donor film and the acceptor substrate improves a life span, a yield and a reliability of the organic light-emitting diode.
摘要:
A laser induced thermal imaging apparatus for imaging an imaging layer of a donor film on an acceptor substrate. The laser induced thermal imaging apparatus includes: a substrate stage having an electromagnet, and adapted to receive an acceptor substrate having a pixel area of the organic light emitting device and a donor film including the organic light emitting layer to be imaged on the pixel area; a laser oscillator for irradiating a laser on the donor film; a contact frame adapted to be located between the substrate stage and the laser oscillator and including an opening portion of a pattern corresponding to a part to be imaged of the donor film and a permanent magnet for forming a magnetic force with the substrate stage; and a contact frame moving mechanism for moving the contact frame toward the substrate stage.
摘要:
An organic light emitting diode, and a method of fabricating the same, the organic light emitting diode including a pixel-defining layer disposed on a substrate, the pixel-defining layer having an opening therein and having at least one stepped portion formed adjacent to the opening, and an organic layer disposed in the opening and at least partially covering the at least one stepped portion.
摘要:
A laser induced thermal imaging (LITI) apparatus and a method of making an electronic device using the same are disclosed. The LITI apparatus includes a chamber, a substrate support, a contact frame, and a laser source or oscillator. The LITI apparatus transfers a transferable layer from a film donor device onto a surface of an intermediate electronic device. The LITI apparatus uses a magnetic force to provide a close contact between the transferable layer and the surface of the intermediate device. The magnetic force is generated by magnetic materials formed in two components of the LITI apparatus that are spaced apart interposing transferable layer and the surface of the intermediate device. Magnets or magnetic materials are formed in the two following components of the LITI apparatus: 1) the intermediate device and the film donor device; 2) the intermediate device and the contact frame; 3) the substrate support and the film donor device; or 4) the substrate support and the contact frame.
摘要:
A laser induced thermal imaging (LITI) apparatus and a method of making an electronic device using the same are disclosed. The LITI apparatus includes a chamber, a substrate support, a contact frame, and a laser source or oscillator. The LITI apparatus transfers a transferable layer from a film donor device onto a surface of an intermediate electronic device. The LITI apparatus uses a magnetic force to provide a close contact between the transferable layer and the surface of the intermediate device. The magnetic force is generated by magnetic materials formed in two components of the LITI apparatus that are spaced apart interposing transferable layer and the surface of the intermediate device. Magnets or magnetic materials are formed in the two following components of the LITI apparatus: 1) the intermediate device and the film donor device; 2) the intermediate device and the contact frame; 3) the substrate support and the film donor device; or 4) the substrate support and the contact frame.
摘要:
A method of compensating a missing nozzle of a printer and a printer using the same. The method includes determining adjacent nozzles corresponding to the missing nozzle, and compensating the missing nozzle by generating dots having an increased size through the adjacent nozzles and generating dots having a normal size through other nozzles when the missing nozzle is generated in the nozzles performing a printing operation. Therefore, it is possible to compensate operations of all color nozzles as well as the black nozzle. As a result, the method of compensating the missing nozzle of the printer compensates operations of the missing nozzle when an image having a composite color is printed as well as when the black image is printed. In addition, it is possible to maintain appropriate image quality by compensating the operation of the missing nozzle through other adjacent nozzles even when a portion of the adjacent nozzles is out of order, since the number of the adjacent nozzles is larger.
摘要:
A deceleration module for extending or retracting a whip antenna. In the deceleration module, a motor unit is installed on the bottom of a body housing, a deceleration unit reduces a rotating force provided coaxially from the motor unit at least twice. A roller unit is integrally formed coaxially with the deceleration module by injection molding, and disposed to roll in an extending and retracting direction of the whip antenna in contact with the outer circumference of the whip antenna.
摘要:
A bonding apparatus and method thereof to bond the bonding portions of an FPC cable to pads of a print head die in order to electrically connect the print head die of an ink jet print head assembly include a stage and a bonding tool. The print head die includes resistive heaters, signal lines connected to the resistive heaters, and electrical pads to connect the signal lines to an outside of the print head die to the FPC cable having conductors having bonding portions facing the pads. The print head die is supported on the stage with the pads facing upward. The bonding tool includes a tip that press bonding portions of the FPC cable against corresponding pads of the print head die placed on the stage, and heats the bonding portions in contact with the pads to bond the bonding portion to the pads. The bonding tool includes a protrusion positioned to align with a position beyond the boundary of the print head die, and that extends lower than the tip, such that, during the bonding operation, the protrusion bends the FPC cable downward. In addition, during the bonding operation, the upper protective film of the FPC cable around the bonding portions are left intact to provide protective layer over the resulting bond, and thus results in less amount of encapsulation over the bond.