利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

7 条记录 (耗时 0.02 秒)

    Pedestal covers
    2.
    发明授权
    Pedestal covers 有权
    基座盖

    公开(公告)号：US08851463B2

    公开(公告)日：2014-10-07

    申请号：US13736410

    申请日：2013-01-08

    申请人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    发明人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    IPC分类号： H01B13/10 ,  G03F7/20

    CPC分类号： H01L21/683 ,  B23Q3/105 ,  H01L21/67161 ,  H01L21/68735 ,  H01L21/68757 ,  H01L21/68785

    摘要： Examples of novel semiconductor processing pedestals, and apparatuses including such pedestals, are described. These pedestals are specifically configured to provide uniform heat transfer to semiconductor substrates and to reduce maintenance complexity and/or frequency. Specifically, a pedestal may include a removable cover positioned over a metal platen of the pedestal. The removable cover is configured to maintain a consistent and uniform temperature profile of its substrate-facing surface even though the platen's upper-surface, which supports the cover and is in thermal communication with the cover, may have a much less uniform temperature profile. The cover may be made from certain ceramic materials and shaped as a thin plate. These materials are resistant to the processing environments and maintain their thermal characteristics over many processing cycles. The cover can be easily removed from the platen and replaced with a new one without a need for major disassembly of the entire apparatus.

    摘要翻译： 描述新颖的半导体处理基座和包括这种基座的设备的例子。 这些基座被特别地构造成能够向半导体基板提供均匀的热传递并且降低维护复杂性和/或频率。 具体地，基座可以包括位于基座的金属台板上的可移除盖。 可拆卸的盖被配置为保持其面向基板的表面的一致和均匀的温度分布，即使支撑盖并与盖热连通的台板的上表面也可能具有不太均匀的温度分布。 盖可以由某些陶瓷材料制成并成形为薄板。 这些材料对加工环境具有耐受性，并在许多加工循环中保持其热特性。 盖子可以很容易地从压板上移除并且被更换，而不需要整个装置的重大拆卸。

    PEDESTAL COVERS
    3.
    发明申请
    PEDESTAL COVERS 有权

    公开(公告)号：US20130122431A1

    公开(公告)日：2013-05-16

    申请号：US13736410

    申请日：2013-01-08

    申请人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    发明人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    IPC分类号： H01L21/683 ,  B23Q3/10

    CPC分类号： H01L21/683 ,  B23Q3/105 ,  H01L21/67161 ,  H01L21/68735 ,  H01L21/68757 ,  H01L21/68785

    摘要： Examples of novel semiconductor processing pedestals, and apparatuses including such pedestals, are described. These pedestals are specifically configured to provide uniform heat transfer to semiconductor substrates and to reduce maintenance complexity and/or frequency. Specifically, a pedestal may include a removable cover positioned over a metal platen of the pedestal. The removable cover is configured to maintain a consistent and uniform temperature profile of its substrate-facing surface even though the platen's upper-surface, which supports the cover and is in thermal communication with the cover, may have a much less uniform temperature profile. The cover may be made from certain ceramic materials and shaped as a thin plate. These materials are resistant to the processing environments and maintain their thermal characteristics over many processing cycles. The cover can be easily removed from the platen and replaced with a new one without a need for major disassembly of the entire apparatus.

    摘要翻译： 描述新颖的半导体处理基座和包括这种基座的设备的例子。 这些基座被特别地构造成能够向半导体基板提供均匀的热传递并且降低维护复杂性和/或频率。 具体地，基座可以包括位于基座的金属台板上的可移除盖。 可拆卸的盖被配置为保持其面向基板的表面的一致和均匀的温度分布，即使支撑盖并与盖热连通的台板的上表面也可能具有不太均匀的温度分布。 盖可以由某些陶瓷材料制成并成形为薄板。 这些材料对加工环境具有耐受性，并在许多加工循环中保持其热特性。 盖子可以很容易地从压板上移除并且被新的盖子替代，而不需要整个装置的重大拆卸。

    PEDESTAL COVERS
    4.
    发明申请
    PEDESTAL COVERS 有权

    公开(公告)号：US20120264051A1

    公开(公告)日：2012-10-18

    申请号：US13086010

    申请日：2011-04-13

    申请人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    发明人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    IPC分类号： G03C11/12 ,  H01L21/477 ,  B23Q3/00

    CPC分类号： H01L21/683 ,  B23Q3/105 ,  H01L21/67161 ,  H01L21/68735 ,  H01L21/68757 ,  H01L21/68785

    摘要： Examples of novel semiconductor processing pedestals, and apparatuses including such pedestals, are described. These pedestals are specifically configured to provide uniform heat transfer to semiconductor substrates and to reduce maintenance complexity and/or frequency. Specifically, a pedestal may include a removable cover positioned over a metal platen of the pedestal. The removable cover is configured to maintain a consistent and uniform temperature profile of its substrate-facing surface even though the platen's upper-surface, which supports the cover and is in thermal communication with the cover, may have a much less uniform temperature profile. The cover may be made from certain ceramic materials and shaped as a thin plate. These materials are resistant to the processing environments and maintain their thermal characteristics over many processing cycles. The cover can be easily removed from the platen and replaced with a new one without a need for major disassembly of the entire apparatus.

    摘要翻译： 描述新颖的半导体处理基座和包括这种基座的设备的例子。 这些基座被特别地构造成能够向半导体基板提供均匀的热传递并且降低维护复杂性和/或频率。 具体地，基座可以包括位于基座的金属台板上的可移除盖。 可拆卸的盖被配置为保持其面向基板的表面的一致和均匀的温度分布，即使支撑盖并与盖热连通的台板的上表面也可能具有不太均匀的温度分布。 盖可以由某些陶瓷材料制成并成形为薄板。 这些材料对加工环境具有耐受性，并在许多加工循环中保持其热特性。 盖子可以很容易地从压板上移除并且被更换，而不需要整个装置的重大拆卸。

    Pedestal covers
    6.
    发明授权
    Pedestal covers 有权
    基座盖

    公开(公告)号：US08371567B2

    公开(公告)日：2013-02-12

    申请号：US13086010

    申请日：2011-04-13

    申请人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    发明人： Ivelin Angelov ,  Brian Severson ,  Natan Solomon

    IPC分类号： B23Q3/00 ,  H01L21/306 ,  C23F1/00

    CPC分类号： H01L21/683 ,  B23Q3/105 ,  H01L21/67161 ,  H01L21/68735 ,  H01L21/68757 ,  H01L21/68785

    摘要： Examples of novel semiconductor processing pedestals, and apparatuses including such pedestals, are described. These pedestals are specifically configured to provide uniform heat transfer to semiconductor substrates and to reduce maintenance complexity and/or frequency. Specifically, a pedestal may include a removable cover positioned over a metal platen of the pedestal. The removable cover is configured to maintain a consistent and uniform temperature profile of its substrate-facing surface even though the platen's upper-surface, which supports the cover and is in thermal communication with the cover, may have a much less uniform temperature profile. The cover may be made from certain ceramic materials and shaped as a thin plate. These materials are resistant to the processing environments and maintain their thermal characteristics over many processing cycles. The cover can be easily removed from the platen and replaced with a new one without a need for major disassembly of the entire apparatus.

    摘要翻译： 描述新颖的半导体处理基座和包括这种基座的设备的例子。 这些基座被特别地构造成能够向半导体基板提供均匀的热传递并且降低维护复杂性和/或频率。 具体地，基座可以包括位于基座的金属台板上的可移除盖。 可拆卸的盖被配置为保持其面向基板的表面的一致和均匀的温度分布，即使支撑盖并与盖热连通的台板的上表面也可能具有不太均匀的温度分布。 盖可以由某些陶瓷材料制成并成形为薄板。 这些材料对加工环境具有耐受性，并在许多加工循环中保持其热特性。 盖子可以很容易地从压板上移除并且被新的盖子替代，而不需要整个装置的重大拆卸。