公开(公告)号：US4978224A

公开(公告)日：1990-12-18

申请号：US218311

申请日：1988-07-12

申请人： Shin Kishimoto ,  Toshihide Morimoto ,  Nobuaki Kakimori ,  Yuho Takahashi ,  Morihide Ohsaki

发明人： Shin Kishimoto ,  Toshihide Morimoto ,  Nobuaki Kakimori ,  Yuho Takahashi ,  Morihide Ohsaki

IPC分类号： H05K13/08

CPC分类号： H05K13/08

摘要： To determine whether chip components are properly mounted on a printed circuit board, two sets of slit light beams for projecting slit line images in mutually perpendicular directions are alternately made incident thereon diagonally from above. Edges of the mounted chip components produce discontinuities in the projected slit beam image patterns such that the positions, sizes, orientations, etc. of individual mounted components can be calculated from image data obtained from viewing positions above the circuit board by a camera or the like. Since it can be easily ascertained how the slit line image pattern should appear if proper components are properly mounted, an analysis of the calculated data can indicate whether the chip components are properly mounted on the tested printed circuit board.

摘要翻译： 为了确定芯片部件是否正确地安装在印刷电路板上，两组用于在相互垂直的方向上突出切割线图像的狭缝光束交替地从上方沿对角线入射。 安装的芯片部件的边缘在投影的狭缝光束图像图案中产生不连续性，使得可以通过相机等从电路板上方的观看位置获得的图像数据计算各个安装部件的位置，尺寸，取向等 。 由于可以容易地确定如果适当的部件正确地安装时，切口线图像图案应如何出现，所以计算出的数据的分析可以指示芯片部件是否正确安装在测试的印刷电路板上。

公开(公告)号：US5450204A

公开(公告)日：1995-09-12

申请号：US37358

申请日：1993-03-26

申请人： Yoshihide Shigeyama ,  Nobuaki Kakimori ,  Yuichi Yamamoto ,  Yutaka Iwata ,  Kengo Nishigaki ,  Shin Kishimoto

发明人： Yoshihide Shigeyama ,  Nobuaki Kakimori ,  Yuichi Yamamoto ,  Yutaka Iwata ,  Kengo Nishigaki ,  Shin Kishimoto

IPC分类号： G01B11/24 ,  G01N21/89 ,  G01N21/956 ,  G01R31/309 ,  G06T1/00 ,  H05K3/34 ,  H05K13/08 ,  G01B11/14 ,  G01B11/28

CPC分类号： G01N21/95607 ,  G01R31/309 ,  H05K13/08 ,  G01N2021/8887 ,  G01N2021/8905 ,  G01N2021/8908 ,  G01N2021/95646

摘要： An inspecting device inspects the printed state of cream solder by projecting a plurality of light patterns varying in phase onto a printed circuit board printed with cream solder, and processing signals obtained by an image pick-up device for picking up the image on the surface of the printed circuit board using a phase shifting method. A printed position, area, thickness or amount of the cream solder can be detected. By comparing the data thus obtained with reference data, the printed state is evaluated. The printed state of the cream solder may be examined quickly and positively, while a continuous automatic processing can be effected without stopping the mounting process of the printed circuit board in a production line.

摘要翻译： 检查装置通过将多个相位不同的光图案投影到印有膏状焊料的印刷电路板上，检查膏状焊料的印刷状态，以及由图像拾取装置获得的处理信号，以拾取表面上的图像 印刷电路板采用相移法。 可以检测出膏状焊料的印刷位置，面积，厚度或量。 通过将如此获得的数据与参考数据进行比较，评估打印状态。 可以快速，积极地检查膏状焊料的印刷状态，而可以在不停止印刷电路板在生产线中的安装过程的情况下进行连续的自动处理。