摘要:
A liquid treatment apparatus treating a surface of a substrate held generally horizontally on a stage in a housing by supplying a treating liquid to said surface from a supply nozzle. The liquid treatment apparatus includes a cup body provided so as to surround the substrate held in the substrate holding part laterally, the cup body being mounted detachably to a base inside the housing from an upward direction thereof; a cup body holding part holding the cup body detachably; and an elevating mechanism moving the cup body holding part up and down between a first position at which the cup body is mounted upon the base body and a second position located above the first position.
摘要:
Disclosed is a liquid processing apparatus including first and second cups installed so as to surround a rotation holding unit of a substrate and guide a processing liquid scattered from the rotating substrate downwards. A first driving unit and a second driving unit elevate the first cup and the second cup between a position receiving the processing liquid and the lower position thereof. A controller controls that the first cup and the second cup are ascended at the same time by transferring the driving force of the first driving unit while the first cup or a first elevating member thereof is overlapped with the second cup or a second elevating member thereof from the lower side by setting the ascending speed of the first cup to be higher than the ascending speed of the second cup when the first and second cups are ascended at the same time.
摘要:
A coating apparatus includes a driving unit configured to rotate a substrate holding member about a vertical axis to spread a coating liquid supplied on a front side central portion of a substrate toward a front side peripheral portion of the substrate by a centrifugal force. The apparatus is provided with a wobble damping mechanism including a gas delivery port and a suction port both disposed to face a back side of the substrate and configured to damp a wobble of the substrate being rotated by delivering a gas from the delivery port and sucking the gas into the suction port.
摘要:
A substrate liquid processing apparatus of the present invention includes a guide rotary cup configured to guide a process-liquid scattering from a substrate rotating and being held by a substrate holding table and a guide cup configured to guide downward the process-liquid guided by the guide rotary cup. The guide cup includes a downward extension portion extending downward from an inner peripheral end portion of a guide cup body and an inner peripheral extension portion extending inward from the inner peripheral end portion more than the downward extension portion. The inner peripheral extension portion is configured to form a gas guide space together with the guide rotary cup and the downward extension portion so that a gas turning by the rotation of the guide rotary cup can be guided downward.
摘要:
A liquid treatment apparatus treating a surface of a substrate held generally horizontally on a stage in a housing by supplying a treating liquid to said surface from a supply nozzle. The liquid treatment apparatus includes a cup body provided so as to surround the substrate held in the substrate holding part laterally, the cup body being mounted detachably to a base inside the housing from an upward direction thereof; a cup body holding part holding the cup body detachably; and an elevating mechanism moving the cup body holding part up and down between a first position at which the cup body is mounted upon the base body and a second position located above the first position.
摘要:
A spin chuck rotatably holds a semiconductor wafer, while resist is dropped on a surface of the semiconductor wafer through a resist application nozzle and thus applied thereon, and before the resist applied on the wafer dries, a cleaning liquid is supplied through a bevel cleaning nozzle to a portion of the wafer located at a peripheral portion thereof in a vicinity of a beveled portion to remove the resist adhering to the beveled portion. Thereafter, a film of the resist that is formed on the surface of the wafer is dried.
摘要:
A substrate liquid processing apparatus includes a placement table configured to hold a substrate, a rotary driving unit configured to rotate the placement table, a liquid supply unit configured to supply a liquid to the substrate placed on the placement table, and an upper liquid guide cup, a central liquid guide cup, and a lower liquid guide cup which are disposed in this order from the top and are configured to guide downward the liquid scattering from the rotating substrate being placed on the placement table. A driving mechanism is configured to move up and down the upper liquid guide cup, the central liquid guide cup, and the lower liquid guide cup. The driving mechanism is connected to the central liquid guide cup.
摘要:
Disclosed is a liquid processing apparatus and a liquid processing method that can prevent a processing liquid from being left on a lift pin after a drying-out process of a substrate, thereby preventing the processing liquid from being attached to the back surface of the substrate after the liquid processing. The liquid processing apparatus of the present disclosure includes a holding plate that supports a substrate, a lift pin plate provided above the holding plate having a lift pin that supports the wafer from a lower side, and a processing liquid supply unit that supplies the processing liquid to the back surface of the wafer. The processing liquid supply unit is provided with a head part configured to close a penetrating hole of the lift pin plate. The processing liquid supply unit and the lift pin plate are configured to be elevated with respect to the holding plate.
摘要:
Disclosed are a flow path switching apparatus and a fluid processing apparatus having a liquid processing unit that performs a processing by supplying different kinds of processing fluid to wafer W at different timings. The atmosphere of the liquid processing unit is discharged fluid to a plurality of exclusive exhaust paths through exhaust paths and flow path switching units. A flow path switching unit includes an outer tube having a plurality of connection holes and a rotary tube inserted into the outer tube having a plurality of openings. In particular, one of the plurality of openings of the rotary tube is aligned with one of the plurality of connection holes of the outer tube in such a way that only an aligned set of an opening of the rotary tube and a connection hole of the outer tube is sequentially communicated during the rotation of the rotary tube.
摘要:
A coating method includes holding a substrate in a horizontal state on a substrate holding member; supplying a coating liquid onto a front side central portion of the substrate held on the substrate holding member; rotating the substrate holding member about a vertical axis to spread the coating liquid supplied on the front side central portion of the substrate toward a front side peripheral portion of the substrate by a centrifugal force; and damping a wobble of the substrate being rotated, by a wobble damping mechanism including a gas delivery port and a suction port both disposed to face a back side of the substrate, while delivering a gas from the delivery port and sucking the gas into the suction port.