公开(公告)号：US09142598B2

公开(公告)日：2015-09-22

申请号：US13527923

申请日：2012-06-20

申请人： Hideto Ohnuma ,  Noriko Miyairi ,  Naoyuki Senda

发明人： Hideto Ohnuma ,  Noriko Miyairi ,  Naoyuki Senda

IPC分类号： H01L29/18 ,  H01L51/40 ,  H01L27/32 ,  H01L51/00 ,  H01L51/50 ,  H01L51/52

CPC分类号： H01L51/5206 ,  H01L27/3246 ,  H01L27/326 ,  H01L51/0002 ,  H01L51/0021 ,  H01L51/0052 ,  H01L51/0054 ,  H01L51/0058 ,  H01L51/006 ,  H01L51/0072 ,  H01L51/0074 ,  H01L51/0085 ,  H01L51/5012 ,  H01L51/52 ,  H01L51/5203 ,  H01L51/5221 ,  H01L51/56 ,  H01L2251/558

摘要： To provide a light-emitting panel in which the occurrence of crosstalk is suppressed. To provide a method for manufacturing a light-emitting panel in which the occurrence of crosstalk is suppressed. The light-emitting panel includes a first electrode of one light-emitting element, a first electrode of the other light-emitting element, and an insulating partition which separates the two first electrodes. A portion with a thickness A1 smaller than a thickness A0 of a portion of the layer containing a light-emitting organic compound, which overlaps with a side surface of the partition, is included. The ratio (B1/B0) of a thickness B1 of a portion of the second electrode, which overlaps with a side surface of the partition, to a thickness B0 of a portion of the second electrode, which overlaps with the first electrode, is higher than the ratio (A1/A0).

摘要翻译： 提供抑制串扰发生的发光面板。 提供抑制串扰发生的发光面板的制造方法。 发光面板包括一个发光元件的第一电极，另一个发光元件的第一电极和分离两个第一电极的绝缘隔板。 包括厚度A1小于包含与隔板的侧表面重叠的发光有机化合物的层的一部分的厚度A0的部分。 第二电极的与隔板的侧面重叠的部分的厚度B1与第一电极重叠的部分的厚度B0的比（B1 / B0）更高 比（A1 / A0）。

公开(公告)号：US20120326201A1

公开(公告)日：2012-12-27

申请号：US13527923

申请日：2012-06-20

申请人： Hideto OHNUMA ,  Noriko MIYAIRI ,  Naoyuki SENDA

发明人： Hideto OHNUMA ,  Noriko MIYAIRI ,  Naoyuki SENDA

IPC分类号： H01L33/36

CPC分类号： H01L51/5206 ,  H01L27/3246 ,  H01L27/326 ,  H01L51/0002 ,  H01L51/0021 ,  H01L51/0052 ,  H01L51/0054 ,  H01L51/0058 ,  H01L51/006 ,  H01L51/0072 ,  H01L51/0074 ,  H01L51/0085 ,  H01L51/5012 ,  H01L51/52 ,  H01L51/5203 ,  H01L51/5221 ,  H01L51/56 ,  H01L2251/558

摘要： To provide a light-emitting panel in which the occurrence of crosstalk is suppressed. To provide a method for manufacturing a light-emitting panel in which the occurrence of crosstalk is suppressed. The light-emitting panel includes a first electrode of one light-emitting element, a first electrode of the other light-emitting element, and an insulating partition which separates the two first electrodes. A portion with a thickness A1 smaller than a thickness A0 of a portion of the layer containing a light-emitting organic compound, which overlaps with a side surface of the partition, is included. The ratio (B1/B0) of a thickness B1 of a portion of the second electrode, which overlaps with a side surface of the partition, to a thickness B0 of a portion of the second electrode, which overlaps with the first electrode, is higher than the ratio (A1/A0).

摘要翻译： 提供抑制串扰发生的发光面板。 提供抑制串扰发生的发光面板的制造方法。 发光面板包括一个发光元件的第一电极，另一个发光元件的第一电极和分离两个第一电极的绝缘隔板。 包括厚度A1小于包含与隔板的侧表面重叠的发光有机化合物的层的一部分的厚度A0的部分。 第二电极的与隔板的侧面重叠的部分的厚度B1与第一电极重叠的部分的厚度B0的比（B1 / B0）更高 比（A1 / A0）。

公开(公告)号：US06797626B2

公开(公告)日：2004-09-28

申请号：US10331070

申请日：2002-12-27

申请人： Noriko Miyairi ,  Yasuo Inada ,  Tsuyoshi Hasegawa ,  Yuji Terashima ,  Kenji Sakai ,  Tadahiro Kitamura ,  Takahiro Umeda

发明人： Noriko Miyairi ,  Yasuo Inada ,  Tsuyoshi Hasegawa ,  Yuji Terashima ,  Kenji Sakai ,  Tadahiro Kitamura ,  Takahiro Umeda

IPC分类号： H01L21302

CPC分类号： B24B37/30 ,  C09G1/02 ,  H01L21/3212 ,  H05K3/26 ,  H05K3/383 ,  H05K3/4644 ,  H05K2203/025 ,  H05K2203/121

摘要： The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the substrate onto the polishing pad, with a backing pad, by a press head; relatively rotating the press head with respect to the polishing plate, with supplying polishing slurry onto the polishing pad. The backing pad is made of a material whose Asker C hardness is 75-95 and whose compressibility is 10% or less. The polishing slurry includes a chelating agent for chelating copper, an etching agent for etching the surface of copper layer, an oxidizing agent for oxidizing the surface of copper layer, and water.

摘要翻译： 抛光基板的铜层的方法能够提高原料去除率等。该方法包括以下步骤：将基板供给到具有面向抛光垫的铜层的抛光板的抛光垫上; 用衬垫将衬底用衬垫压入抛光垫上; 相对于抛光板相对地旋转压头，同时将抛光浆料供应到抛光垫上。 衬垫由Asker C硬度为75-95且压缩率为10％以下的材料制成。 抛光浆料包括用于螯合铜的螯合剂，用于蚀刻铜层表面的蚀刻剂，用于氧化铜层表面的氧化剂和水。