-
公开(公告)号：US06797626B2
公开(公告)日：2004-09-28
申请号：US10331070
申请日：2002-12-27
申请人： Noriko Miyairi , Yasuo Inada , Tsuyoshi Hasegawa , Yuji Terashima , Kenji Sakai , Tadahiro Kitamura , Takahiro Umeda
发明人： Noriko Miyairi , Yasuo Inada , Tsuyoshi Hasegawa , Yuji Terashima , Kenji Sakai , Tadahiro Kitamura , Takahiro Umeda
IPC分类号： H01L21302
CPC分类号： B24B37/30 , C09G1/02 , H01L21/3212 , H05K3/26 , H05K3/383 , H05K3/4644 , H05K2203/025 , H05K2203/121
摘要： The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the substrate onto the polishing pad, with a backing pad, by a press head; relatively rotating the press head with respect to the polishing plate, with supplying polishing slurry onto the polishing pad. The backing pad is made of a material whose Asker C hardness is 75-95 and whose compressibility is 10% or less. The polishing slurry includes a chelating agent for chelating copper, an etching agent for etching the surface of copper layer, an oxidizing agent for oxidizing the surface of copper layer, and water.
摘要翻译： 抛光基板的铜层的方法能够提高原料去除率等。该方法包括以下步骤：将基板供给到具有面向抛光垫的铜层的抛光板的抛光垫上; 用衬垫将衬底用衬垫压入抛光垫上; 相对于抛光板相对地旋转压头，同时将抛光浆料供应到抛光垫上。 衬垫由Asker C硬度为75-95且压缩率为10％以下的材料制成。 抛光浆料包括用于螯合铜的螯合剂，用于蚀刻铜层表面的蚀刻剂，用于氧化铜层表面的氧化剂和水。
-
2.发明授权Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat 失效具有取向平面的镜面抛光晶圆倒角的方法和装置公开(公告)号：US06332828B1
公开(公告)日：2001-12-25
申请号：US09613870
申请日：2000-07-11
IPC分类号： B24B906
摘要： A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed Ns has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed Ns according to the detected wafer mirror-like polishing position.
摘要翻译： 公开了一种通过在被预定压力的旋转缓冲轮按压的状态下旋转晶片而具有取向平坦的晶片的倒角镜状抛光方法。 用相对简单的控制系统可以获得镜面抛光稳定的晶圆倒角。 本发明的前提是，晶片旋转速度Ns具有低惯性质量和低转速，因此与按压压力控制和缓冲轮控制相比，可以获得具有高响应特性和高精度的晶片转速控制，并且 根据检测晶片反射镜抛光位置的检测装置的检测信号，根据检测到的晶片反射镜抛光位置来控制晶片转速Ns，检测晶片的固有外围部分，拐角和定向平面部分。
-
公开(公告)号：US5549502A
公开(公告)日：1996-08-27
申请号：US162679
申请日：1993-12-06
CPC分类号： B24B37/345
摘要： A grinding method and apparatus having a position aligning mechanism to correctly achieve the centering of each work on a work table and locate an orientation flat part of each work at a predetermined position, and a displacing mechanism for reciprocally slidably displacing a top ring and the work table in order to assure that the center of each work is positionally aligned with the center of each top ring at an original position after completion of the centering of each work on the work table and the locating of the orientation flat part, and subsequently, centering each top ring with the gravitational center of each work so as to cancel a positional offset state prior to holding the work with the top ring to thrust the work against the grinding or polishing surface. The invention also includes a polishing method and apparatus in which both of a top ring and a rotary disc are reciprocally slidably displaced to improve the polishing efficiency of the device.
摘要翻译： 一种磨削方法和装置，其具有位置对准机构，以正确地实现每个工件在工作台上的对中并将每个工件的定向平面部分定位在预定位置，以及位移机构，用于可往复地滑动地移动顶环和工件 以确保每个工件的中心在完成每个工件在工作台上的定心和定位平面部分的定位之后在原始位置与每个顶环的中心位置对准，然后定心 每个顶环具有每个工件的重力中心，以便在用顶环保持工件之前取消位置偏移状态，以将工件推向研磨或抛光表面。 本发明还包括抛光方法和装置，其中顶环和旋转盘都可往复滑动地移位，以提高装置的抛光效率。
-
公开(公告)号：US5766065A
公开(公告)日：1998-06-16
申请号：US567162
申请日：1995-12-05
IPC分类号： B24B9/00 , B24B9/06 , H01L21/304 , B24B5/00
CPC分类号： B24B9/065
摘要： A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.
-
公开(公告)号：US4664333A
公开(公告)日：1987-05-12
申请号：US780296
申请日：1985-09-26
申请人： Yasuo Inada , Koki Sato , Takazo Fujii , Hideo Yokoyama , Shoichi Takahashi , Kiyoshi Mizutani , Takayoshi Kawashima , Akira Nagawa
发明人： Yasuo Inada , Koki Sato , Takazo Fujii , Hideo Yokoyama , Shoichi Takahashi , Kiyoshi Mizutani , Takayoshi Kawashima , Akira Nagawa
CPC分类号： B60R22/12 , D03D1/0005 , Y10S242/918
摘要： An occupant restraining webbing employed in a seatbelt system for a vehicle includes warp which has a dry tenacity of 8.8 gr/De or more, a thickness of 1,700 De or less and a twist multiplier of 3,100 to 5,500. Thus, it is possible to reduce the extra amount by which the webbing is undesirably wound off after the rotation of a takeup shaft for winding off the webbing from a webbing retractor has ceased.
摘要翻译： 在车辆用安全带系统中使用的乘员约束用织带包括具有8.8g /□或更大的干强度，1700De以下的厚度和3,100-5,500的扭曲乘数的经纱。 因此，可以减少在从织带卷收器卷绕的卷绕轴的旋转之后织带不期望地卷起的额外的量。
-
公开(公告)号：US06361418B1
公开(公告)日：2002-03-26
申请号：US09547659
申请日：2000-04-12
申请人： Yasuo Inada
发明人： Yasuo Inada
IPC分类号： B24B700
CPC分类号： B24B37/08 , B24B37/345 , B24B49/12
摘要： The abrasive system of the present invention is capable of automatically and efficiently feeding and discharging work pieces. In the abrasive system, an upper abrasive plate and a lower abrasive plate pinch the work pieces, which are provided in through-holes of a carrier and abrade both faces of each work piece. A carrier driving mechanism moves the carrier, along a circular orbit, without spinning, together with the work pieces. Stopping means stops the movement of the carrier at a predetermined position. The feeding-and-discharging means includes: an arm robot having a work holding unit, which is provided to a front end and capable of holding and releasing the work piece; and an image processing unit for recognizing shapes and positions of the through-holes of the carrier and the work pieces.
摘要翻译： 本发明的磨料系统能够自动且有效地进给和排出工件。 在研磨系统中，上研磨板和下研磨板夹紧工件，其被设置在载体的通孔中并磨损每个工件的两个面。 载体驱动机构与工件一起沿着圆形轨道移动载体而不旋转。 停止装置停止载体在预定位置的移动。 送出装置包括：臂机器人，其具有工件保持单元，该工件保持单元设置在前端并能够保持和释放工件; 以及图像处理单元，用于识别载体和工件的通孔的形状和位置。
-
公开(公告)号：US4876143A
公开(公告)日：1989-10-24
申请号：US881697
申请日：1986-07-03
申请人： Minoru Sugita , Teruyuki Nakatsuji , Tadashi Fujisaki , Minoru Sawaide , Noboru Ishikawa , Yasuo Inada
发明人： Minoru Sugita , Teruyuki Nakatsuji , Tadashi Fujisaki , Minoru Sawaide , Noboru Ishikawa , Yasuo Inada
IPC分类号： B05D7/20 , B29C70/06 , B29C70/08 , B29C70/10 , B29C70/20 , B29C70/22 , B29D99/00 , B29L31/06 , C04B16/06 , C04B32/02 , C08J5/04 , E04C5/07
CPC分类号： B29D99/0046 , B29C70/088 , B29C70/20 , B29C70/222 , E04C5/07 , B29L2031/06 , Y10T428/249943 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/29 , Y10T428/2913 , Y10T428/2922 , Y10T428/2933 , Y10T428/2951 , Y10T428/2953 , Y10T428/2962 , Y10T428/2964 , Y10T428/2969
摘要： A rob material includes an elongated matrix made of synthetic resin, a plurality of first elongated textile elements, and a plurality of second elongated textile elements, the first and second elements being embeded within the matrix, parallel to each other along the matrix, each of the first elements being composed of a plurality of yarns braided together, the second elements having a lower breaking elongation rate than said first elements. In such a rod material, the second elements have a substantially complete elasticity, and the first elements have such an elongation rate as to elongate further after the fracture of the second elements. Therefore, the stress-strain curve of the rod material shows a high elastic modulus in the elastic region and a high breaking elongation rate. In other words, the stress-strain behavior is similar to that of steel rods.
摘要翻译： 抢劫材料包括由合成树脂制成的细长矩阵，多个第一细长织物元件和多个第二细长织物元件，第一和第二元件被嵌入矩阵内，沿矩阵彼此平行，每个 第一元件由编织在一起的多根纱线组成，第二元件具有比所述第一元件低的断裂伸长率。 在这种棒状材料中，第二元件具有基本上完全的弹性，并且第一元件具有在第二元件断裂之后进一步伸长的伸长率。 因此，棒材的应力 - 应变曲线在弹性区域表现出高的弹性模量和高的断裂伸长率。 换句话说，应力 - 应变行为与钢筋相似。
-
公开(公告)号：US5928066A
公开(公告)日：1999-07-27
申请号：US993989
申请日：1997-12-18
摘要： A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.
摘要翻译： 公开了半导体晶片的外围倒角部分的抛光装置。 抛光装置包括：围绕其周边的旋转鼓，其上缠绕有其上的研磨层的带; 用于旋转所述旋转滚筒的第一马达; 晶片保持机构，其包括用于保持晶片的晶片保持部件，用于旋转晶片保持部件的第二电动机，用于支撑晶片保持部件和第二电动机的支撑部件，以及用于改变晶片保持部件的倾斜角度的晶片倾斜部件 所述晶片相对于所述旋转鼓通过使所述支撑构件在基本上平行于所述晶片的主表面的第一轴线上往复旋转; 以及移动构件，用于使保持在支撑构件上的晶片与缠绕在旋转鼓上的带接触或分离。
-
公开(公告)号：US5879225A
公开(公告)日：1999-03-09
申请号：US834612
申请日：1997-04-14
申请人： Michio Kudo , Yasuo Inada , Makoto Nakajima , Masanori Fukushima
发明人： Michio Kudo , Yasuo Inada , Makoto Nakajima , Masanori Fukushima
IPC分类号： B24B37/10 , B24B37/12 , B24B47/10 , H01L21/304 , B24B7/22
CPC分类号： B24B37/105 , B24B47/10
摘要： A polishing machine of the present invention is capable of uniformly polishing a member to be polished with high flatness, and polishing cloth, which is employed in the polishing machine, is uniformly abraded. In the polishing machine, a polishing plate is capable of rotating. A supporting table rotatably supports the polishing plate. A rotary driving mechanism is mounted on the supporting table, and it rotates the polishing plate. A base supports the supporting table. An orbital driving mechanism moves the supporting table along a circular orbit without spinning about its own axis.
摘要翻译： 本发明的抛光机能够以高的平坦度均匀地研磨待抛光的部件，并且在抛光机中使用的抛光布被均匀地磨损。 在抛光机中，抛光板能够旋转。 支撑台可旋转地支撑抛光板。 旋转驱动机构安装在支撑台上，并使抛光板旋转。 基座支撑支撑台。 轨道驱动机构沿着圆形轨道移动支撑台，而不绕其自身的轴线旋转。
-
公开(公告)号：US5733181A
公开(公告)日：1998-03-31
申请号：US329952
申请日：1994-10-27
CPC分类号： B24B21/002 , B24B9/065
摘要： An apparatus for polishing the notch of a wafer in an effective and efficient way, which comprises: a flexible tape carrying abrasive grains in the working face thereof; an infeed reel for feeding the tape stored thereon: a take-up reel for taking up the tape fed from the infeed reel; a motor for driving to rotate the take-up reel; a means for blowing a fluid to the backside surface to the edge portion of the notch to be in direct contact along the full periphery of the notch; and a means for oscillating the tape sideways.
摘要翻译： 一种用于以有效和有效的方式抛光晶片的凹口的装置，其包括：在其工作面中承载磨料颗粒的柔性带; 用于馈送存储在其上的带的进给卷轴;卷取卷轴，用于卷取从进料卷轴进给的带; 用于驱动旋转卷取卷轴的马达; 用于将流体吹送到所述凹口的所述边缘部分的所述后侧表面沿着所述凹口的整个周边直接接触的装置; 以及用于横向摆动带的装置。
-
-
-
-
-
-
-
-
-
搜索结果
14 条记录 (耗时 0.026 秒)