Abstract:
An integrated circuit (IC), IC assembly and circuit for distributing a clock signal in an integrated circuit includes a capacitive clock distribution circuit having at least one conductor therein. At least one inductor is formed in a metal layer of the integrated circuit and is coupled to the clock distribution circuit. The inductor, generally in the form of a number of spiral inductors distributed throughout the integrated circuit, provides an inductance value selected to resonate with the capacitive clock distribution circuit at resonance, power dissipation is reduced while skew and jitter performance can be improved.
Abstract:
A circuit for measuring timing uncertainty in a clocked digital path and in particular, the number of logic stages completed in any clock cycle. A local clock buffer receives a global clock and provides a complementary pair of local clocks. A first local (launch) clock is an input to a delay line, e.g., 3 clock cycles worth of series connected inverters. Delay line taps (inverter outputs) are inputs to a register that is clocked by the complementary clock pair to capture progression of the launch clock through the delay line and identify any variation (e.g., from jitter, VDD noise) in that progression. Global clock skew and across chip gate length variation can be measured by cross coupling launch clocks from a pair of such clock buffers and selectively passing the local and remote launch clocks to the respective delay lines.
Abstract:
A capacitive bend sensor includes a first element having a comb-patterned portion of conducting material, and a second element having a comb-patterned portion of conducting material. A dielectric material is disposed between the comb-patterned portion of the first element and the comb-patterned portion of the second element. The first element is bonded to the second element such that the comb-patterned portion of the first element slides relative to the comb-patterned portion of the second element when the first and second elements are bent. Bend angle is measured according to the alignment of the comb-patterned portion of the first element and the comb-patterned portion of the second element. The sensor may be coupled to a human finger to measure bend angle of the finger, or may be coupled to a joint of a human body to measure bend angle of the joint.
Abstract:
A method is provided for managing power distribution on a three-dimensional chip stack having two or more strata, a plurality of vertical power delivery structures, and multiple stack components. At least two stack components are on different strata. Operating modes are stored that respectively have different power dissipations. A respective effective power budget is determined for each of the at least two stack components based on respective ones of the operating modes targeted therefor, and power characteristics and thermal characteristics of at least some of the stack components inclusive or exclusive of the at least two stack components. The respective ones of the plurality of operating modes targeted for the at least two stack components are selectively accepted or re-allocated based on the respective effective power budget for each of the at least two stack components, power constraints, and thermal constraints. The power constraints include vertical structure electrical constraints.
Abstract:
A circuit and method for measuring duty cycle uncertainty in an on-chip global clock. A global clock is provided to a delay line at a local clock buffer. Delay line taps (inverter outputs) are inputs to a register that is clocked by the local clock buffer. The register captures clock edges, which are filtered to identify a single location for each edge. Imbalance in space between the edges indicated imbalance in duty cycle. Up/down signals are generated from any imbalance and passed to a phase locked loop to adjust the balance.
Abstract:
A method is provided for managing power distribution on a 3D chip stack having two or more strata, a plurality of vertical power delivery structures, and multiple stack components. At least two stack components are on different strata. Operating modes are stored that respectively have different power dissipations. A respective effective power budget is determined for each of the at least two stack components based on respective ones of the operating modes targeted therefor, and power characteristics and thermal characteristics of at least some of the stack components inclusive or exclusive of the at least two stack components. The respective ones of the plurality of operating modes targeted for the at least two stack components are selectively accepted or re-allocated based on the respective effective power budget for each of the at least two stack components, power constraints, and thermal constraints. The power constraints include vertical structure electrical constraints.
Abstract:
A circuit and method for measuring duty cycle uncertainty in an on-chip global clock. A global clock is provided to a delay line at a local clock buffer. Delay line taps (inverter outputs) are inputs to a register that is clocked by the local clock buffer. The register captures clock edges, which are filtered to identify a single location for each edge. Imbalance in space between the edges indicated imbalance in duty cycle. Up/down signals are generated from any imbalance and passed to a phase locked loop to adjust the balance.
Abstract:
A hierarchical and modular clock programmable delay circuit structure is described that can achieve almost unlimited fine resolution and unlimited delay range. The same circuit may also be applied to critical circuits that require fine adjustment in timing applications. The modular design allows the circuit and its layout to be synthesized by software to achieve desired delay resolution and range. Constant capacitive load of internal node enhances the linearity of achieved delay by digital controls.
Abstract:
An integrated circuit (IC), IC assembly and circuit for distributing a clock signal in an integrated circuit includes a capacitive clock distribution circuit having at least one conductor therein. At least one inductor is formed in a metal layer of the integrated circuit and is coupled to the clock distribution circuit. The inductor, generally in the form of a number of spiral inductors distributed throughout the integrated circuit, provides an inductance value selected to resonate with the capacitive clock distribution circuit at resonance, power dissipation is reduced while skew and jitter performance can be improved.
Abstract:
An integrated circuit, comprising: a semiconductor substrate, a plurality of last metal conductors disposed above said substrate, a bottom metallic layer disposed on said last metal conductors, a top metallic layer, and an alpha absorber disposed between said bottom and top metallic layers, said alpha absorber consisting essentially of a high-purity metal which is an alpha-particle absorber. The metal is, for example, of Ta, W, Re, Os or Ir.