专利检索 ap:"Pamela Stellmacher" 第 1 页

1.

发明申请
Method and apparatus for a low thermal impedance printed circuit board assembly 审中-公开
标题翻译：低热阻印刷电路板组件的方法和装置

公开(公告)号：US20070278002A1

公开(公告)日：2007-12-06

申请号：US11445031

申请日：2006-05-31

申请人： Romi Mayder , Pamela Stellmacher

发明人： Romi Mayder , Pamela Stellmacher

IPC分类号： H05K1/11 , H01R12/04

CPC分类号： H05K1/113 , H05K1/0206 , H05K3/3436 , H05K2201/0959 , H05K2201/10734 , H05K2203/025

摘要： A low thermal impedance printed circuit board assembly compatible with surface mount assembly reflow solder processes is presented. The low thermal impedance printed circuit board assembly may have filled vias soldered directly to solder balls of the surface mount assembly.

摘要翻译： 提出了一种与表面贴装组件回流焊接工艺兼容的低热阻印刷电路板组件。低热阻抗印刷电路板组件可以具有直接焊接到表面安装组件的焊球的填充过孔。

2.

发明申请
Solid via with a contact pad for mating with an interposer of an ATE tester 审中-公开
标题翻译：具有接触垫的固体通孔，用于与ATE测试仪的插入件配合

公开(公告)号：US20080142252A1

公开(公告)日：2008-06-19

申请号：US11638884

申请日：2006-12-13

申请人： Romi Mayder , Kris Rexroad , Pamela Stellmacher

发明人： Romi Mayder , Kris Rexroad , Pamela Stellmacher

IPC分类号： H05K1/09 , H05K1/11

CPC分类号： H05K1/113 , H05K3/4069 , H05K2201/0347 , H05K2201/0959

摘要： An epoxy filled via hole in a printed circuit board is presented. The epoxy filled via hole may have metal plating between the epoxy and the via hole walls of the printed circuit board. The epoxy filled via hole may have a land pad directly over the epoxy filling, creating a compact contact area for an ATE interposer.

摘要翻译： 介绍了印刷电路板中环氧树脂填充通孔。环氧树脂填充的通孔可以在环氧树脂和印刷电路板的通孔壁之间进行金属电镀。环氧树脂填充的通孔可以在环氧填充物的正上方具有焊盘，为ATE插入件创建紧凑的接触面积。