公开(公告)号：US06388199B1

公开(公告)日：2002-05-14

申请号：US09628833

申请日：2000-07-31

Applicant: Tongbi Jiang ,  Partrick Tandy

Inventor： Tongbi Jiang ,  Partrick Tandy

IPC: H05K103

CPC classification number: H01L23/3107 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of selectively adjusting surface tension of a soldermask material. Specifically, a method of selectively adjusting the surface tension of a soldermask material to promote adhesion of a molding compound in a ball grid array package while maintaining a low surface tension on the ball attach area to prevent bridging between the solder balls. Solder balls require a low surface tension soldermask to minimize bridging, while the molding compound requires a high surface tension to provide adequate adhesion to the surface of the soldermask. By exposing selected portions of the soldermask to an activation method, such as ultra-violet radiation, the surface tension of the soldermask can be varied such that different areas of the package exhibit different surface tensions.

Abstract translation: 选择性地调节焊接材料的表面张力的方法。 具体地说，可以选择性地调节焊料材料的表面张力以促进模塑料在球栅阵列封装中的粘附，同时保持球附着区域上的低表面张力以防止焊球之间的桥接。 焊球需要低表面张力焊接掩模以最小化桥接，而模塑料需要高表面张力以提供对焊接表面的足够的粘附。 通过将焊接掩模的选定部分暴露于诸如紫外辐射的激活方法，可以改变焊接掩模的表面张力，使得封装的不同区域表现出不同的表面张力。

公开(公告)号：US06889430B2

公开(公告)日：2005-05-10

申请号：US10020352

申请日：2001-12-12

Applicant: Tongbi Jiang ,  Partrick Tandy

Inventor： Tongbi Jiang ,  Partrick Tandy

IPC: H01L23/31 ,  H01L23/495 ,  H05K3/34

CPC classification number: H01L23/3107 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of selectively adjusting surface tension of a soldermask material. Specifically, a method of selectively adjusting the surface tension of a soldermask material to promote adhesion of a molding compound in a ball grid array package while maintaining a low surface tension on the ball attach area to prevent bridging between the solder balls. Solder balls require a low surface tension soldermask to minimize bridging, while the molding compound requires a high surface tension to provide adequate adhesion to the surface of the soldermask. By exposing selected portions of the soldermask to an activation method, such as ultra-violet radiation, the surface tension of the soldermask can be varied such that different areas of the package exhibit different surface tensions.

Abstract translation: 选择性地调节焊接材料的表面张力的方法。 具体地说，可以选择性地调节焊料材料的表面张力以促进模塑料在球栅阵列封装中的粘附，同时保持球附着区域上的低表面张力以防止焊球之间的桥接。 焊球需要低表面张力焊接掩模以最小化桥接，而模塑料需要高表面张力以提供对焊接表面的足够的粘附。 通过将焊接掩模的选定部分暴露于诸如紫外辐射的激活方法，可以改变焊接掩模的表面张力，使得封装的不同区域表现出不同的表面张力。