-
1.发明申请Multi-chip package with high-speed serial communications between semiconductor die 有权多芯片封装与半导体芯片之间的高速串行通信公开(公告)号：US20050248036A1
公开(公告)日：2005-11-10
申请号：US10841741
申请日：2004-05-07
IPC分类号： H01L23/22 , H01L23/24 , H01L23/48 , H01L23/52 , H01L25/04 , H01L25/065 , H01L25/18 , H01L29/40
CPC分类号： H01L25/18 , H01L24/73 , H01L25/0655 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
摘要翻译： 多芯片封装包括封装基板。 第一和第二半导体管芯形成在封装衬底上。 第一和第二半导体管芯被配置为经由高速串行通信协议相互通信。
-
2.发明申请Utilizations and Applications of Near Field Communications in Mobile Device Management and Security 审中-公开近场通信在移动设备管理与安全中的应用与应用公开(公告)号：US20150358822A1
公开(公告)日：2015-12-10
申请号：US14655148
申请日：2013-12-27
申请人： Michael Thomas HENDRICK , Mark REED , Dan SHCAFFNER , Philip ATTFIELD , Julia NARVAEZ , Paul CHENARD , SEQUITUR LABS, INC.
发明人： Michael Thomas HENDRICK , Mark REED , Dan SCHAFFNER , Philip ATTFIELD , Julia NARVAEZ , Paul CHENARD
CPC分类号： G06F21/629 , G06F2221/2111 , G06F2221/2149 , H04L67/125 , H04M1/72577 , H04M2250/04 , H04W4/021 , H04W4/14 , H04W4/33 , H04W4/80 , H04W12/0027 , H04W12/00503 , H04W12/08
摘要： Systems and methods for using Near Field Communications1 (NFC) m\d other short-range wireless communications technologies in mobile device management and security. Uses of NFC devices of both passive and active types are presented herein, as “policy control points” (PCPs) within a policy-based system for mobile handset management, in situations where granular control of handset capabilities is required. Certain location-based, as well as non-location-specific variants of the invention are presented as examples.
摘要翻译： 使用近场通信1（NFC）在移动设备管理和安全方面采用其他短距离无线通信技术的系统和方法。 被动和主动类型的NFC设备的使用在这里被呈现在用于移动手持机管理的基于策略的系统中的“策略控制点”（PCP），在需要对手机能力进行细粒度控制的情况下。 作为示例呈现了本发明的某些基于位置的以及非位置特定变体。
-
3.发明申请Method of Making Multi-Chip Package with High-Speed Serial Communications between Semiconductor Dice 有权半导体芯片之间高速串行通信的多芯片封装方法公开(公告)号：US20080113471A1
公开(公告)日：2008-05-15
申请号：US11972602
申请日：2008-01-10
IPC分类号： H01L21/58
CPC分类号： H01L25/18 , H01L24/73 , H01L25/0655 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
摘要翻译： 多芯片封装包括封装基板。 第一和第二半导体管芯形成在封装衬底上。 第一和第二半导体管芯被配置为经由高速串行通信协议相互通信。
-
-
搜索结果
3 条记录 (耗时 0.01 秒)
