公开(公告)号：US08476757B2

公开(公告)日：2013-07-02

申请号：US12572476

申请日：2009-10-02

申请人： Peter A. Stenger ,  Mark E. Schneider ,  Thomas A. Andersen

发明人： Peter A. Stenger ,  Mark E. Schneider ,  Thomas A. Andersen

IPC分类号： H01L23/34

CPC分类号： H01L24/12 ,  H01L23/552 ,  H01L23/66 ,  H01L24/11 ,  H01L24/15 ,  H01L24/16 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16235 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/00

摘要： A monolithic microwave integrated circuit (MMIC) flip chip interconnect is formed by coating an active side of the chip with a dielectric coating, such as benzocyclobutene (BCB), that inhibits deposition of metal plating materials. A portion of the dielectric coating is removed to expose bond pads on the active side of the chip, stud bumps are bonded to the bond pads, and the active side is then plated with first and second consecutive metal plating materials, such as nickel and gold, respectively, that do not adhere to the dielectric coating. The chip is then oriented such that the plated stud bumps on the active side of the chip face bond pads on a substrate, and the stud bumps on the chip are bonded to the bond pads on the substrate.

摘要翻译： 通过用抑制金属电镀材料沉积的介电涂层（例如苯并环丁烯（BCB））涂覆芯片的有源侧来形成单片微波集成电路（MMIC）倒装芯片互连。 去除电介质涂层的一部分以暴露芯片的有源侧上的焊盘，柱形突起结合到接合焊盘，然后用活性侧镀有第一和第二连续的金属电镀材料，例如镍和金 ，分别不粘附于电介质涂层。 然后将芯片定向成使得芯片的有源侧上的电镀突起凸起接合衬底上的焊盘，并且芯片上的柱状凸起接合到衬底上的接合焊盘。

公开(公告)号：US07420436B2

公开(公告)日：2008-09-02

申请号：US11373983

申请日：2006-03-14

申请人： Peter A. Stenger

发明人： Peter A. Stenger

IPC分类号： H01P5/107

CPC分类号： H01P5/107

摘要： In one aspect, an embodiment of the invention provides a transition from a planar substrate/chip circuit microwave transmission line to waveguide transmission media on the back of the substrate/chip. The transition enables planar waveguide fed MMW ESA architectures to be realized within the tight grid spacing required for emerging MMW ESAs.

摘要翻译： 在一个方面，本发明的实施例提供从平面基板/芯片电路微波传输线到衬底/芯片背面上的波导传输介质的转变。 该转换使得能够在新兴MMW ESA所需的紧密网格间隔内实现平面波导馈送的MMW ESA架构。

公开(公告)号：US07132990B2

公开(公告)日：2006-11-07

申请号：US11060774

申请日：2005-02-18

申请人： Peter A. Stenger ,  Fred C. Kuss ,  Kevin LaCour ,  Craig Heffner ,  Robert Sisk ,  Carl D. Wise ,  Joseph Paquin ,  Tujuana Hinton ,  Andrew Walters ,  David Krafcsik ,  Brian T. McMonagle ,  Steven D. Block ,  Steven S. Handley

发明人： Peter A. Stenger ,  Fred C. Kuss ,  Kevin LaCour ,  Craig Heffner ,  Robert Sisk ,  Carl D. Wise ,  Joseph Paquin ,  Tujuana Hinton ,  Andrew Walters ,  David Krafcsik ,  Brian T. McMonagle ,  Steven D. Block ,  Steven S. Handley

IPC分类号： H01Q19/06

CPC分类号： H01P5/085 ,  H01P1/047 ,  H01P1/268 ,  H01P5/107 ,  H01Q1/422 ,  H01Q3/26 ,  H01Q21/0037 ,  H01Q21/0087 ,  H01Q21/064 ,  H01Q23/00

摘要： A vertically integrated Ka-band active electronically scanned antenna including, among other things, a transitioning RF waveguide relocator panel located behind a radiator faceplate and an array of beam control tiles respectively coupled to one of a plurality of transceiver modules via an RF manifold. Each of the beam control tiles includes a respective plurality of high power transmit/receive (T/R) cells as well as dielectric waveguides, RF stripline and coaxial transmission line elements. The waveguide relocator panel is preferably fabricated by a diffusion bonded copper laminate stack up with dielectric filling. The beam control tiles are preferably fabricated by the use of multiple layers of low temperature co-fired ceramic (LTCC) material laminated together. The waveguide relocator panel and the beam control tiles are designed to route RF signals to and from a respective transceiver module of four transceiver modules and a quadrature array of antenna radiators matched to free space formed in the faceplate. Planar type metal spring gaskets are provided between the interfacing layers so as to provide and ensure interconnection between mutually facing waveguide ports and to prevent RF leakage from around the perimeter of the waveguide ports. Cooling of the various components is achieved by a pair of planar forced air heat sink members which are located on either side of the array of beam control tiles. DC power and control of the T/R cells is provided by a printed circuit wiring board assembly located adjacent to the array of beam controlled tiles with solderless DC connections being provided by an arrangement of “fuzz button” electrical connector elements.

摘要翻译： 一种垂直集成的Ka波段有源电子扫描天线，其特别包括位于散热器面板后面的转换RF波导重定位板和经由RF歧管分别耦合到多个收发器模块之一的波束控制瓦片阵列。 每个波束控制瓦片包括相应的多个高功率发射/接收（T / R）单元以及介质波导，RF带状线和同轴传输线元件。 波导重新定位器面板优选地通过具有电介质填充物的扩散结合的铜层压板来制造。 束控制瓦优选通过使用层压在一起的多层低温共烧陶瓷（LTCC）材料来制造。 波导重定位板和波束控制瓦片被设计成将RF信号路由到四个收发器模块的相应收发器模块和与面板中形成的自由空间匹配的天线辐射器的正交阵列。 平面型金属弹簧垫片设置在接口层之间，以便提供并确保相互面对的波导端口之间的互连，并防止RF波导从波导端口的周边周围泄漏。 通过一对平面的强制空气散热构件实现各种部件的冷却，这些平面的强制空气散热构件位于光束控制瓦片阵列的任一侧上。 直流电源和T / R电池的控制由位于与束控制瓦片阵列相邻的印刷电路布线板组件提供，其中无焊直流连接由“模糊按钮”电连接器元件的布置提供。

公开(公告)号：US06975267B2

公开(公告)日：2005-12-13

申请号：US10358278

申请日：2003-02-05

申请人： Peter A. Stenger ,  Fred C. Kuss ,  Kevin LaCour ,  Craig Heffner ,  Robert Sisk ,  Carl D. Wise ,  Joseph Paquin ,  Tujuana Hinton ,  Andrew Walters ,  David Krafcsik ,  Brian T. McMonagle ,  Steven D. Block ,  Steven S. Handley

发明人： Peter A. Stenger ,  Fred C. Kuss ,  Kevin LaCour ,  Craig Heffner ,  Robert Sisk ,  Carl D. Wise ,  Joseph Paquin ,  Tujuana Hinton ,  Andrew Walters ,  David Krafcsik ,  Brian T. McMonagle ,  Steven D. Block ,  Steven S. Handley

IPC分类号： H01P1/04 ,  H01P1/26 ,  H01P5/08 ,  H01P5/107 ,  H01Q1/42 ,  H01Q3/26 ,  H01Q21/00 ,  H01Q21/06 ,  H01Q23/00 ,  H01Q3/22 ,  G01S13/00 ,  H01Q3/24

CPC分类号： H01P5/085 ,  H01P1/047 ,  H01P1/268 ,  H01P5/107 ,  H01Q1/422 ,  H01Q3/26 ,  H01Q21/0037 ,  H01Q21/0087 ,  H01Q21/064 ,  H01Q23/00

摘要： A vertically integrated Ka-band active electronically scanned antenna including, among other things, a transitioning RF waveguide relocator panel located behind a radiator faceplate and an array of beam control tiles respectively coupled to one of a plurality of transceiver modules via an RF manifold. Each of the beam control tiles includes a respective plurality of high power transmit/receive (T/R) cells as well as dielectric waveguides, RF stripline and coaxial transmission line elements. The waveguide relocator panel is preferably fabricated by a diffusion bonded copper laminate stack up with dielectric filling. The beam control tiles are preferably fabricated by the use of multiple layers of low temperature co-fired ceramic (LTCC) material laminated together. The waveguide relocator panel and the beam control tiles are designed to route RF signals to and from a respective transceiver module of four transceiver modules and a quadrature array of antenna radiators matched to free space formed in the faceplate. Planar type metal spring gaskets are provided between the interfacing layers so as to provide and ensure interconnection between mutually facing waveguide ports and to prevent RF leakage from around the perimeter of the waveguide ports. Cooling of the various components is achieved by a pair of planar forced air heat sink members which are located on either side of the array of beam control tiles. DC power and control of the T/R cells is provided by a printed circuit wiring board assembly located adjacent to the array of beam controlled tiles with solderless DC connections being provided by an arrangement of “fuzz button” electrical connector elements.

摘要翻译： 一种垂直集成的Ka波段有源电子扫描天线，其特别包括位于散热器面板后面的转换RF波导重定位板和经由RF歧管分别耦合到多个收发器模块之一的波束控制瓦片阵列。 每个波束控制瓦片包括相应的多个高功率发射/接收（T / R）单元以及介质波导，RF带状线和同轴传输线元件。 波导重新定位器面板优选地通过具有电介质填充物的扩散结合的铜层压板来制造。 束控制瓦优选通过使用层压在一起的多层低温共烧陶瓷（LTCC）材料来制造。 波导重定位板和波束控制瓦片被设计成将RF信号路由到四个收发器模块的相应收发器模块和与面板中形成的自由空间匹配的天线辐射器的正交阵列。 平面型金属弹簧垫片设置在接口层之间，以便提供并确保相互面对的波导端口之间的互连，并防止RF波导从波导端口的周边周围泄漏。 通过一对平面的强制空气散热构件实现各种部件的冷却，这些平面的强制空气散热构件位于光束控制瓦片阵列的任一侧上。 直流电源和T / R电池的控制由位于与束控制瓦片阵列相邻的印刷电路布线板组件提供，其中无焊直流连接由“模糊按钮”电连接器元件的布置提供。

公开(公告)号：US5517687A

公开(公告)日：1996-05-14

申请号：US194199

申请日：1994-02-09

申请人： Edward C. Niehenke ,  Marvin Cohn ,  Peter A. Stenger

发明人： Edward C. Niehenke ,  Marvin Cohn ,  Peter A. Stenger

IPC分类号： H03B19/18 ,  H03D7/14 ,  H03D7/18 ,  H03D9/06 ,  H04B1/26

CPC分类号： H03D9/0633 ,  H04B1/26 ,  H03B19/18 ,  H03D2200/0023 ,  H03D2200/0082 ,  H03D7/1408 ,  H03D7/18

摘要： A subharmonic image rejection and image enhancement mixer for mixing millimeter wavelength signals using a low conversion loss technique is described. A local oscillator frequency from an external source is fed to a first subharmonic mixer and through a phase shifter to a second subharmonic mixer. The phase shifter delays the local oscillator signal by (90.degree./n), where n is the multiple of the subharmonic mixers and is greater than 1. The first and second subharmonic mixers mix the local oscillator frequency with an input signal, which includes a desired frequency and an image frequency, to produce an intermediate frequency having a desired component and an image component at a select phase. A 0.degree.-90.degree. hybrid separates and terminates the image component of the intermediate frequency. The input port that feeds the input signal to each subharmonic mixer is dimensioned so as to provide a virtual image short termination or an image short termination to a self-generated image signal from each subharmonic mixer, thereby decreasing the conversion loss of the frequency mixer.

摘要翻译： 描述了使用低转换损耗技术混合毫米波长信号的次谐波图像抑制和图像增强混频器。 来自外部源的本地振荡器频率被馈送到第一次谐波混频器并且通过移相器馈送到第二次谐波混频器。 移相器将本地振荡器信号延迟（90°/ n），其中n是次谐波混频器的倍数，大于1.第一和第二次谐波混频器将本地振荡器频率与输入信号混合，其中包括 期望频率和图像频率，以在选择阶段产生具有期望分量和图像分量的中频。 0°-90°混合分离并终止中频图像分量。 将输入信号馈送到每个次谐波混频器的输入端口的尺寸被设计为从每个次谐波混频器向自生成的图像信号提供虚拟图像短终端或图像短终端，从而降低了混频器的转换损耗。

公开(公告)号：US20110079925A1

公开(公告)日：2011-04-07

申请号：US12572476

申请日：2009-10-02

申请人： Peter A. Stenger ,  Mark E. Schneider ,  Thomas A. Andersen

发明人： Peter A. Stenger ,  Mark E. Schneider ,  Thomas A. Andersen

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L24/12 ,  H01L23/552 ,  H01L23/66 ,  H01L24/11 ,  H01L24/15 ,  H01L24/16 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16235 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/00

摘要： A monolithic microwave integrated circuit (MMIC) flip chip interconnect is formed by coating an active side of the chip with a dielectric coating, such as benzocyclobutene (BCB), that inhibits deposition of metal plating materials. A portion of the dielectric coating is removed to expose bond pads on the active side of the chip, stud bumps are bonded to the bond pads, and the active side is then plated with first and second consecutive metal plating materials, such as nickel and gold, respectively, that do not adhere to the dielectric coating. The chip is then oriented such that the plated stud bumps on the active side of the chip face bond pads on a substrate, and the stud bumps on the chip are bonded to the bond pads on the substrate.

摘要翻译： 通过用抑制金属电镀材料沉积的介电涂层（例如苯并环丁烯（BCB））涂覆芯片的有源侧来形成单片微波集成电路（MMIC）倒装芯片互连。 去除电介质涂层的一部分以暴露芯片的有源侧上的焊盘，柱形突起结合到接合焊盘，然后用活性侧镀有第一和第二连续的金属电镀材料，例如镍和金 ，分别不粘附于电介质涂层。 然后将芯片定向成使得芯片的有源侧上的电镀突起凸起接合衬底上的焊盘，并且芯片上的柱状凸起接合到衬底上的接合焊盘。

公开(公告)号：US07479841B2

公开(公告)日：2009-01-20

申请号：US11057127

申请日：2005-02-15

申请人： Peter A. Stenger

发明人： Peter A. Stenger

IPC分类号： H01P5/107

CPC分类号： H01P5/107

摘要： An MMIC chip is disclosed that includes a planar substrate having a first surface and a second surface, a conductive layer having an opening on the first surface, a transmission line on the second surface, at least one conductor extending from the conductive layer to the second surface defining a waveguide around the opening, wherein the transmission line is connected to the at least one conductor such that a signal traveling along the transmission line is guided toward the opening in the first side by the at least one conductor.

摘要翻译： 公开了一种MMIC芯片，其包括具有第一表面和第二表面的平面基板，在第一表面上具有开口的导电层，在第二表面上的传输线，从导电层延伸到第二表面的至少一个导体 表面限定围绕开口的波导，其中传输线连接到至少一个导体，使得沿着传输线行进的信号通过至少一个导体被引导到第一侧的开口。