公开(公告)号：US06580491B2

公开(公告)日：2003-06-17

申请号：US09749044

申请日：2000-12-26

申请人： Richard Ronald Hall ,  Robert Lee Lewis ,  How Tzu Lin ,  Peter Michael Nichols ,  Robert David Sebesta

发明人： Richard Ronald Hall ,  Robert Lee Lewis ,  How Tzu Lin ,  Peter Michael Nichols ,  Robert David Sebesta

IPC分类号： G03B2768

CPC分类号： G03F7/70466 ,  G03F7/70258 ,  G03F9/00 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0082 ,  H05K2201/09918

摘要： Apparatus and method for compensating for distortion of the substrate of a printed circuit workpiece that involves performing two tasks. First, a mask that carries functional circuit features and alignment features is positioned rotatably so that the mask alignment features, when projected onto a table that holds the printed circuit workpiece, will be on a line extending parallel to one of two orthogonal axes of the table. Second, the spacing of alignment features on the printed circuit workpiece is determined and this determination is a measure of the distortion of the printed circuit workpiece substrate. A lens through which the mask image is projected is moved to adjust the magnification of the image in accordance with the measured distortion of the substrate of the printed circuit workpiece.

公开(公告)号：US06271503B1

公开(公告)日：2001-08-07

申请号：US09559846

申请日：2000-04-27

申请人： Richard Ronald Hall ,  Francesco Marconi ,  Peter Michael Nichols

发明人： Richard Ronald Hall ,  Francesco Marconi ,  Peter Michael Nichols

IPC分类号： H05B368

CPC分类号： B25B11/005

摘要： A vacuum fixture incorporating a vacuum suctioning device which may be employed in the manufacture of thin film chip carriers through the intermediary of retaining parts which are to be processed on the surface of a suction plate in a dimensionally compensating operative mode. A process is disclosed which may be employed in the manufacture of thin film chip carriers which is adhered in a dimensionally compensating manner to the surface of an interposer plate which is supported on a suction plate of a vacuum fixture.

公开(公告)号：US06173948B1

公开(公告)日：2001-01-16

申请号：US09233838

申请日：1999-01-20

申请人： Richard Ronald Hall ,  Francesco Marconi ,  Peter Michael Nichols

发明人： Richard Ronald Hall ,  Francesco Marconi ,  Peter Michael Nichols

IPC分类号： B25B1100

CPC分类号： B25B11/005

摘要： A vacuum fixture incorporating a vacuum suctioning device which may be employed in the manufacture of thin film chip carriers through the intermediary of retaining parts which are to be processed on the surface of a suction plate in a dimensionally compensating operative mode. A process is disclosed which may be employed in the manufacture of thin film chip carriers which is adhered in a dimensionally compensating manner to the surface of an interposer plate which is supported on a suction plate of a vacuum fixture.

摘要翻译： 一种真空装置，其包括真空抽吸装置，其可以用于制造薄膜芯片载体，通过在尺寸补偿操作模式中在待加工的吸附板表面上的保持部件。 公开了可以用于制造薄膜芯片载体的方法，薄膜芯片载体以尺寸补偿的方式粘附到支撑在真空夹具的吸盘上的插入板的表面。