公开(公告)号：US08564955B2

公开(公告)日：2013-10-22

申请号：US13151144

申请日：2011-06-01

Applicant: Chad C Schmidt ,  Richard Lidio Blanco, Jr. ,  Douglas L Heirich ,  Michael D Hillman ,  Phillip L Mort ,  Jay S Nigen ,  Gregory L Tice

Inventor： Chad C Schmidt ,  Richard Lidio Blanco, Jr. ,  Douglas L Heirich ,  Michael D Hillman ,  Phillip L Mort ,  Jay S Nigen ,  Gregory L Tice

IPC: H05K7/20

CPC classification number: H01L23/367 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/32057 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19043

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract translation: 本发明的实施例提供一种用于分配热界面材料的系统。 该系统包括：集成电路芯片; 散热器 以及集成电路芯片和散热器之间的兼容热界面材料（TIM）。 在组装系统期间，散热器的配合表面和集成电路芯片的配合表面被成形为当TIM被按压在散热器的配合表面和相应的匹配表面之间时以预定图案分布 集成电路芯片。

公开(公告)号：US20110228482A1

公开(公告)日：2011-09-22

申请号：US13151144

申请日：2011-06-01

Applicant: Chad C. Schmidt ,  Richard Lidio Blanco, JR. ,  Douglas L. Heirich ,  Michael D. Hillman ,  Phillip L. Mort ,  Jay S. Nigen ,  Gregory L. Tice

Inventor： Chad C. Schmidt ,  Richard Lidio Blanco, JR. ,  Douglas L. Heirich ,  Michael D. Hillman ,  Phillip L. Mort ,  Jay S. Nigen ,  Gregory L. Tice

IPC: H05K7/20 ,  F28F7/00 ,  B23P19/00

CPC classification number: H01L23/367 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/32057 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19043

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract translation: 本发明的实施例提供一种用于分配热界面材料的系统。 该系统包括：集成电路芯片; 散热器 以及集成电路芯片和散热器之间的兼容热界面材料（TIM）。 在组装系统期间，散热器的配合表面和集成电路芯片的配合表面被成形为当TIM被按压在散热器的配合表面和相应的配合表面之间时以预定图案分布 集成电路芯片。

公开(公告)号：US20100246133A1

公开(公告)日：2010-09-30

申请号：US12415760

申请日：2009-03-31

Applicant: Chad C. Schmidt ,  Richard Lidio Blanco, JR. ,  Douglas L. Heirich ,  Michael D. Hillman ,  Phillip L. Mort ,  Jay S. Nigen ,  Gregory L. Tice

Inventor： Chad C. Schmidt ,  Richard Lidio Blanco, JR. ,  Douglas L. Heirich ,  Michael D. Hillman ,  Phillip L. Mort ,  Jay S. Nigen ,  Gregory L. Tice

IPC: H05K7/20 ,  H01L23/40 ,  H01L21/50 ,  F28F7/00

CPC classification number: H01L23/367 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/32057 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19043

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract translation: 本发明的实施例提供一种用于分配热界面材料的系统。 该系统包括：集成电路芯片; 散热器 以及集成电路芯片和散热器之间的兼容热界面材料（TIM）。 在组装系统期间，散热器的配合表面和集成电路芯片的配合表面被成形为当TIM被按压在散热器的配合表面和相应的配合表面之间时以预定图案分布 集成电路芯片。

公开(公告)号：US20120162095A1

公开(公告)日：2012-06-28

申请号：US13028168

申请日：2011-02-15

Applicant: Frank F. Liang ,  Amaury J. Heresztyn ,  Phillip L. Mort ,  Carl Peterson ,  Benjamin M. Rappoport ,  John P. Ternus

Inventor： Frank F. Liang ,  Amaury J. Heresztyn ,  Phillip L. Mort ,  Carl Peterson ,  Benjamin M. Rappoport ,  John P. Ternus

IPC: G02B5/22 ,  G06F3/041 ,  B05D5/06

CPC classification number: G02B5/208

Abstract: An internal optical coating includes multiple layers of different materials and thicknesses and is disposed between a transparent display cover and a visual display unit for an electronic device display. The optical coating transmits most visible light, reflects most non-visible light and substantially absorbs blackbody radiation generated from within the electronic device. The multiple layers comprise two or more materials having alternating low and high indices of refraction, and can include 36 or more layers, each having a thickness ranging from 10 to 400 nanometers. The arrangement and thicknesses of the layers are designed based upon the thickness and optical properties of the transparent display cover. The internal optical coating can also be specially formulated to replace a typical internal anti-reflective coating proximate the visual display unit.

Abstract translation: 内部光学涂层包括不同材料和厚度的多层，并且设置在透明显示器盖和用于电子设备显示器的视觉显示单元之间。 光学涂层透射最可见的光，反射大多数不可见光并且基本上吸收从电子设备内产生的黑体辐射。 多层包括具有交替的低折射率和高折射率的两种或更多种材料，并且可以包括36层或更多层，每层具有10至400纳米的厚度。 基于透明显示器盖的厚度和光学特性来设计层的布置和厚度。 内部光学涂层也可以特别配制，以代替靠近视觉显示单元的典型的内部抗反射涂层。

公开(公告)号：US20120162751A1

公开(公告)日：2012-06-28

申请号：US12977879

申请日：2010-12-23

Applicant: Frank F. Liang ,  Phillip L. Mort ,  Amaury J. Heresztyn ,  Jay S. Nigen ,  Simon Prakash ,  John P. Ternus

Inventor： Frank F. Liang ,  Phillip L. Mort ,  Amaury J. Heresztyn ,  Jay S. Nigen ,  Simon Prakash ,  John P. Ternus

IPC: G02B5/26 ,  B05D5/06

CPC classification number: G02B1/10 ,  G02B5/26 ,  G06F1/20 ,  G06F1/203

Abstract: An optical coating includes multiple layers of different materials and thicknesses and is disposed proximate a transparent display cover for an electronic device display. The optical coating transmits most visible light, reflects most non-visible light and substantially absorbs blackbody radiation generated from within the electronic device. The optical coating can be readily removable from the electronic device display either alone or in combination with a removable transparent display cover. The multiple layers comprise two or more materials having alternating low and high indices of refraction, and can include 36 or more layers, each having a thickness ranging from 10 to 400 nanometers. The arrangement and thicknesses of the layers are designed based upon the thickness and optical properties of the transparent display cover.

Abstract translation: 光学涂层包括多层不同的材料和厚度，并且靠近用于电子设备显示器的透明显示器盖布置。 光学涂层透射最可见的光，反射大多数不可见光并且基本上吸收从电子设备内产生的黑体辐射。 光学涂层可以容易地从电子设备显示器单独地或与可移除的透明显示器盖组合地移除。 多层包括具有交替的低折射率和高折射率的两种或更多种材料，并且可以包括36层或更多层，每层具有10至400纳米的厚度。 基于透明显示器盖的厚度和光学特性来设计层的布置和厚度。

公开(公告)号：US07961469B2

公开(公告)日：2011-06-14

申请号：US12415760

申请日：2009-03-31

Applicant: Chad C Schmidt ,  Richard Lidio Blanco, Jr. ,  Douglas L Heirich ,  Michael D Hillman ,  Phillip L Mort ,  Jay S Nigen ,  Gregory L Tice

Inventor： Chad C Schmidt ,  Richard Lidio Blanco, Jr. ,  Douglas L Heirich ,  Michael D Hillman ,  Phillip L Mort ,  Jay S Nigen ,  Gregory L Tice

IPC: H05K7/20

CPC classification number: H01L23/367 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/32057 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19043

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract translation: 本发明的实施例提供一种用于分配热界面材料的系统。 该系统包括：集成电路芯片; 散热器 以及集成电路芯片和散热器之间的兼容热界面材料（TIM）。 在组装系统期间，散热器的配合表面和集成电路芯片的配合表面被成形为当TIM被按压在散热器的配合表面和相应的配合表面之间时以预定图案分布 集成电路芯片。