公开(公告)号：US06241226B1

公开(公告)日：2001-06-05

申请号：US09389778

申请日：1999-09-03

申请人： Gregory A. Olsen ,  Christopher J. Lichner ,  Phillip Rayer, II ,  Chad J. Voelkers

发明人： Gregory A. Olsen ,  Christopher J. Lichner ,  Phillip Rayer, II ,  Chad J. Voelkers

IPC分类号： B23G1300

CPC分类号： B24B37/30

摘要： The present invention relates to a vacuum system for reliably holding wafers exposed to effluents in a wafer chuck. A vacuum pump generates a vacuum communicated to a wafer chuck through a tank. The tank has a baffle for converting vapor effluent to liquid effluent from the air sucked into the vacuum system. The tank stores the liquid effluent to prevent the effluent from fouling the vacuum pump and other components. A pressure transducer is connected to the tank to detect a loss in vacuum that may indicate a lost wafer condition. A trap is placed between the tank and the vacuum pump to detect if excessive effluents have escaped from the tank and to signal that corrective action may need to be taken.

摘要翻译： 本发明涉及一种真空系统，用于可靠地容纳暴露于晶片卡盘中的流出物的晶片。 真空泵通过罐产生与晶片卡盘相通的真空。 该罐具有用于将蒸气流出物转换成吸入真空系统的空气的液体流出物的挡板。 储罐储存液体流出物，以防止污水污染真空泵和其他部件。 压力传感器连接到罐，以检测真空中的损失，这可能指示晶片失效。 在罐和真空泵之间放置一个陷阱，以检测是否有过多的废水从罐中逸出，并表示可能需要采取纠正措施。

公开(公告)号：US20050016681A1

公开(公告)日：2005-01-27

申请号：US10921666

申请日：2004-08-18

申请人： Ismail Emesh ,  Periya Gopalan ,  Phillip Rayer ,  Bentley Palmer

发明人： Ismail Emesh ,  Periya Gopalan ,  Phillip Rayer ,  Bentley Palmer

IPC分类号： B23H5/08 ,  C25D7/12 ,  C25D17/14 ,  C25F7/00 ,  H01L21/288 ,  H01L21/321 ,  C23F1/00

CPC分类号： C25D17/14 ,  B23H5/08 ,  C25D7/123 ,  C25D17/001 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/32125

摘要： An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.

摘要翻译： 提供了一种电化学装置，其将材料沉积在工件表面上或从工件表面去除材料。 该设备包括抛光垫和压板，该压板又由与抛光垫接触并与第一电位接触的第一导电层，耦合到第二电位的第二导电层以及设置在第二电位之间的第一绝缘层 第一和第二导电层。 至少一个电触点位于抛光垫内并电耦合到第二导电层。 提供一个储存器，其将电解质溶液与抛光垫和工件接触。 载体定位和/或将工件压靠在抛光垫上。