公开(公告)号：US20050016681A1

公开(公告)日：2005-01-27

申请号：US10921666

申请日：2004-08-18

申请人： Ismail Emesh ,  Periya Gopalan ,  Phillip Rayer ,  Bentley Palmer

发明人： Ismail Emesh ,  Periya Gopalan ,  Phillip Rayer ,  Bentley Palmer

IPC分类号： B23H5/08 ,  C25D7/12 ,  C25D17/14 ,  C25F7/00 ,  H01L21/288 ,  H01L21/321 ,  C23F1/00

CPC分类号： C25D17/14 ,  B23H5/08 ,  C25D7/123 ,  C25D17/001 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/32125

摘要： An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.

摘要翻译： 提供了一种电化学装置，其将材料沉积在工件表面上或从工件表面去除材料。 该设备包括抛光垫和压板，该压板又由与抛光垫接触并与第一电位接触的第一导电层，耦合到第二电位的第二导电层以及设置在第二电位之间的第一绝缘层 第一和第二导电层。 至少一个电触点位于抛光垫内并电耦合到第二导电层。 提供一个储存器，其将电解质溶液与抛光垫和工件接触。 载体定位和/或将工件压靠在抛光垫上。

公开(公告)号：US06802955B2

公开(公告)日：2004-10-12

申请号：US10044514

申请日：2002-01-11

申请人： Ismail Emesh ,  Periya Gopalan ,  Phillip M. Rayer, II ,  Bentley J. Palmer

发明人： Ismail Emesh ,  Periya Gopalan ,  Phillip M. Rayer, II ,  Bentley J. Palmer

IPC分类号： B23H300

CPC分类号： C25D17/14 ,  B23H5/08 ,  C25D7/123 ,  C25D17/001 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/32125

摘要： An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.

摘要翻译： 提供了一种电化学装置，其将材料沉积在工件表面上或从工件表面去除材料。 该设备包括抛光垫和压板，该压板又由与抛光垫接触并与第一电位接触的第一导电层，耦合到第二电位的第二导电层以及设置在第二电位之间的第一绝缘层 第一和第二导电层。 至少一个电触点位于抛光垫内并电耦合到第二导电层。 提供一个储存器，其将电解质溶液与抛光垫和工件接触。 载体定位和/或将工件压靠在抛光垫上。

公开(公告)号：US07297239B2

公开(公告)日：2007-11-20

申请号：US10921666

申请日：2004-08-18

申请人： Ismail Emesh ,  Periya Gopalan ,  Phillip M. Rayer, II ,  Bentley J. Palmer

发明人： Ismail Emesh ,  Periya Gopalan ,  Phillip M. Rayer, II ,  Bentley J. Palmer

IPC分类号： C25D17/14 ,  C25F7/00 ,  B23H5/06 ,  B23H7/22

CPC分类号： C25D17/14 ,  B23H5/08 ,  C25D7/123 ,  C25D17/001 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/32125

摘要： An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.

摘要翻译： 提供了一种电化学装置，其将材料沉积在工件表面上或从工件表面去除材料。 该设备包括抛光垫和压板，该压板又包括与抛光垫接触并与第一电位接触的第一导电层，耦合到第二电位的第二导电层和设置在第二电位之间的第一绝缘层 第一和第二导电层。 至少一个电触点位于抛光垫内并电耦合到第二导电层。 提供一个储存器，其将电解质溶液与抛光垫和工件接触。 载体定位和/或将工件压靠在抛光垫上。

公开(公告)号：US06818604B2

公开(公告)日：2004-11-16

申请号：US09971332

申请日：2001-10-04

申请人： Ismail Emesh ,  Yakov Epshteyn ,  Periya Gopalan ,  Guangshum Chen ,  Xingbo Yang

发明人： Ismail Emesh ,  Yakov Epshteyn ,  Periya Gopalan ,  Guangshum Chen ,  Xingbo Yang

IPC分类号： C11D732

CPC分类号： H01L21/67046 ,  B08B1/04 ,  G11B23/505

摘要： The invention relates generally to a system and method for improved cleaning of workpieces and workpiece cleaning tools. More specifically, the invention provides systems and methods for cleaning workpieces and sponges by manipulating the surface charge of one or more sponges by exposing them to various cleaning fluids. In one embodiment, sponges such as PVA sponges, having either positive, negative or neutral charges, are used to clean surfaces of workpieces such as semiconductor wafers. While cleaning a workpiece, a sponge may be exposed to a workpiece cleaning fluid, which may or may not alter the surface charge of the sponge. After cleaning the workpiece, the sponge may be exposed to a sponge cleaning fluid, which may or may not alter the surface charge of the sponge. Manipulating the surface charge of a sponge during and/or after cleaning of a workpiece may enhance cleaning of the workpiece, by attracting oppositely charged particles and/or repelling similarly charged particles from the workpiece surface. Manipulating the surface charge of a sponge may also enhance cleaning of the sponge, by reducing or eliminating the attractive forces between the surface of the sponge and the charged particles attached to it.

摘要翻译： 本发明一般涉及用于改进工件和工件清洁工具的清洁的系统和方法。 更具体地，本发明提供了通过将它们暴露于各种清洁流体来操纵一种或多种海绵的表面电荷来清洁工件和海绵的系统和方法。 在一个实施例中，使用具有正，负或中性电荷的诸如PVA海绵的海绵来清洁诸如半导体晶片的工件的表面。 在清洁工件时，海绵可能会暴露于工件清洁液中，这可能会影响或不会改变海绵的表面电荷。 在清洁工件之后，海绵可能暴露于海绵清洗液中，这可能会改变或不会改变海绵的表面电荷。 在清洁工件期间和/或之后操作海绵的表面电荷可以通过从工件表面吸引带相反电荷的颗粒和/或排斥相似带电的颗粒来增强工件的清洁。 操纵海绵的表面电荷还可以通过减少或消除海绵表面和附着在其上的带电粒子之间的吸引力来增强海绵的清洁。

公开(公告)号：US20050121969A1

公开(公告)日：2005-06-09

申请号：US10729119

申请日：2003-12-04

申请人： Ismail Emesh ,  Bentley Palmer

发明人： Ismail Emesh ,  Bentley Palmer

IPC分类号： B24B7/22 ,  B24B55/02 ,  B60B7/00 ,  C09G1/02

CPC分类号： B24B55/02 ,  B24B7/228 ,  C09G1/02

摘要： A polishing fluid for a chemical-mechanical polishing process, an apparatus including the polishing fluid, and methods for making and using the polishing fluid, the fluid including a surfactant having an aliphatic structure, a buffer for maintaining the polishing fluid at a pH ranging between about 5 and about 14, and a chelating agent.

摘要翻译： 一种用于化学机械抛光工艺的抛光液，包括抛光液的设备，以及制造和使用抛光液的方法，所述流体包括具有脂族结构的表面活性剂，用于将抛光液保持在pH范围 约5至约14，和螯合剂。

公开(公告)号：US20060255016A1

公开(公告)日：2006-11-16

申请号：US11489874

申请日：2006-07-19

申请人： Julia Svirchevski ,  Saket Chadda ,  Ismail Emesh ,  Thomas Laursen ,  Bentley Palmer ,  Sanjay Basak ,  Krishna Murella

发明人： Julia Svirchevski ,  Saket Chadda ,  Ismail Emesh ,  Thomas Laursen ,  Bentley Palmer ,  Sanjay Basak ,  Krishna Murella

IPC分类号： C03C15/00 ,  H01L21/461

CPC分类号： B24B27/0023 ,  B24B37/042 ,  B24B37/345 ,  H01L21/3212

摘要： A method for polishing a metal layer on a workpiece is provided wherein relative motion is produced between the metal layer and a polishing surface and wherein the metal layer has a polish resistant film thereon. The metal layer is first pre-treated to substantially remove the polish resistant film. Next, the metal layer is polished at low pressure between the metal layer and the polishing surface in the presence of a polishing solution. The pretreating may be accomplished by, for example, sputtering, polishing the polish-resistant film in the presence of abrasive polishing solution, polishing the polish-resistant film at higher pressures between the film and the polishing surface, maintaining the temperature of the pretreating step to be substantially between 10 degrees Centigrade and 30 degrees Centigrade, and chemically removing the film.

摘要翻译： 提供了一种在工件上抛光金属层的方法，其中在金属层和抛光表面之间产生相对运动，并且其中金属层在其上具有防抛光膜。 首先对金属层进行预处理以基本上除去耐抛光膜。 接着，在抛光液的存在下，金属层在金属层与研磨面之间以低压被抛光。 预处理可以通过例如溅射来实现，在研磨抛光溶液的存在下抛光耐抛光膜，在膜和抛光表面之间以更高的压力抛光耐抛光膜，保持预处理步骤的温度 基本上在10摄氏度和30摄氏度之间，并化学去除膜。

公开(公告)号：US20080237048A1

公开(公告)日：2008-10-02

申请号：US11694655

申请日：2007-03-30

申请人： Ismail Emesh ,  Ivo Raaijmakers

发明人： Ismail Emesh ,  Ivo Raaijmakers

IPC分类号： C25D5/04 ,  C25D17/22

CPC分类号： C25D1/00 ,  C25D1/02 ,  C25D5/04 ,  C25D17/001 ,  C25D17/12 ,  C25D21/10 ,  H01L21/2885 ,  H01L21/76898

摘要： A device for electrodepositing a conductive material from a first solution into at least one feature formed on a wafer includes a hollow body, an electrode, and a moving mechanism. The hollow body includes a first opening and a second opening. The first solution is supplied to the second opening and injected from the first opening. The electrode is disposed within the hollow body. A potential difference is applicable between the first electrode and the surface of the wafer to electrodeposit the conductive material into the at least one feature. The moving mechanism is mechanically coupled to the hollow body. The moving mechanism is configured to position the first opening of the hollow body over the at least one feature.

摘要翻译： 用于将导电材料从第一溶液电沉积到形成在晶片上的至少一个特征的装置包括中空体，电极和移动机构。 中空体包括第一开口和第二开口。 将第一溶液供应到第二开口并从第一开口注入。 电极设置在中空体内。 在第一电极和晶片的表面之间可以应用电位差，以将导电材料电沉积到至少一个特征中。 移动机构机械地联接到中空体。 移动机构构造成将中空体的第一开口定位在至少一个特征上。

公开(公告)号：US08268135B2

公开(公告)日：2012-09-18

申请号：US11164270

申请日：2005-11-16

申请人： Ismail Emesh ,  Saket Chadda ,  Nikolay N Korovin ,  Brian L Mueller

发明人： Ismail Emesh ,  Saket Chadda ,  Nikolay N Korovin ,  Brian L Mueller

IPC分类号： C25F3/16 ,  C25F3/30

CPC分类号： B24B37/20 ,  B23H5/08 ,  B24B37/12 ,  C25F3/02 ,  C25F7/00 ,  H01L21/32125 ,  H01L21/7684

摘要： An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.

摘要翻译： 用于平坦化工件上的金属化表面的电化学平面化装置包括抛光垫和压板。 压板由导电材料形成，靠近抛光垫设置并且被配置为在平坦化处理的至少一部分期间具有负电荷。 至少一个电导体位于压板内。 电导体具有连接到电源的第一端。 工件载体构造成承载工件并将工件压靠在抛光垫上。 电源通过电导体向工件施加正电荷，使得产生工件的金属化表面和压板之间的电位差以从工件移除金属化表面的至少一部分。

公开(公告)号：US20060081460A1

公开(公告)日：2006-04-20

申请号：US11164270

申请日：2005-11-16

申请人： Ismail Emesh ,  Saket Chadda ,  Nikolay Korovin ,  Brian Mueller

发明人： Ismail Emesh ,  Saket Chadda ,  Nikolay Korovin ,  Brian Mueller

IPC分类号： C25D17/00 ,  C25B9/00

CPC分类号： B24B37/20 ,  B23H5/08 ,  B24B37/12 ,  C25F3/02 ,  C25F7/00 ,  H01L21/32125 ,  H01L21/7684

摘要： An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.

摘要翻译： 用于平坦化工件上的金属化表面的电化学平面化装置包括抛光垫和压板。 压板由导电材料形成，靠近抛光垫设置并且被配置为在平坦化处理的至少一部分期间具有负电荷。 至少一个电导体位于压板内。 电导体具有连接到电源的第一端。 工件载体构造成承载工件并将工件压靠在抛光垫上。 电源通过电导体向工件施加正电荷，使得产生工件的金属化表面和压板之间的电位差以从工件移除金属化表面的至少一部分。

公开(公告)号：US20070017818A1

公开(公告)日：2007-01-25

申请号：US11185591

申请日：2005-07-19

申请人： Ismail Emesh ,  Bulent Basol

发明人： Ismail Emesh ,  Bulent Basol

IPC分类号： B23H5/00

CPC分类号： B23H5/08 ,  C25D3/02 ,  H01L21/32125 ,  H01L21/7684

摘要： A system and method for electropolishing a conductive surface of a wafer using an electrolyte comprising an electrically resistive agent that modulates the conductivity of the electrolyte. The electrically resistive agent is a urea or a urea derivative. The electrolyte may also include a chelating agent a pH adjusting agent, and/or a surface film forming agent. The system includes a wafer carrier configured to hold the wafer, a polishing pad, and an electrode in proximity to the polishing pad. The wafer carrier may be configured to rotate or laterally move the wafer on the polishing surface of the polishing pad.

摘要翻译： 一种使用电解质电解抛光晶片的导电表面的系统和方法，所述电解质包括调节电解质的导电性的电阻剂。 电阻剂是脲或脲衍生物。 电解质还可以包括螯合剂，pH调节剂和/或表面成膜剂。 该系统包括被配置为将晶片，抛光垫和电极保持在抛光垫附近的晶片载体。 晶片载体可以被配置为在抛光垫的抛光表面上旋转或横向移动晶片。