公开(公告)号：US20050016681A1

公开(公告)日：2005-01-27

申请号：US10921666

申请日：2004-08-18

申请人： Ismail Emesh ,  Periya Gopalan ,  Phillip Rayer ,  Bentley Palmer

发明人： Ismail Emesh ,  Periya Gopalan ,  Phillip Rayer ,  Bentley Palmer

IPC分类号： B23H5/08 ,  C25D7/12 ,  C25D17/14 ,  C25F7/00 ,  H01L21/288 ,  H01L21/321 ,  C23F1/00

CPC分类号： C25D17/14 ,  B23H5/08 ,  C25D7/123 ,  C25D17/001 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/32125

摘要： An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.

摘要翻译： 提供了一种电化学装置，其将材料沉积在工件表面上或从工件表面去除材料。 该设备包括抛光垫和压板，该压板又由与抛光垫接触并与第一电位接触的第一导电层，耦合到第二电位的第二导电层以及设置在第二电位之间的第一绝缘层 第一和第二导电层。 至少一个电触点位于抛光垫内并电耦合到第二导电层。 提供一个储存器，其将电解质溶液与抛光垫和工件接触。 载体定位和/或将工件压靠在抛光垫上。