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公开(公告)号:US20110180389A1
公开(公告)日:2011-07-28
申请号:US12989882
申请日:2009-04-28
申请人: Rainer Cremer , Walter May
发明人: Rainer Cremer , Walter May
IPC分类号: C23C14/35
CPC分类号: H01J37/3408 , C23C14/14 , C23C14/352 , H01J37/3444 , H01J37/3467 , H01J37/3473
摘要: The invention relates to an apparatus and a method for pretreating and coating bodies by means of magnetron sputtering. In a vacuum chamber having a metallic chamber wall (26), magnetrons with sputter targets are arranged, at least one of which is an HPPMS magnetron to which electric pulses are fed by connecting a capacitive element (6) with the sputter target of the HPPMS magnetron via a switching element (5). To achieve effective pretreatment and coating of substrates it is provided according to a first aspect to arrange the switching element on the chamber wall. According to a second aspect, an electrode pair is provided, wherein a first electrode is an HPPMS magnetron (1) and the first and second electrodes are arranged in such a manner that a body (11) supported on a substrate table (4) is arranged between the active surfaces of the electrode pair or is moved through the space between the active surfaces of the electrode pair. In a third aspect, a method is provided, wherein, in an etch step, a negative bias voltage is applied to the body and the body is etched by means of metal ion bombardment, and subsequently the bias voltage is continuously lowered so that material sputtered-off from the sputter targets results in a layer build-up on the body.
摘要翻译: 本发明涉及一种借助于磁控溅射来预处理和涂覆物体的装置和方法。 在具有金属室壁(26)的真空室中,布置有具有溅射靶的磁控管,其中至少一个是HPPMS磁控管,通过将电容元件(6)与HPPMS的溅射靶连接起来供给电脉冲 磁控管通过开关元件(5)。 为了实现基板的有效预处理和涂覆,根据第一方面提供了将开关元件布置在室壁上。 根据第二方面,提供一种电极对,其中第一电极是HPPMS磁控管(1),并且所述第一和第二电极以使得支撑在基板台(4)上的主体(11)为 布置在电极对的有效表面之间或者通过电极对的有效表面之间的空间移动。 在第三方面,提供了一种方法,其中在蚀刻步骤中,通过金属离子轰击将负偏压施加到主体并且主体被蚀刻,随后偏置电压被连续地降低,使得材料溅射 从溅射靶上导出的一层层积聚在身上。
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公开(公告)号:US09812299B2
公开(公告)日:2017-11-07
申请号:US12989882
申请日:2009-04-28
申请人: Rainer Cremer , Walter May
发明人: Rainer Cremer , Walter May
CPC分类号: H01J37/3408 , C23C14/14 , C23C14/352 , H01J37/3444 , H01J37/3467 , H01J37/3473
摘要: The invention relates to an apparatus and a method for pretreating and coating bodies by means of magnetron sputtering. In a vacuum chamber having a metallic chamber wall (26), magnetrons with sputter targets are arranged, at least one of which is an HPPMS magnetron to which electric pulses are fed by connecting a capacitive element (6) with the sputter target of the HPPMS magnetron via a switching element (5). To achieve effective pretreatment and coating of substrates it is provided according to a first aspect to arrange the switching element on the chamber wall. According to a second aspect, an electrode pair is provided, wherein a first electrode is an HPPMS magnetron (1) and the first and second electrodes are arranged in such a manner that a body (11) supported on a substrate table (4) is arranged between the active surfaces of the electrode pair or is moved through the space between the active surfaces of the electrode pair. In a third aspect, a method is provided, wherein, in an etch step, a negative bias voltage is applied to the body and the body is etched by means of metal ion bombardment, and subsequently the bias voltage is continuously lowered so that material sputtered-off from the sputter targets results in a layer build-up on the body.
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公开(公告)号:US08173278B2
公开(公告)日:2012-05-08
申请号:US12297009
申请日:2007-04-20
申请人: Rainer Cremer
发明人: Rainer Cremer
IPC分类号: B32B9/00
CPC分类号: C23C14/08 , C23C14/0641 , C23C14/0676 , C23C14/352 , C23C28/042 , C23C28/044 , C23C28/048 , C23C28/42 , C23C30/00 , C23C30/005 , H01J37/3467
摘要: A coated body and a process for producing a layer of hard material on a substrate are described. The body comprises a substrate (30) and a layer of hard material (36) which has been applied to the substrate (30) and at least partly covers the body. The layer of hard material comprises the metallic elements Al, Cr and Si and also nonmetallic elements selected from the group consisting of B, C, N, O. The atomic proportion of oxygen among the nonmetallic elements is greater than 30%. The layer of hard material is deposited on the substrate by means of magnetron atomization.
摘要翻译: 描述了涂覆体和在基底上制造硬质材料层的方法。 主体包括已经施加到基板(30)并且至少部分地覆盖主体的基底(30)和硬质材料层(36)。 硬质材料层包括金属元素Al,Cr和Si,以及选自B,C,N,O的非金属元素。非金属元素中氧的原子比例大于30%。 通过磁控管雾化将硬质材料层沉积在衬底上。
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公开(公告)号:US20090252973A1
公开(公告)日:2009-10-08
申请号:US12297009
申请日:2007-04-20
申请人: Rainer Cremer
发明人: Rainer Cremer
CPC分类号: C23C14/08 , C23C14/0641 , C23C14/0676 , C23C14/352 , C23C28/042 , C23C28/044 , C23C28/048 , C23C28/42 , C23C30/00 , C23C30/005 , H01J37/3467
摘要: A coated body and a process for producing a layer of hard material on a substrate are described. The body comprises a substrate (30) and a layer of hard material (36) which has been applied to the substrate (30) and at least partly covers the body. The layer of hard material comprises the metallic elements Al, Cr and Si and also nonmetallic elements selected from the group consisting of B, C, N, O. The atomic proportion of oxygen among the nonmetallic elements is greater than 30%. The layer of hard material is deposited on the substrate by means of magnetron atomization.
摘要翻译: 描述了涂覆体和在基底上制造硬质材料层的方法。 主体包括已经施加到基板(30)并且至少部分地覆盖主体的基底(30)和硬质材料层(36)。 硬质材料层包括金属元素Al,Cr和Si,以及选自B,C,N,O的非金属元素。非金属元素中氧的原子比例大于30%。 通过磁控管雾化将硬质材料层沉积在衬底上。
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