公开(公告)号：US20060166608A1

公开(公告)日：2006-07-27

申请号：US11314406

申请日：2005-12-21

Applicant: Scott Chalmers ,  Randall Geels ,  Thomas Bibby

Inventor： Scott Chalmers ,  Randall Geels ,  Thomas Bibby

IPC: B24B49/00 ,  B24B7/30

CPC classification number: B24B37/013 ,  B24B49/12

Abstract: Spectral imaging systems and methods are provided for monitoring a substrate during a chemical-mechanical planarization process. An example system includes a carrier configured to receive a substrate, and a platen configured to receive a polishing pad. The platen includes an aperture configured to pass light. The system also includes a frame that disposes the platen in any number of positions relative to the carrier. An optoelectronic system is coupled to the aperture, and the aperture passes light of the optoelectronic system to illuminate the substrate and passes reflected light from the substrate to the optoelectronic system. A processing system is coupled to the optoelectronic system and uses the reflected light to image the substrate as the polishing pad is polishing the substrate.

Abstract translation: 提供了光谱成像系统和方法，用于在化学机械平面化过程期间监测基底。 示例性系统包括构造成接收基板的载体和被配置为接收抛光垫的压板。 压板包括被配置成使光通过的孔。 该系统还包括将压板放置在相对于载体的任意数量位置的框架。 光电子系统耦合到孔径，孔径传递光电子系统的光以照射衬底并将来自衬底的反射光传递到光电子系统。 处理系统耦合到光电子系统，并且当抛光垫正在抛光衬底时，使用反射光来对衬底成像。

公开(公告)号：US20050174584A1

公开(公告)日：2005-08-11

申请号：US11065182

申请日：2005-02-23

Applicant: Scott Chalmers ,  Randall Geels

Inventor： Scott Chalmers ,  Randall Geels

IPC: G01B11/06 ,  G01N21/55 ,  G01N21/84 ,  G01N21/95 ,  G03F7/20 ,  G01B11/02

CPC classification number: G03F7/70483 ,  G01B11/0625 ,  G01N21/55 ,  G01N21/8422 ,  G01N21/956

Abstract: An apparatus or method captures reflectance spectrum for each of a plurality of spatial locations on the surface of a patterned wafer. A spectrometer system having a wavelength-dispersive element receives light reflected from the locations and separates the light into its constituent wavelength components. A one-dimensional imager scans the reflected light during translation of the wafer with respect to the spectrometer to obtain a set of successive, spatially contiguous, one-spatial dimension spectral images. A processor aggregates the images to form a two-spatial dimension spectral image. One or more properties of the wafer, such as film thickness, are determined from the spectral image. The apparatus or method may provide for relatively translating the wafer at a desired angle with respect to the line being imaged by the spectrometer to enhance measurement spot density, and may provide for automatic focusing of the wafer image by displacement sensor feedback control. The spectrometer system may include an Offner optical system configured to twice pass light reflected from the wafer and received by the imager.

Abstract translation: 装置或方法捕获图案化晶片的表面上的多个空间位置中的每一个的反射光谱。 具有波长分散元件的光谱仪系统接收从位置反射的光并将光分离成其组成的波长分量。 一维成像器在晶片相对于光谱仪的平移期间扫描反射光，以获得一组连续的，空间上连续的一维空间维度的光谱图像。 处理器聚集图像以形成二维尺度的光谱图像。 从光谱图像确定晶片的一个或多个特性，例如膜厚度。 该装置或方法可以相对于由光谱仪成像的线以期望的角度相对平移晶片，以增强测量点密度，并且可以通过位移传感器反馈控制来提供晶片图像的自动聚焦。 光谱仪系统可以包括被配置为两次通过从晶片反射并由成像器接收的光的偏光光学系统。

公开(公告)号：US20050174583A1

公开(公告)日：2005-08-11

申请号：US11056350

申请日：2005-02-10

Applicant: Scott Chalmers ,  Randall Geels

Inventor： Scott Chalmers ,  Randall Geels

IPC: G01B11/06 ,  G01J3/02 ,  G01J3/28 ,  G01J3/36 ,  G01N21/21 ,  G01N21/27 ,  G01N21/47 ,  G01N21/55 ,  G01N21/84 ,  G01N21/95 ,  G01N21/956 ,  G03F7/20 ,  G01B11/28

CPC classification number: G01J3/36 ,  G01B11/0625 ,  G01B11/0641 ,  G01J3/02 ,  G01J3/0208 ,  G01J3/28 ,  G01J3/2823 ,  G01N21/211 ,  G01N21/274 ,  G01N21/4788 ,  G01N21/55 ,  G01N21/8422 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/4792 ,  G03F7/70483

Abstract: An apparatus or method captures reflectance spectrum for each of a plurality of spatial locations on the surface of a patterned wafer. A spectrometer system having a wavelength-dispersive element receives light reflected from the locations and separates the light into its constituent wavelength components. A one-dimensional imager scans the reflected light during translation of the wafer with respect to the spectrometer to obtain a set of successive, spatially contiguous, one-spatial dimension spectral images. A processor aggregates the images to form a two-spatial dimension spectral image. One or more properties of the wafer, such as film thickness, are determined from the spectral image. The apparatus or method may generate a wavelength-dependent correction factor to correct for diffraction errors introduced in reflectance spectra by the wavelength-dispersive element. The invention provides for automatic rotation of a patterned wafer to determine Goodness of Alignment during a measurement process. The invention may include a dual Offner optical system disposed between the wafer and imager.

Abstract translation: 装置或方法捕获图案化晶片的表面上的多个空间位置中的每一个的反射光谱。 具有波长分散元件的光谱仪系统接收从位置反射的光并将光分离成其组成的波长分量。 一维成像器在晶片相对于光谱仪的平移期间扫描反射光，以获得一组连续的，空间上连续的一维空间维度的光谱图像。 处理器聚集图像以形成二维尺度的光谱图像。 从光谱图像确定晶片的一个或多个特性，例如膜厚度。 该装置或方法可以产生波长依赖的校正因子来校正由波长分散元件引入的反射光谱中的衍射误差。 本发明提供了图案化晶片的自动旋转以确定测量过程中的对准质量。 本发明可以包括设置在晶片和成像器之间的双偏光学系统。

公开(公告)号：US20060164657A1

公开(公告)日：2006-07-27

申请号：US11327222

申请日：2006-01-07

Applicant: Scott Chalmers ,  Randall Geels

Inventor： Scott Chalmers ,  Randall Geels

IPC: G01B11/28

CPC classification number: G01B11/0625 ,  G01B11/0641 ,  G01N2021/213

Abstract: Devices and methods for determining wafer orientation in spectral imaging are described. The devices and methods generate an image of a wafer that includes at least one spectral dimension. One or more properties are determined from the spectral dimension, and a map is generated based on the property. The generated map is compared to at least one other map, and data or information of the comparison is used to locate a region of the wafer, for example a measurement pad or other structure.

Abstract translation: 描述了用于确定光谱成像中的晶片取向的装置和方法。 装置和方法产生包括至少一个光谱维度的晶片的图像。 从谱维度确定一个或多个属性，并且基于属性生成地图。 生成的地图与至少一个其他地图进行比较，并且使用比较的数据或信息来定位晶片的区域，例如测量垫或其它结构。