摘要:
A high voltage ESD-protection structure is used to protect delicate transistor circuits connected to an input or output of an integrated circuit bond pad from destructive high voltage ESD events by conducting at a controlled breakdown voltage that is less than a voltage that may cause destructive breakdown of the input and/or output circuits. The ESD-protection structure is able to absorb high current from these ESD events without snapback that would compromise operation of the higher voltage inputs and/or outputs of the integrated circuit. The ESD-protection structure will conduct when an ESD event occurs at a voltage above a controlled breakdown voltage of an electronic device, e.g., diode, in the ESD protection structure. Conduction of current from an ESD event having a voltage above the electronic device controlled breakdown voltage may be through another electronic device, e.g., transistor, having high current conduction capabilities, in the ESD-protection structure that may be controlled (triggered) by the device (e.g., diode) determining the controlled breakdown voltage (at which the ESD voltage is clamped to a desired value). The high voltage ESD-protection structure may be located substantially under the bond pad and may also include a low capacitance forward diode structure between the bond pad and the ESD clamp circuit.
摘要:
An ESD-protection structure is located substantially under an integrated circuit bond pad. This ESD-protection structure is formed as a low capacitance structure by inserting a forward diode between the bond pad and the ESD clamp circuit. Placing the ESD-protection structure under the bond pad eliminates parasitic substrate capacitance and utilizes a parasitic PNP transistor formed from the inserted forward biased diode. The ESD-protection structure includes adjacent alternating P+ and N+ diffusions located substantially under a bond pad to be ESD protected. The P+ diffusions are connected to the bond pad metal with metal vias through an insulating layer. The N+ diffusions are adjacent to the P+ diffusions. An N+ diffusion surrounds the N+ and P+ diffusions, and ties together the N+ diffusions so as to form a continuous N+ diffusion completely around each of the P+ diffusions. An N− well is located substantially under the N+ and P+ diffusions. The surrounding N+ diffusion partially overlaps the edge of the N− well below it. An outer portion of the N+ diffusion, the portion overlapping the N− well, is within a P− well. Another N+ diffusion encircles the N+ diffusion surrounding the P+ diffusions. The another N+ diffusion is in the P− well and a field oxide may be located between the N+ diffusion and the another N+ diffusion. An NPN field transistor is formed with the N+ diffusion being the transistor collector, the P− well being the transistor base and the another N+ diffusion being the emitter.
摘要翻译:ESD保护结构基本上位于集成电路接合焊盘下方。 该ESD保护结构通过在接合焊盘和ESD钳位电路之间插入正向二极管而形成为低电容结构。 将ESD保护结构放在接合焊盘下方可消除寄生衬底电容,并利用由插入的正向偏置二极管形成的寄生PNP晶体管。 ESD保护结构包括基本上位于接合焊盘下方以进行ESD保护的相邻的交替P +和N +扩散。 P +扩散通过绝缘层与金属通孔连接到接合焊盘金属。 N +扩散与P +扩散相邻。 N +扩散围绕N +和P +扩散,并将N +扩散结合在一起,以便在每个P +扩散周围完全形成连续的N +扩散。 N阱基本上位于N +和P +扩散之下。 周围的N +扩散与其下面的N阱的边缘部分重叠。 N +扩散的外部部分,与N阱重叠的部分在P-阱内。 另外N +扩散围绕围绕P +扩散的N +扩散。 另一个N +扩散在P-阱中,场氧化物可以位于N +扩散和另一个N +扩散之间。 形成NPN场晶体管,其中N +扩散为晶体管集电极,P阱为晶体管基极,另一N +扩散为发射极。
摘要:
An improved high quality factor capacitive device is implemented on a single, monolithic integrated circuit. The new layout techniques improve the quality factor (Q) of the capacitor by reducing intrinsic resistance of the capacitor by reducing the distance between the metal contacts of the top and bottom conductive plates. The layout techniques require laying out the top conductive plate of the capacitor in strips such that metal contacts from the bottom conductive plate pass in between the strips and through the dielectric layer. Alternatively, the apertures may be etched into the top conductive plate so that metal contacts pass through the apertures and connect to the bottom conductive plate.
摘要:
A self timed precharge sense amplifier for allowing high speed reading of a memory cell of a memory array. The self timed precharge sense amplifier uses a precharge device for generating an output voltage which is used to ramp up a voltage level of a column of the memory array where the memory cell is located. State control circuitry is coupled to the precharge device for activating and deactivating the precharge device. A sense amplifier is coupled to the precharge device and to the state control circuitry for monitoring the output voltage of the precharge device and for signalling the state control circuitry to deactivate the precharge device when the output voltage has reached a threshold voltage level set by the sense amplifier which is a minimum amount of voltage required to properly read the memory cell.
摘要:
A voltage regulator which will clamp the row voltage of a memory cell or array. The voltage regulator will clamp to a value which is greater than the erased threshold voltage of the memory cell and less than the worst case programmed threshold voltage of the memory cell. The voltage regulator uses an unprogrammed memory cell of the memory array for allowing the row voltage outputted by the voltage regulator to be self-tracking over manufacturing process variations and ambient environmental influences. A switching circuit is coupled to the unprogrammed memory cell for clamping the row voltage outputted by said voltage regulator below the programmed threshold voltage level.
摘要:
A microcontroller device is fabricated in a semiconductor integrated circuit chip to control an external system with which the device is to be installed in circuit. The device has a CPU, a program memory for storing program instructions to be implemented by the CPU, a data memory for storing data including data pertaining to parameters of the external system to be controlled by operation of the CPU according to the instructions, and various peripherals. A brown-out protection circuit monitors the level of the supply voltage for the IC chip relative to a ground reference level, to reset the device as protection against its malfunction in response to reduction of an arithmetic difference between the supply voltage level and the ground reference level to a value less than a predetermined threshold operating voltage level. Reset defines a cessation of operation of the device while maintaining status quo of implementation of program instructions by the CPU and data stored in the data memory. A discriminator distinguishes between a reduction representative of a brown-out event warranting invoking a reset of the device and a reduction representative of mere transitory voltage swings commonly occurring in the device operation not warranting invoking a reset of the device. This serves to avoid both malfunctions and unnecessary resetting of the device in control of the external system.
摘要:
A matching capacitor array is implemented on a single, monolithic integrated circuit. The array features a matrix of bottom electrodes and a plurality of continuous top electrode strips, where each continuous top electrode strip spans numerous bottom electrodes. The conductive contacts for each continuous top electrode strip are removed from the capacitor interface to the terminal ends of each of the continuous top electrode strips. The invention seeks to match or control parasitic and fringe capacitance, rather than to eliminate or minimize such capacitances. By creating a matched array, the parasitic and fringe capacitances of each matching capacitor unit cell are incorporated into the total capacitance of the unit cell.
摘要:
An array of P-channel memory cells is separated into independently programmable memory segments by creating multiple, electrically isolated N-wells upon which the memory segments are fabricated. The methods for creating the multiple, electrically isolated N-wells include p-n junction isolation and dielectric isolation.
摘要:
A system for allowing a two word jump instruction to be executed in the same number of cycles as a single word jump instruction, thereby allowing a processor system to increase memory space without reducing performance. A first address bus is coupled to the linearized program memory for sending addresses of instructions to be fetched to a linearized program memory. A pointer is coupled to the first address bus for storing an address location of a current instruction in the linearized program memory to be fetched and for placing the address location of the current instruction to be fetched on the first address bus. A second address bus is provided and has one end coupled to the output of the program memory and a second end coupled to the first address bus. The second address bus is used for placing an address of an operand of a second word of the two word jump instruction onto the first address bus after an address of an operand of a first word of the two word jump instruction has been placed on the first address bus. This allows the addresses of the first word and the second word to be combined to provide the full address value of the two word jump instruction in the same number of cycles as a single word jump instruction.
摘要:
A microcontroller architecture that adds a dedicated bit in the op-code decode field to force data access to take place on a page of the random access memory (RAM) for that instruction. This allows the user to have any page selected and still have direct access to the special function registers or the register variables that are located on a pre-defined page of the RAM. The setting of the dedicated bit will not affect the current operation of the microcontroller nor will the setting of the bit modify the currently selected address stored in a page select register currently being used by the microcontroller.